Manufacturing method for blind hole of insulating substrate for electronic apparatus
A technology for insulating substrates and manufacturing methods, which is applied in the direction of insulators, chemical instruments and methods, and photoplate-making processes for patterned surfaces, and can solve problems such as side etching, poor adhesion between resist films and glass substrates, etc.
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[0031] Next, the present invention will be described in detail with embodiments and accompanying drawings. In the drawings or descriptions, the same symbols or numbers are used for similar or identical parts. In the drawings, the shapes or thicknesses of the embodiments may be exaggerated for simplification or convenient labeling, and parts of the elements in the drawings will be described in words. It can be understood that elements not shown or described can be in various forms known to those of ordinary skill in the art. This embodiment is illustrated in schematic cross-section of an idealized embodiment (and intermediate structures) of the invention, and reasonable variations in fabrication methods, shapes and / or tolerances will be contemplated by those skilled in the art. Therefore, the embodiments of the present invention should not be construed as limiting the scope of the present invention claimed.
[0032] Figure 1A ~ 1C It is a sectional view of various stages of f...
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