229results about "Circuit electrical arrangements" patented technology

A riser card includes a circuit board and first, second, and third connectors. The first and second connectors are positioned at bottom and top edges of the circuit board, respectively. The third connector is mounted to a face of the circuit board. Such riser card may be mounted on a primary system board such that the first connector is detachably connected to a first complementary connector of the primary system board with the circuit board perpendicular to the primary system board, and the first connector receives power, data, and sideband signals from the first complementary connector. The second and third connectors may mate with second and third complementary connectors of an expansion card oriented parallel to the circuit board and a stackable secondary riser card oriented perpendicular to the circuit board, respectively. The riser card communicates power and sideband signals to the stackable secondary riser card via the third connector.

The embodiment of the invention provides a printed circuit board, a processing method, a test system and electronic equipment. The printed circuit board comprises a plurality of metal layers, a first metal transmission hole, a signal transmission line and a first signal interface. Wherein the plurality of metal layers form a board body structure of the printed circuit board. The first metal transmission hole is arranged in the board body structure, and the first end of the first metal transmission hole extends from the interior of the board body structure to the upper board surface side of the board body structure so as to be coupled with the first signal interface. The signal transmission line is arranged on a first metal layer in the plurality of metal layers, and a first end of the signal transmission line is coupled with a first contact point on the first metal transmission hole in the plate body structure. And a transmission path distance with a first length exists between the first contact point of the first metal transmission hole and the second end of the first metal transmission hole, so that the transmission impedance of the first via hole connecting part is improved. According to the embodiment, the process complexity and the design difficulty are reduced, and the impedance matching degree of the printed circuit board and an external device or structure is improved.

An antenna assembly includes a stack and an antenna structure. The stack includes at least one electrically conductive layer structure and at least one electrically insulating layer structure, and a component, at least partially embedded in the stack. At least a portion of the electrically conductive layer structure is provided at the external side of the stack and is configured to act at least as part of an electromagnetic wave coupling structure. The component is coupled to the electromagnetic wave coupling structure. The antenna structure provides an opening to a channel. The stack and the antenna structure are connected so that the electromagnetic wave coupling structure and the opening to the channel face each other.

Electrical connectors, electrical modules, and systems are provided. In one aspect, an electrical connector includes a housing defining a side surface, an electrical conductor supported by the housing and including an engagement portion proximate the side surface of the housing. The engagement portion is adapted to engage another electrical conductor of another electrical connector. The connector also includes a magnet supported by the housing proximate the side surface of the housing, a projection extending from the side surface of the housing, and a receptacle defined in the side surface of the housing. In other aspects, an electrical module includes at least one of these electrical connectors. In further aspects, a system includes a plurality of these modules and the modules are selectively couplable together.

According to the impedance test method for the multi-layer and multi-order printed circuit board and the circuit board provided by the embodiment of the invention, the through hole is formed in the inner layer circuit board, the impedance of the inner layer circuit board is tested through the through hole, and the impedance of the inner layer circuit board is tested, so that the circuit board can work normally, and the performance and reliability of electronic equipment are improved. After a layer of outer layer circuit board is added on the outer layer circuit board, a blind hole is manufactured on the outer layer circuit board based on a through hole PAD, a test PAD is made by using the blind hole, and impedance test is performed on the added outer layer circuit board, so that the impedance of the current layer can be measured in time during layer addition, and the impedance can be measured without waiting for a finished product. The actual impedance of each layer can be measured, the rejection rate of the impedance of a final finished product is reduced, the production efficiency is improved, and the cost is reduced.

Example approaches are directed to an apparatus for reducing smoke created by a surgical instrument in a procedure, e.g., as part of a surgical system. The apparatus may include an insulating vessel and a flexible printed circuit disposed within the vessel, with the vessel including an inlet and an outlet. The flexible printed circuit includes a substrate layer and a conductive layer disposed on the substrate. The conductive layer includes two charge conducting portions or electrodes having opposite electrical charges, which are spaced apart by an electrically insulated portion. The charge conducting portions are positioned between the inlet and outlet of the vessel such that particles entering the inlet are electrically charged and drawn to one of the charge conducting portions.

The signal transmission device includes first, second and third chips. The first and second chips includes respectively: a first input pad; an ADC that converts a first analog signal inputted to the first input pad into a first digital signal; a first transmission circuit that generates a first pulse signal in correspondence to the first digital signal; a first output pad that outputs the first pulse signal; a second input pad; a first reception circuit that generates a second digital signal in correspondence to a second pulse signal inputted to the second input pad; a DAC that converts the second digital signal into a second analog signal; and a second output pad that outputs the second analog signal. The third chip, upon receiving the first pulse signal from the first output pad of the first chip, outputs the second pulse signal to the second input pad of the second chip.

The invention discloses a BGA fan-out structure of a PCB and a manufacturing method of the BGA fan-out structure, at least one surface of the PCB is provided with a plurality of BGA bonding pads which are distributed in a square array mode, no wiring is conducted between the BGA bonding pads, the circle of BGA bonding pads arranged on the outermost periphery are peripheral bonding pads, the other BGA bonding pads are inner bonding pads, the center of each inner bonding pad is provided with an in-disc hole with an internal partition, and the in-disc hole is formed in the center of each inner bonding pad. The hole diameter of the in-plate hole is smaller than the outer diameter of the BGA bonding pad, and each inner circuit layer of the PCB is provided with a row of hole rings which are arranged around the in-plate hole in a one-to-one correspondence manner and are communicated with the in-plate hole, and a plurality of fan-out wires which are communicated with the hole rings in a one-to-one correspondence manner. The fan-out wires transversely penetrate through the middle of a gap between every two adjacent in-plate holes which are longitudinally arranged or transversely penetrate through the outer sides of the in-plate holes, and the hole rings in the different inner circuit layers are in one-to-one correspondence with the inner bonding pads in the different columns respectively. According to the invention, the design of fan-out of the BGA bonding pad from the inner layer is realized through the via in the pad and the inner layer wiring, and the problem of difficult fan-out wiring of the high-density bonding pad is solved.

The present invention provides a storage device with one-button destruction function, which comprises a case, a circuit board, a control unit, a storage unit, a button, and a power supply. The destruction function comprises steps of: generating a pressing signal when the button is pressed; the control unit obtains a pressing time according to the pressing signal; the control unit generating an erasing signal according to a time threshold value, a second time threshold value, and the pressing time; and the control unit executing a destruction process on the storage unit according to the erasing signal.

Clips serving as vertical interconnect are disclosed herein. In certain embodiments, an electronic assembly such as an electronic module includes a first circuit board and an electronic component attached to the first circuit board. The electronic component includes a dielectric body and at least one clip secured to the dielectric body. The clip is electrically connected to the first circuit board to operate as vertical interconnect.

The invention provides a rigid-flexible combined board, a satellite, a satellite system and a satellite manufacturing method, the rigid-flexible combined board is suitable for connecting each subsystem in the satellite to realize information interaction among the subsystems, and the rigid-flexible combined board comprises a rigid board comprising a signal transmission line; and a plurality of flexible plates, one end of each flexible plate is electrically connected with the rigid plate, and the other end of each flexible plate is electrically connected with the corresponding subsystem. The rigid-flexible combined board is electrically connected with each subsystem of the satellite through each flexible board electrically connected with one rigid board, so that data interaction among the subsystems in the satellite is realized, complicated and disordered data cables in the prior art can be integrated, and more concise and effective spatial layout in the satellite is realized.

A coated article includes: a substrate; a first dielectric layer over at least a portion of the substrate; a first metallic layer over at least a portion of the first dielectric layer; a first primer layer over at least a portion of the first metallic layer; and a second dielectric layer over at least a portion of the first primer layer; where the first primer layer is selected from the group consisting of zinc, aluminum-doped silver, aluminum zinc, vanadium zinc, tungsten tantalum, titanium niobium, zirconium niobium, tungsten niobium, aluminum niobium, aluminum titanium, tungsten titanium, tantalum titanium, zinc titanium, zinc tin, indium zinc, silver zinc, gallium zinc, indium tin, mixtures thereof, combinations thereof, and alloys thereof.

An integrated field output terminal assembly for traffic controller cabinets includes a circuit board carrying high-density flash-transfer relays and output terminals on a front side, and a short-circuit protection subassembly on a rear side. The protection subassembly has rows of plug-in fuse holders electrically connected through the board to incoming power channels from high-density switch packs, with surge suppressors located between fuse sections. An insulating panel, spaced by standoffs, shields the rear circuitry while providing labeled openings for rapid fuse access. A swing-down mounting bracket lets the board pivot within the cabinet for tool-less inspection and replacement of fuses. By placing circuit protection on the same footprint as the output board, the assembly eliminates separate fuse panels and bulky harnesses, cutting cabinet volume, material cost, and service time while safeguarding switch packs against shorts, lightning, and wiring faults.

The present disclosure relates to a power module designed to have balanced current flow for each parallel power switch such that each power switch has a similar current path length. The power module can include a first plurality of power switches electrically coupled to a first region and a second plurality of power switches electrically coupled to a second region. A first plurality of conductive clips is configured to conduct a first plurality of currents and a second plurality of conductive clips is configured to conduct a second plurality of currents. The power module can include a first leadframe configured to apply a positive voltage to the first region, a second leadframe configured to conduct current from the second region, and a third leadframe configured to conduct current from the third region.

The application discloses a circuit board conductive accessory, a circuit board assembly and an electronic device. The circuit board assembly comprises a circuit board, at least two conductive mounting seats and at least one conductive piece. The conductive mounting seats are connected to the circuit board, and each conductive mounting seat is formed with a first conductive plug-in structure. The conductive piece comprises a conductive main body part and at least two second conductive plug-in structures connected to the conductive main body part, and each first conductive plug-in structure is plugged with at least one second conductive plug-in structure. The circuit board conductive accessory, the circuit board assembly and the electronic device provided by the application can reduce manufacturing cost.

The invention provides a circuit board, a preparation method of the circuit board and electronic equipment. The circuit board comprises a substrate; the solder mask layer is arranged on the end face of at least one side of the substrate, and a groove is formed in the end face of the side, away from the substrate, of the solder mask layer; and the reinforcing layer is connected with the side, where the groove is formed, of the solder mask layer, and an adhesive layer is arranged on the reinforcing layer and located in the groove. Through the mode, the adhesive layer can be placed in the groove, so that the adhesive layer is prevented from overflowing from the solder mask layer through the groove, and the edge area, forming the groove, of the solder mask layer is connected with the reinforcing layer, so that the edge area of the reinforcing layer can support the reinforcing layer, and the flatness of the surface of the reinforcing layer is effectively ensured.

The invention discloses a flexible circuit board and a maintenance method thereof, an integrated busbar, a battery pack and a vehicle, the flexible circuit board comprises a conductive layer, a first covering film and a second covering film, the conductive layer comprises a line, a first fuse and a second fuse, the first fuse is electrically connected with the line, and the second fuse is electrically connected with the first covering film. A gap is formed between the second fuse and the circuit; the first covering film and the second covering film are arranged on the two sides of the conducting layer in the thickness direction respectively and connected with the conducting layer, and the first covering film is provided with a first window, a second window, a third window and a fourth window; wherein the first window and the second window are respectively arranged corresponding to bonding pads at two ends of the first fuse, and the third window and the fourth window are respectively arranged corresponding to bonding pads at two ends of the second fuse. According to the flexible circuit board, the fuse can be maintained, so that the flexible circuit board is prevented from being scrapped due to fusing of the fuse.

A display apparatus includes: a substrate including a display region and a non-display region outside the display region; a first line disposed on an upper surface of the substrate in the non-display region of the substrate, where the first line has a first height; a flexible printed circuit board; a second line disposed on a lower surface of the flexible printed circuit board, where the second line has a second height; and a connection line located in a portion in which the substrate and the flexible printed circuit board overlap each other and disposed between the substrate and the flexible printed circuit board, where in the connection lines has a third height greater than each of the first height and the second height, one end of the connection line is connected to the first line, and another end of the connection line is connected to the second line.

To provide a laminated coupling coil component capable of obtaining the desired coupling coefficient while reducing the height of the component.SOLUTION: A laminated coupling coil component 1 has conductor layers L1, L3, L5 including spiral coils 11-13, conductor layers L2, L4, L6 including spiral coils 21-23, and a conductor layer L7 including spiral coils 31, 41 provided at different planar positions from each other. The spiral coils 11-13 and 21-23 overlap each other when viewed from the laminated direction. Spiral coils 11-13 and 31 are connected in series between terminal electrodes E1 and E2, and spiral coils 21-23 and 41 are connected in series between terminal electrodes E4 and E3. This allows the coupling coefficient to be adjusted, making it possible to obtain the desired coupling coefficient while reducing the height of the components.SELECTED DRAWING: Figure 2

The invention relates to a component carrier (100) comprising a stack having a stack direction, a method for manufacturing a component carrier and a package having a component carrier (100), wherein the stack (30) comprises: at least one electrically conductive layer structure; at least one electrically insulating layer structure; a first main surface (MS1) and a second main surface (MS2), wherein the first main surface (MS1) and the second main surface (MS2) are disposed one above the other in a stacking direction and are opposite to each other; and a first side wall (W1) and a second side wall (W2), the first side wall (W1) and the second side wall (W2) being located between the first main surface (MS1) and the second main surface (MS2) and connecting the opposite main surfaces (MS1, MS2). The extension (L1) of the first main surface (MS1) differs from the extension (L2) of the second main surface (MS2) in at least a first extension direction (ED) at least in the planarized state of the stack (30).

An electronic element includes a substrate, a first input pad on a first surface of the substrate, at least one chip on the first surface of the substrate, and a first output pad on the first surface of the substrate. The first input pad, the at least one chip, and the first output pad are sequentially connected. The first input pad and the first output pad are in direct physical contact with the first surface of the substrate. A surface of the first input pad facing away from the substrate and a surface of the first output pad facing away from the substrate constitute a partial area of an outer surface of the electronic element.

To provide a technique capable of reducing a current path length without losing connection reliability in a contact.SOLUTION: An elastic deformation part 82 includes: an upper contact part 85 that can come into contact with a signal pad 10 corresponded to any one of a plurality of signal pads 10; and a lower contact part 87 that is provided at an input and output board 4, and can come into contact with a short circuit pad 16 of which a potential is similar to a main pad 15A. In a contact 33, the lower contact part 87 is separated from the short circuit pad 16 when the upper contact part 85 is separated from the signal pad 10, and the lower contact part 87 comes into contact with the short circuit pad 16 when the elastic deformation part 82 is elastically deformed due to the upper contact part 85 coming into contact with the signal pad 10. Then, a current path length from the upper contact part 85 to the lower contact part 87 is shorter than that from the upper contact part 85 to a soldering part 81.SELECTED DRAWING: Figure 13

The present invention relates to a current sensor system comprising a conductor and a packaged integrated circuit for sensing a current in the conductor, said conductor being external to the packaged integrated circuit. The packaged integrated circuit comprises : - a substrate (2) having an active surface (3) and a back surface (4), - one or more magnetic sensing elements (7) disposed in or on the active surface of the substrate, - a processing circuit disposed in or on the active surface of the substrate and arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor, - a housing (1), - a plurality of leads (8) having an outer lead portion extending outside the housing and an inner lead portion, - electrical connections (6) between the leads and the active surface of the substrate, wherein the back surface of the substrate is disposed on a support (5) formed by at least two inner lead portions of said plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.

The invention relates to the technical field of heat dissipation, in particular to a fan and an electronic device. Comprising a fan frame, a wire, a terminal board and a limiting assembly. The fan frame comprises an installation area provided with a first limiting piece, a first installation plate and a second installation plate, and the first installation plate and the second installation plate are oppositely arranged in the second direction and located on the two sides of the first limiting piece in the first direction respectively. The first limiting piece is provided with a first limiting hole penetrating in the first direction, and the first mounting plate and the second mounting plate are each provided with a mounting groove penetrating in the second direction; the terminal plate is movably inserted into the mounting groove and is provided with a second limiting hole and a flat cable hole, the first limiting hole and the second limiting hole coincide along the axis of the first direction, and the flat cable hole is connected with a wire; the limiting assembly is connected with the first and second limiting holes, and the inner diameter of the second limiting hole is larger than the diameter of part of the limiting assembly, so that the terminal plate is in floating connection with the mounting groove. According to the fan, the influence of vibration on the connection stability of the connector and the terminal board is reduced, and meanwhile the heat dissipation space of the electronic device is increased.

To provide a printed wiring board having high quality.SOLUTION: A method for manufacturing a printed wiring board includes: forming a resin insulation layer; forming a protective film on a first surface of the resin insulation layer; forming an opening for a via conductor; removing the protective film; cleaning the first surface; forming a second conductor layer; and forming a via conductor. The resin insulation layer contains a resin and inorganic particles, and the inorganic particles contain first inorganic particles partially embedded in the resin and second inorganic particles completely embedded in the resin. The cleaning includes forming the first inorganic particles from the second inorganic particles. The formation of the second conductor layer includes: forming a seed layer on the first surface of the resin insulation layer; forming a plating resist on the seed layer using DI exposure; forming an electrolytic plating layer; removing a plating resist; and removing a seed layer exposed from the electrolytic plating layer.SELECTED DRAWING: Figure 1

One or more embodiments of the present disclosure provides a manufacturing method for a flexible printed circuit board assembly (40) including a first substrate (410) including a first main line (4110), a first branch line (4130) extending from the first main line, and a first connector (4150) at a first side of the first main line, and having a perforation (4151), and a second substrate (430) separated from the first substrate (410), and including a second main line (4310), a second branch line (4330) extending from the second main line, and a second connector (4350) at a first side of the second main line, and having a perforation (4351), wherein the first substrate (410) and the second substrate (430) are electrically connected through the first connector (4150) and the second connector (4350).

Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes at least a frame plate, circuit boards, support bodies, and solder joints. The frame plate includes a frame body and first pads provided on the frame body. The circuit boards each are provided on one side of the frame plate. The circuit board includes a board body and second pads provided on the board body. The first pads face the second pads. The support bodies are provided between the frame plate and the circuit boards. The support bodies are configured to support the circuit boards, so that a predetermined spacing exists between the first pads and the second pads. The support bodies each include a first support portion and a second support portion. The first support portion and the second support portion are stacked along a thickness direction of the frame plate. The first support portion is connected to the frame body. The second support portion is connected to the board body. Solder joints are provided between the first pads and the second pads. The solder joints connect the first pads to the second pads.

Disclosed is a PCB of a planar transformer including: a PCB substrate with a through hole and a double-sided winding part formed on double sides of the PCB substrate, wherein the double-sided winding part is of a symmetric structure, a via hole consistent with the through hole is formed in the center of the double-sided winding part, the via hole is aligned to the through hole to form a magnetic core hole, and the circumference of the via hole is raised to form wire blocking parts; and forming a wire passing groove in the wall of the magnetic core hole, wherein the wire passing groove allows a metal conducting wire to pass through to be planarly wound from inside to outside on double sides of the double-sided winding part at the same time so as to form two coils in series located on the double sides of the PCB substrate.

To provide a flexible circuit board capable of transmitting both an analog signal and a digital signal and easily being incorporated in a housing of an electronic apparatus such as a smart phone in a bent state, its manufacturing method and an electronic apparatus.SOLUTION: A flexible circuit board electrically connects a first module having a radio communication antenna and a digital terminal, and a second module for performing signal processing of an analog signal and a digital signal, and has a signal line region, a connector region and a bent region. The signal line region includes an analog signal line, a digital signal line, and a ground layer formed so as to cover the analog signal line through an insulation layer. The bent region has a layer reduction structure in which the number of wiring layers and / or insulation layers is smaller than that of them of the signal line region.SELECTED DRAWING: Figure 3

A press-fit fastener for securing components together is provided. In one aspect, an electronic system assembly includes a first component with a first hole, a second component with a second hole, and a press-fit fastener configured to be inserted into the first hole and the second hole in a single motion. The press-fit fastener is configured to at least contribute to securing the second component to the first component after insertion into the first and second holes. Related press-fit fasteners and methods of manufacture are disclosed.