154results about "Circuit electrical arrangements" patented technology

A riser card includes a circuit board and first, second, and third connectors. The first and second connectors are positioned at bottom and top edges of the circuit board, respectively. The third connector is mounted to a face of the circuit board. Such riser card may be mounted on a primary system board such that the first connector is detachably connected to a first complementary connector of the primary system board with the circuit board perpendicular to the primary system board, and the first connector receives power, data, and sideband signals from the first complementary connector. The second and third connectors may mate with second and third complementary connectors of an expansion card oriented parallel to the circuit board and a stackable secondary riser card oriented perpendicular to the circuit board, respectively. The riser card communicates power and sideband signals to the stackable secondary riser card via the third connector.

An antenna assembly includes a stack and an antenna structure. The stack includes at least one electrically conductive layer structure and at least one electrically insulating layer structure, and a component, at least partially embedded in the stack. At least a portion of the electrically conductive layer structure is provided at the external side of the stack and is configured to act at least as part of an electromagnetic wave coupling structure. The component is coupled to the electromagnetic wave coupling structure. The antenna structure provides an opening to a channel. The stack and the antenna structure are connected so that the electromagnetic wave coupling structure and the opening to the channel face each other.

The signal transmission device includes first, second and third chips. The first and second chips includes respectively: a first input pad; an ADC that converts a first analog signal inputted to the first input pad into a first digital signal; a first transmission circuit that generates a first pulse signal in correspondence to the first digital signal; a first output pad that outputs the first pulse signal; a second input pad; a first reception circuit that generates a second digital signal in correspondence to a second pulse signal inputted to the second input pad; a DAC that converts the second digital signal into a second analog signal; and a second output pad that outputs the second analog signal. The third chip, upon receiving the first pulse signal from the first output pad of the first chip, outputs the second pulse signal to the second input pad of the second chip.

The invention discloses a BGA fan-out structure of a PCB and a manufacturing method of the BGA fan-out structure, at least one surface of the PCB is provided with a plurality of BGA bonding pads which are distributed in a square array mode, no wiring is conducted between the BGA bonding pads, the circle of BGA bonding pads arranged on the outermost periphery are peripheral bonding pads, the other BGA bonding pads are inner bonding pads, the center of each inner bonding pad is provided with an in-disc hole with an internal partition, and the in-disc hole is formed in the center of each inner bonding pad. The hole diameter of the in-plate hole is smaller than the outer diameter of the BGA bonding pad, and each inner circuit layer of the PCB is provided with a row of hole rings which are arranged around the in-plate hole in a one-to-one correspondence manner and are communicated with the in-plate hole, and a plurality of fan-out wires which are communicated with the hole rings in a one-to-one correspondence manner. The fan-out wires transversely penetrate through the middle of a gap between every two adjacent in-plate holes which are longitudinally arranged or transversely penetrate through the outer sides of the in-plate holes, and the hole rings in the different inner circuit layers are in one-to-one correspondence with the inner bonding pads in the different columns respectively. According to the invention, the design of fan-out of the BGA bonding pad from the inner layer is realized through the via in the pad and the inner layer wiring, and the problem of difficult fan-out wiring of the high-density bonding pad is solved.

The present invention provides a storage device with one-button destruction function, which comprises a case, a circuit board, a control unit, a storage unit, a button, and a power supply. The destruction function comprises steps of: generating a pressing signal when the button is pressed; the control unit obtains a pressing time according to the pressing signal; the control unit generating an erasing signal according to a time threshold value, a second time threshold value, and the pressing time; and the control unit executing a destruction process on the storage unit according to the erasing signal.

An integrated field output terminal assembly for traffic controller cabinets includes a circuit board carrying high-density flash-transfer relays and output terminals on a front side, and a short-circuit protection subassembly on a rear side. The protection subassembly has rows of plug-in fuse holders electrically connected through the board to incoming power channels from high-density switch packs, with surge suppressors located between fuse sections. An insulating panel, spaced by standoffs, shields the rear circuitry while providing labeled openings for rapid fuse access. A swing-down mounting bracket lets the board pivot within the cabinet for tool-less inspection and replacement of fuses. By placing circuit protection on the same footprint as the output board, the assembly eliminates separate fuse panels and bulky harnesses, cutting cabinet volume, material cost, and service time while safeguarding switch packs against shorts, lightning, and wiring faults.

The present disclosure relates to a power module designed to have balanced current flow for each parallel power switch such that each power switch has a similar current path length. The power module can include a first plurality of power switches electrically coupled to a first region and a second plurality of power switches electrically coupled to a second region. A first plurality of conductive clips is configured to conduct a first plurality of currents and a second plurality of conductive clips is configured to conduct a second plurality of currents. The power module can include a first leadframe configured to apply a positive voltage to the first region, a second leadframe configured to conduct current from the second region, and a third leadframe configured to conduct current from the third region.

The application discloses a circuit board conductive accessory, a circuit board assembly and an electronic device. The circuit board assembly comprises a circuit board, at least two conductive mounting seats and at least one conductive piece. The conductive mounting seats are connected to the circuit board, and each conductive mounting seat is formed with a first conductive plug-in structure. The conductive piece comprises a conductive main body part and at least two second conductive plug-in structures connected to the conductive main body part, and each first conductive plug-in structure is plugged with at least one second conductive plug-in structure. The circuit board conductive accessory, the circuit board assembly and the electronic device provided by the application can reduce manufacturing cost.

The invention discloses a flexible circuit board and a maintenance method thereof, an integrated busbar, a battery pack and a vehicle, the flexible circuit board comprises a conductive layer, a first covering film and a second covering film, the conductive layer comprises a line, a first fuse and a second fuse, the first fuse is electrically connected with the line, and the second fuse is electrically connected with the first covering film. A gap is formed between the second fuse and the circuit; the first covering film and the second covering film are arranged on the two sides of the conducting layer in the thickness direction respectively and connected with the conducting layer, and the first covering film is provided with a first window, a second window, a third window and a fourth window; wherein the first window and the second window are respectively arranged corresponding to bonding pads at two ends of the first fuse, and the third window and the fourth window are respectively arranged corresponding to bonding pads at two ends of the second fuse. According to the flexible circuit board, the fuse can be maintained, so that the flexible circuit board is prevented from being scrapped due to fusing of the fuse.

A display apparatus includes: a substrate including a display region and a non-display region outside the display region; a first line disposed on an upper surface of the substrate in the non-display region of the substrate, where the first line has a first height; a flexible printed circuit board; a second line disposed on a lower surface of the flexible printed circuit board, where the second line has a second height; and a connection line located in a portion in which the substrate and the flexible printed circuit board overlap each other and disposed between the substrate and the flexible printed circuit board, where in the connection lines has a third height greater than each of the first height and the second height, one end of the connection line is connected to the first line, and another end of the connection line is connected to the second line.

To provide a laminated coupling coil component capable of obtaining the desired coupling coefficient while reducing the height of the component.SOLUTION: A laminated coupling coil component 1 has conductor layers L1, L3, L5 including spiral coils 11-13, conductor layers L2, L4, L6 including spiral coils 21-23, and a conductor layer L7 including spiral coils 31, 41 provided at different planar positions from each other. The spiral coils 11-13 and 21-23 overlap each other when viewed from the laminated direction. Spiral coils 11-13 and 31 are connected in series between terminal electrodes E1 and E2, and spiral coils 21-23 and 41 are connected in series between terminal electrodes E4 and E3. This allows the coupling coefficient to be adjusted, making it possible to obtain the desired coupling coefficient while reducing the height of the components.SELECTED DRAWING: Figure 2

The invention relates to a component carrier (100) comprising a stack having a stack direction, a method for manufacturing a component carrier and a package having a component carrier (100), wherein the stack (30) comprises: at least one electrically conductive layer structure; at least one electrically insulating layer structure; a first main surface (MS1) and a second main surface (MS2), wherein the first main surface (MS1) and the second main surface (MS2) are disposed one above the other in a stacking direction and are opposite to each other; and a first side wall (W1) and a second side wall (W2), the first side wall (W1) and the second side wall (W2) being located between the first main surface (MS1) and the second main surface (MS2) and connecting the opposite main surfaces (MS1, MS2). The extension (L1) of the first main surface (MS1) differs from the extension (L2) of the second main surface (MS2) in at least a first extension direction (ED) at least in the planarized state of the stack (30).

An electronic element includes a substrate, a first input pad on a first surface of the substrate, at least one chip on the first surface of the substrate, and a first output pad on the first surface of the substrate. The first input pad, the at least one chip, and the first output pad are sequentially connected. The first input pad and the first output pad are in direct physical contact with the first surface of the substrate. A surface of the first input pad facing away from the substrate and a surface of the first output pad facing away from the substrate constitute a partial area of an outer surface of the electronic element.

To provide a technique capable of reducing a current path length without losing connection reliability in a contact.SOLUTION: An elastic deformation part 82 includes: an upper contact part 85 that can come into contact with a signal pad 10 corresponded to any one of a plurality of signal pads 10; and a lower contact part 87 that is provided at an input and output board 4, and can come into contact with a short circuit pad 16 of which a potential is similar to a main pad 15A. In a contact 33, the lower contact part 87 is separated from the short circuit pad 16 when the upper contact part 85 is separated from the signal pad 10, and the lower contact part 87 comes into contact with the short circuit pad 16 when the elastic deformation part 82 is elastically deformed due to the upper contact part 85 coming into contact with the signal pad 10. Then, a current path length from the upper contact part 85 to the lower contact part 87 is shorter than that from the upper contact part 85 to a soldering part 81.SELECTED DRAWING: Figure 13

The present invention relates to a current sensor system comprising a conductor and a packaged integrated circuit for sensing a current in the conductor, said conductor being external to the packaged integrated circuit. The packaged integrated circuit comprises : - a substrate (2) having an active surface (3) and a back surface (4), - one or more magnetic sensing elements (7) disposed in or on the active surface of the substrate, - a processing circuit disposed in or on the active surface of the substrate and arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor, - a housing (1), - a plurality of leads (8) having an outer lead portion extending outside the housing and an inner lead portion, - electrical connections (6) between the leads and the active surface of the substrate, wherein the back surface of the substrate is disposed on a support (5) formed by at least two inner lead portions of said plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.

To provide a printed wiring board having high quality.SOLUTION: A method for manufacturing a printed wiring board includes: forming a resin insulation layer; forming a protective film on a first surface of the resin insulation layer; forming an opening for a via conductor; removing the protective film; cleaning the first surface; forming a second conductor layer; and forming a via conductor. The resin insulation layer contains a resin and inorganic particles, and the inorganic particles contain first inorganic particles partially embedded in the resin and second inorganic particles completely embedded in the resin. The cleaning includes forming the first inorganic particles from the second inorganic particles. The formation of the second conductor layer includes: forming a seed layer on the first surface of the resin insulation layer; forming a plating resist on the seed layer using DI exposure; forming an electrolytic plating layer; removing a plating resist; and removing a seed layer exposed from the electrolytic plating layer.SELECTED DRAWING: Figure 1

One or more embodiments of the present disclosure provides a manufacturing method for a flexible printed circuit board assembly (40) including a first substrate (410) including a first main line (4110), a first branch line (4130) extending from the first main line, and a first connector (4150) at a first side of the first main line, and having a perforation (4151), and a second substrate (430) separated from the first substrate (410), and including a second main line (4310), a second branch line (4330) extending from the second main line, and a second connector (4350) at a first side of the second main line, and having a perforation (4351), wherein the first substrate (410) and the second substrate (430) are electrically connected through the first connector (4150) and the second connector (4350).

Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes at least a frame plate, circuit boards, support bodies, and solder joints. The frame plate includes a frame body and first pads provided on the frame body. The circuit boards each are provided on one side of the frame plate. The circuit board includes a board body and second pads provided on the board body. The first pads face the second pads. The support bodies are provided between the frame plate and the circuit boards. The support bodies are configured to support the circuit boards, so that a predetermined spacing exists between the first pads and the second pads. The support bodies each include a first support portion and a second support portion. The first support portion and the second support portion are stacked along a thickness direction of the frame plate. The first support portion is connected to the frame body. The second support portion is connected to the board body. Solder joints are provided between the first pads and the second pads. The solder joints connect the first pads to the second pads.

Disclosed is a PCB of a planar transformer including: a PCB substrate with a through hole and a double-sided winding part formed on double sides of the PCB substrate, wherein the double-sided winding part is of a symmetric structure, a via hole consistent with the through hole is formed in the center of the double-sided winding part, the via hole is aligned to the through hole to form a magnetic core hole, and the circumference of the via hole is raised to form wire blocking parts; and forming a wire passing groove in the wall of the magnetic core hole, wherein the wire passing groove allows a metal conducting wire to pass through to be planarly wound from inside to outside on double sides of the double-sided winding part at the same time so as to form two coils in series located on the double sides of the PCB substrate.

A network switch includes a circuit board and a plurality of transmission ports. The circuit board is disposed in a chassis, and an opening of the chassis is corresponding to a first reference line. The plurality of transmission ports are disposed on an edge of the circuit board. The edge is corresponding to a second reference line, and the first reference line and the second reference line form an acute angle.

A computer system that allows a central device to transmit identification information to multiple peripheral devices is disclosed. The central device is coupled to multiple peripheral devices via respective point-to-point communication links. The central device may send a first identifier to a particular peripheral device of the multiple peripheral devices using a particular common mode voltage on a particular point-to-point communication link that is coupled between the central device and the particular peripheral device.

The application provides a display module and a display device, which comprise a display panel and a printed circuit board electrically connected to the display panel, the printed circuit board comprising: a connector comprising a plurality of first pins; a timing controller electrically connected to the plurality of first pins; and a protection circuit, input and output ends of the protection circuit being electrically connected to the first pins, and the output end of the protection circuit being used for outputting a low-level signal according to a high-level signal received by the input end of the protection circuit. By adding the protection circuit between the first pins and the back-end components, when the signal voltage at the first pins is high, the output end of the protection circuit will output low to pull down the voltage at the first pins, thereby solving the problem of burning of the back-end components caused by misinsertion of the wires.

A wearable electronic device is provided. The wearable electronic device includes a frame accommodating at least one lens or at least one display, a temple connected to an end of the frame, and a flexible printed circuit board (FPCB) having at least a portion disposed on the temple and extending along the longitudinal direction. The flexible printed circuit board includes: a plurality of substrate layers which have one or more circuit lines formed on a surface thereof and are disposed to overlap each other along the thickness direction; and at least one connection layer disposed between the plurality of substrate layers and connecting the surfaces of the substrate layers adjacent to each other. When the flexible printed circuit board is viewed in the thickness direction, the flexible printed circuit board includes a first circuit area having formed therein a data line for transmitting a data signal, and the at least one connection layer does not overlap the first circuit area.

A component carrier with a stack including at least one electrically conductive layer structure and at least one electrically insulating layer structure, a cavity formed in the stack and delimited by a bottom wall and a sidewall, and an electrically conductive laser protection structure at least in an edge region between the bottom wall and the sidewall.

The intermediate circuit board has a plate-shaped substrate and a plurality of signal transmission line pairs for differential signal transmission extending on a major face of the substrate from one end to the other end of the substrate in the direction of connection to the counterpart connect bodies; the substrate has a fiber cloth formed by braiding a plurality of fibers used to reinforce the substrate in a mesh pattern and a plate-like member made of plastic having the fiber cloth embedded therein; the plurality of signal transmission line pairs have straight pairs and cross pairs disposed in an alternating manner in the width direction of the substrate; and the straight pairs and cross pairs, when viewed in the through-thickness direction of the substrate, are formed extending inclined at an angle relative to the fibers of the fiber cloth.

The invention relates to the technical field of laser radars, and discloses a laser emission sensor and a laser radar system.The laser emission sensor comprises a substrate which comprises a first wiring layer, an insulating layer and a second wiring layer; a driving module and a plurality of light-emitting modules are arranged on the first wiring layer, any light-emitting module comprises a plurality of light sources, the light sources are connected with the driving module through corresponding first leads, and the first leads are arranged on the first wiring layer; a second lead opposite to the first lead is arranged on the second wiring layer; a plurality of connecting blocks are arranged on the insulating layer, the first lead is connected in parallel with the opposite second lead through at least two connecting blocks, and the length of the second lead connected in parallel is positively correlated with the length of the first lead. Response time and luminance of different light sources tend to be consistent, the reduction degree of a laser radar system to a target object is improved, and the reliability of the laser radar system is improved. And the signal crosstalk caused by increasing the line broadband of the lead and the increase of the size of the laser emission sensor can be avoided.

A power distribution component includes a wavelength converter, a connecting portion, a first power distribution portion and a second power distribution portion. The wavelength converter has an input end and a connection end. The connecting portion includes a first connecting end and a second connecting end, and the first connecting end is connected to the connection end. The first power distribution portion includes a first output port and a first end, and the first end is connected to the second connecting end. The second power distribution portion includes a second output port and a second end, and the second end is connected to the second connecting end. The first power distribution portion and the second power distribution portion are symmetrically disposed on opposite sides of the connecting portion by regarding the connecting portion as a mirror axis. Additionally, a wireless transceiver including a power distribution component is also provided.

The present invention provides a storage device with one-button destruction function, which comprises a case, a circuit board, a control unit, a storage unit, a button, and a power supply. The destruction function comprises steps of: generating a pressing signal when the button is pressed; the control unit obtains a pressing time according to the pressing signal; the control unit generating an erasing signal according to a time threshold value, a second time threshold value, and the pressing time; and the control unit executing a destruction process on the storage unit according to the erasing signal.

The application provides a printed circuit board, a conversion board and an electronic device, and relates to the technical field of electronics. The printed circuit board is provided with a first mounting area, a second mounting area and a third mounting area. The first mounting area is used for mounting a system-level chip. The second mounting area is used for mounting a first memory or a first conversion board. The third mounting area is used for mounting a second memory or a second conversion board. The first mounting area is provided with first-type signal pins and second-type signal pins. The second mounting area is provided with third-type signal pins and fourth-type signal pins. The third mounting area is provided with fifth-type signal pins and sixth-type signal pins. The first-type signal pins are electrically connected to the third-type signal pins through first-type signal lines in the printed circuit board. The second-type signal pins are electrically connected to the fifth-type signal pins through second-type signal lines in the printed circuit board. The fourth-type signal pins are electrically connected to the sixth-type signal pins through third-type signal lines in the printed circuit board.

A carrier assembly may include a first carrier sub-assembly, said first carrier sub-assembly having an elongated shape and comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure extending up to a first area provided on one of two extremities of the elongated shape, wherein a first plurality of conductive nanowires is provided on said first area, and a second carrier sub-assembly, said second carrier sub-assembly comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure comprising a second area, wherein a second plurality of conductive nanowires is provided on that second area.