72results about "Circuit electrical arrangements" patented technology

The invention discloses a BGA fan-out structure of a PCB and a manufacturing method of the BGA fan-out structure, at least one surface of the PCB is provided with a plurality of BGA bonding pads which are distributed in a square array mode, no wiring is conducted between the BGA bonding pads, the circle of BGA bonding pads arranged on the outermost periphery are peripheral bonding pads, the other BGA bonding pads are inner bonding pads, the center of each inner bonding pad is provided with an in-disc hole with an internal partition, and the in-disc hole is formed in the center of each inner bonding pad. The hole diameter of the in-plate hole is smaller than the outer diameter of the BGA bonding pad, and each inner circuit layer of the PCB is provided with a row of hole rings which are arranged around the in-plate hole in a one-to-one correspondence manner and are communicated with the in-plate hole, and a plurality of fan-out wires which are communicated with the hole rings in a one-to-one correspondence manner. The fan-out wires transversely penetrate through the middle of a gap between every two adjacent in-plate holes which are longitudinally arranged or transversely penetrate through the outer sides of the in-plate holes, and the hole rings in the different inner circuit layers are in one-to-one correspondence with the inner bonding pads in the different columns respectively. According to the invention, the design of fan-out of the BGA bonding pad from the inner layer is realized through the via in the pad and the inner layer wiring, and the problem of difficult fan-out wiring of the high-density bonding pad is solved.

The present invention provides a storage device with one-button destruction function, which comprises a case, a circuit board, a control unit, a storage unit, a button, and a power supply. The destruction function comprises steps of: generating a pressing signal when the button is pressed; the control unit obtains a pressing time according to the pressing signal; the control unit generating an erasing signal according to a time threshold value, a second time threshold value, and the pressing time; and the control unit executing a destruction process on the storage unit according to the erasing signal.

An integrated field output terminal assembly for traffic controller cabinets includes a circuit board carrying high-density flash-transfer relays and output terminals on a front side, and a short-circuit protection subassembly on a rear side. The protection subassembly has rows of plug-in fuse holders electrically connected through the board to incoming power channels from high-density switch packs, with surge suppressors located between fuse sections. An insulating panel, spaced by standoffs, shields the rear circuitry while providing labeled openings for rapid fuse access. A swing-down mounting bracket lets the board pivot within the cabinet for tool-less inspection and replacement of fuses. By placing circuit protection on the same footprint as the output board, the assembly eliminates separate fuse panels and bulky harnesses, cutting cabinet volume, material cost, and service time while safeguarding switch packs against shorts, lightning, and wiring faults.

The present disclosure relates to a power module designed to have balanced current flow for each parallel power switch such that each power switch has a similar current path length. The power module can include a first plurality of power switches electrically coupled to a first region and a second plurality of power switches electrically coupled to a second region. A first plurality of conductive clips is configured to conduct a first plurality of currents and a second plurality of conductive clips is configured to conduct a second plurality of currents. The power module can include a first leadframe configured to apply a positive voltage to the first region, a second leadframe configured to conduct current from the second region, and a third leadframe configured to conduct current from the third region.

The application discloses a circuit board conductive accessory, a circuit board assembly and an electronic device. The circuit board assembly comprises a circuit board, at least two conductive mounting seats and at least one conductive piece. The conductive mounting seats are connected to the circuit board, and each conductive mounting seat is formed with a first conductive plug-in structure. The conductive piece comprises a conductive main body part and at least two second conductive plug-in structures connected to the conductive main body part, and each first conductive plug-in structure is plugged with at least one second conductive plug-in structure. The circuit board conductive accessory, the circuit board assembly and the electronic device provided by the application can reduce manufacturing cost.

The present invention relates to a current sensor system comprising a conductor and a packaged integrated circuit for sensing a current in the conductor, said conductor being external to the packaged integrated circuit. The packaged integrated circuit comprises : - a substrate (2) having an active surface (3) and a back surface (4), - one or more magnetic sensing elements (7) disposed in or on the active surface of the substrate, - a processing circuit disposed in or on the active surface of the substrate and arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor, - a housing (1), - a plurality of leads (8) having an outer lead portion extending outside the housing and an inner lead portion, - electrical connections (6) between the leads and the active surface of the substrate, wherein the back surface of the substrate is disposed on a support (5) formed by at least two inner lead portions of said plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.

One or more embodiments of the present disclosure provides a manufacturing method for a flexible printed circuit board assembly (40) including a first substrate (410) including a first main line (4110), a first branch line (4130) extending from the first main line, and a first connector (4150) at a first side of the first main line, and having a perforation (4151), and a second substrate (430) separated from the first substrate (410), and including a second main line (4310), a second branch line (4330) extending from the second main line, and a second connector (4350) at a first side of the second main line, and having a perforation (4351), wherein the first substrate (410) and the second substrate (430) are electrically connected through the first connector (4150) and the second connector (4350).

Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes at least a frame plate, circuit boards, support bodies, and solder joints. The frame plate includes a frame body and first pads provided on the frame body. The circuit boards each are provided on one side of the frame plate. The circuit board includes a board body and second pads provided on the board body. The first pads face the second pads. The support bodies are provided between the frame plate and the circuit boards. The support bodies are configured to support the circuit boards, so that a predetermined spacing exists between the first pads and the second pads. The support bodies each include a first support portion and a second support portion. The first support portion and the second support portion are stacked along a thickness direction of the frame plate. The first support portion is connected to the frame body. The second support portion is connected to the board body. Solder joints are provided between the first pads and the second pads. The solder joints connect the first pads to the second pads.

Disclosed is a PCB of a planar transformer including: a PCB substrate with a through hole and a double-sided winding part formed on double sides of the PCB substrate, wherein the double-sided winding part is of a symmetric structure, a via hole consistent with the through hole is formed in the center of the double-sided winding part, the via hole is aligned to the through hole to form a magnetic core hole, and the circumference of the via hole is raised to form wire blocking parts; and forming a wire passing groove in the wall of the magnetic core hole, wherein the wire passing groove allows a metal conducting wire to pass through to be planarly wound from inside to outside on double sides of the double-sided winding part at the same time so as to form two coils in series located on the double sides of the PCB substrate.

A network switch includes a circuit board and a plurality of transmission ports. The circuit board is disposed in a chassis, and an opening of the chassis is corresponding to a first reference line. The plurality of transmission ports are disposed on an edge of the circuit board. The edge is corresponding to a second reference line, and the first reference line and the second reference line form an acute angle.

A computer system that allows a central device to transmit identification information to multiple peripheral devices is disclosed. The central device is coupled to multiple peripheral devices via respective point-to-point communication links. The central device may send a first identifier to a particular peripheral device of the multiple peripheral devices using a particular common mode voltage on a particular point-to-point communication link that is coupled between the central device and the particular peripheral device.

The application provides a display module and a display device, which comprise a display panel and a printed circuit board electrically connected to the display panel, the printed circuit board comprising: a connector comprising a plurality of first pins; a timing controller electrically connected to the plurality of first pins; and a protection circuit, input and output ends of the protection circuit being electrically connected to the first pins, and the output end of the protection circuit being used for outputting a low-level signal according to a high-level signal received by the input end of the protection circuit. By adding the protection circuit between the first pins and the back-end components, when the signal voltage at the first pins is high, the output end of the protection circuit will output low to pull down the voltage at the first pins, thereby solving the problem of burning of the back-end components caused by misinsertion of the wires.

A wearable electronic device is provided. The wearable electronic device includes a frame accommodating at least one lens or at least one display, a temple connected to an end of the frame, and a flexible printed circuit board (FPCB) having at least a portion disposed on the temple and extending along the longitudinal direction. The flexible printed circuit board includes: a plurality of substrate layers which have one or more circuit lines formed on a surface thereof and are disposed to overlap each other along the thickness direction; and at least one connection layer disposed between the plurality of substrate layers and connecting the surfaces of the substrate layers adjacent to each other. When the flexible printed circuit board is viewed in the thickness direction, the flexible printed circuit board includes a first circuit area having formed therein a data line for transmitting a data signal, and the at least one connection layer does not overlap the first circuit area.

The intermediate circuit board has a plate-shaped substrate and a plurality of signal transmission line pairs for differential signal transmission extending on a major face of the substrate from one end to the other end of the substrate in the direction of connection to the counterpart connect bodies; the substrate has a fiber cloth formed by braiding a plurality of fibers used to reinforce the substrate in a mesh pattern and a plate-like member made of plastic having the fiber cloth embedded therein; the plurality of signal transmission line pairs have straight pairs and cross pairs disposed in an alternating manner in the width direction of the substrate; and the straight pairs and cross pairs, when viewed in the through-thickness direction of the substrate, are formed extending inclined at an angle relative to the fibers of the fiber cloth.

The invention relates to the technical field of laser radars, and discloses a laser emission sensor and a laser radar system.The laser emission sensor comprises a substrate which comprises a first wiring layer, an insulating layer and a second wiring layer; a driving module and a plurality of light-emitting modules are arranged on the first wiring layer, any light-emitting module comprises a plurality of light sources, the light sources are connected with the driving module through corresponding first leads, and the first leads are arranged on the first wiring layer; a second lead opposite to the first lead is arranged on the second wiring layer; a plurality of connecting blocks are arranged on the insulating layer, the first lead is connected in parallel with the opposite second lead through at least two connecting blocks, and the length of the second lead connected in parallel is positively correlated with the length of the first lead. Response time and luminance of different light sources tend to be consistent, the reduction degree of a laser radar system to a target object is improved, and the reliability of the laser radar system is improved. And the signal crosstalk caused by increasing the line broadband of the lead and the increase of the size of the laser emission sensor can be avoided.

The present invention provides a storage device with one-button destruction function, which comprises a case, a circuit board, a control unit, a storage unit, a button, and a power supply. The destruction function comprises steps of: generating a pressing signal when the button is pressed; the control unit obtains a pressing time according to the pressing signal; the control unit generating an erasing signal according to a time threshold value, a second time threshold value, and the pressing time; and the control unit executing a destruction process on the storage unit according to the erasing signal.

The application provides a printed circuit board, a conversion board and an electronic device, and relates to the technical field of electronics. The printed circuit board is provided with a first mounting area, a second mounting area and a third mounting area. The first mounting area is used for mounting a system-level chip. The second mounting area is used for mounting a first memory or a first conversion board. The third mounting area is used for mounting a second memory or a second conversion board. The first mounting area is provided with first-type signal pins and second-type signal pins. The second mounting area is provided with third-type signal pins and fourth-type signal pins. The third mounting area is provided with fifth-type signal pins and sixth-type signal pins. The first-type signal pins are electrically connected to the third-type signal pins through first-type signal lines in the printed circuit board. The second-type signal pins are electrically connected to the fifth-type signal pins through second-type signal lines in the printed circuit board. The fourth-type signal pins are electrically connected to the sixth-type signal pins through third-type signal lines in the printed circuit board.

A multilayer wiring board has a first signal layer and ground layers, and includes a first differential wiring provided in the first signal layer and including first and second wirings, a first another signal line provided on the first signal layer, a signal via extending along the stacking direction and electrically connected to the first another signal line, and a ground via extending along a stacking direction and electrically connected to the ground layers. The first differential wiring includes a first portion, a second portion continuous with the first portion, and a third portion continuous with the second portion, the first wiring being disposed between the ground via and the signal via adjacent to the ground via, the second wiring being disposed on an opposite side of the first wiring across the ground via, and the ground via being sandwiched between the first and second wirings.

The embodiment of the invention provides a fast-fusing printed circuit board and an electric energy converter. The printed circuit board comprises at least one layer of copper foil; a fuse is arranged in the printed circuit board and is formed by copper foil; the fuse is connected with the current supply end, and the cross sectional area of the fuse is smaller than that of the copper foils at other positions within the preset range of the current supply end; wherein the current supply end is at least one or more of a power supply input end, a capacitance end and an inductance end, the fuse comprises a plurality of sub-fuses which are connected in parallel, and the sum of the cross sectional areas of the plurality of sub-fuses is smaller than or equal to the cross sectional area of the copper foil connected with the input end and the output end of the fuse; and when the current value of the current flowing through the plurality of sub-fuses is greater than the current value of the fusing current, the plurality of sub-fuses are fused step by step. Therefore, when the current supply end fails or is abnormal, the fuse can be fused to protect the circuit; besides, the fuse is formed by the copper foil, and the process of the fuse and the process of the copper foil are consistent, so that the fuse can be designed according to actual needs, and the printed circuit board is simple in process, small in size and low in cost.

The application provides a circuit board local metallization edge covering laminated structure and a processing technology thereof, which comprises a first core plate, a first non-flowing PP layer, a second core plate, a second non-flowing PP layer and a third core plate arranged in sequence from top to bottom, conductive metal strips are formed on the first core plate, the second core plate and the third core plate, a first blind groove is formed on the surface of the first core plate facing the second core plate, a second blind groove is formed on the surface of the third core plate facing the second core plate, and a first through groove is formed on the first non-flowing PP layer. The application does not need to pre-metallize and edge cover all layers, then control deep milling to mill off the excess metallization edge covering layers and etch, thereby avoiding the problems of milling deep damage to the metallization edge covering layer and affecting the unit size quality caused by the control deep milling, and mass production can be realized.

The present disclosure relates to a device, which may be part of an automotive radar system, and which includes a substrate including a first metal layer, at least one dielectric layer, the first metal layer being disposed over the at least one dielectric layer, a second metal layer, the at least one dielectric layer being disposed over the second metal layer, and multiple waveguide structures, each including a portion of the first metal layer and conductive side walls that extend through the at least one dielectric layer from the first metal layer to the second metal layer, the sidewalls defining first openings that extend through the first metal layer, the dielectric layer, and the second metal layer. The first metal layer may include second openings, and each opening of the second openings may laterally surround at least one of the multiple waveguide structures.

Devices with spark gap structures for monitoring or protecting against electrical overload (EOS) and associated methods are disclosed. In one aspect, a vertical spark gap device comprises a substrate with a horizontal main surface, a first conductive layer, and a second conductive layer, each extending over the substrate and substantially parallel to the horizontal main surface, while separated in a vertical direction intersecting the horizontal main surface. One of the first and second conductive layers is electrically connected to a first voltage node, and the other of the first and second conductive layers is electrically connected to a second voltage node.The first and second conductive layers serve as one or more arc electrode pairs and have overlapping sections configured to generate one or more arc discharges in response to an EOS voltage signal received between the first and second voltage nodes, generally extending in the vertical direction.

One or more embodiments of the present disclosure provides a manufacturing method for a flexible printed circuit board assembly including a first substrate including a first main line, a first branch line extending from the first main line, and a first connector at a first side of the first main line, and having a perforation, and a second substrate separated from the first substrate, and including a second main line, a second branch line extending from the second main line portion, and a second connector at a first side of the second main line, and having a perforation, wherein the first substrate and the second substrate are electrically connected through the first connector and the second connector.

The present disclosure relates to a power module comprising: a first high-side current path and a second high-side current path connected by a plurality of high-side switches between a power input node and an output node; a first low-side current path and a second low-side current path connected by a plurality of low-side switches between a ground node and the output node; wherein a first current path length is equal to a sum of a length of the first high-side current path and a length of the first low-side current path, and wherein a second current path length is equal to a sum of a length of the second high-side current path and a length of the second low-side current path, and wherein a deviation between the first current path length and the second current path length is within 15%.

A semiconductor device includes a first case, a second case coupled to the first case to form an inner space, a memory module disposed within the inner space, and including a module substrate and a plurality of electronic components mounted on the module substrate, and a heat dissipation chamber assembly provided in at least a portion of the first case, and including a heat diffusion chamber in thermal contact with at least one of the electronic components and a sidewall structure extending vertically toward the module substrate to surround the electronic component in thermal contact with the heat diffusion chamber.

The application belongs to the technical field of circuit board manufacturing, and particularly relates to a buried magnetic circuit board manufacturing method and an electronic component. The buried magnetic circuit board manufacturing method comprises the following steps: preparing a substrate, the substrate is prepared with two plates, and the two plates are oppositely arranged; burying a magnetic body, a pressure bearing plate with a predetermined strength is arranged between the two plates, a containing through slot is formed on the pressure bearing plate, and an adhesive layer is arranged on both sides of the pressure bearing plate, a first magnetic body is accommodated in the containing through slot, and the two plates are respectively pressed and adhered by the two sides of the pressure bearing plate under a predetermined temperature and a predetermined pressure; filling, a containing hole is formed on one of the plates, the containing hole penetrates to the first magnetic body, the cross-sectional area of the first magnetic body parallel to the pressure bearing plate is greater than the cross-sectional area of the containing hole parallel to the pressure bearing plate, and a magnetic conductive glue is filled in the containing hole; and solidifying, the magnetic conductive glue is solidified. The application improves the total inductance of the circuit board, and does not need to enlarge the size of the circuit board, which is beneficial to the miniaturization of the circuit board.

Press-fit fasteners for securing components together are provided. In one aspect, an electronic system assembly includes a first component comprising a first hole, a second component comprising a second hole, and a press-fit fastener configured to be inserted into the first hole and the second hole in a single motion. The press-fit fastener is configured to at least contribute to securing the second component to the first component after insertion into the first and second holes. Related press-fit fasteners and methods of manufacture are disclosed.

The invention is suitable for the technical field of converters, and provides an energy storage converter and a capacitor current sharing design method thereof. The energy storage converter comprises a PCB. The positive bus and the negative bus are arranged on the PCB, the reference midpoint is located between the positive bus and the negative bus, the first capacitor network is arranged between the positive bus and the reference midpoint and comprises a plurality of positive bus capacitors, and the second capacitor network is arranged between the reference midpoint and the negative bus and comprises a plurality of negative bus capacitors. The plurality of positive bus capacitors are connected in parallel, and the plurality of negative bus capacitors are connected in parallel; and the contact areas of the pins of the plurality of positive bus capacitors and the plurality of negative bus capacitors and the copper sheet on the PCB are different, so that a plurality of impedance gradients are formed. By the adoption of the mode, the current sharing precision can be improved, current sharing control is converted from circuit-level intervention to structure-level self-balancing, active elements such as current sharing resistors / inductors are omitted, and the current sharing circuit can adapt to high-frequency application scenes.

A computer system that allows a central device to transmit identification information to multiple peripheral devices is disclosed. The central device is coupled to multiple peripheral devices via respective point-to-point communication links. The central device may send a first identifier to a particular peripheral device of the multiple peripheral devices using a particular common mode voltage on a particular point-to-point communication link that is coupled between the central device and the particular peripheral device.

To provide a printed circuit board that comprises a main printed circuit board and a flexible printed circuit board where a damper detection pattern is formed, and that can make compact the structure for ensuring the security of the main printed circuit board.SOLUTION: A flexible printed circuit board 3 of a printed circuit board comprises a box part 3a formed in a box shape, and fixed parts 3b to 3d spreading on an outer peripheral side of the box part 3a. Internal lands 35 to 38 forming one end part of a tamper detection part are electrically connected to the main printed circuit board and arranged inside the box part 3a, and external lands 45 to 48 forming the other end part of the tamper detection part are formed at the fixed parts 3b to 3d, fixed to the main printed circuit board, and also electrically connected to the main printed circuit board. The external lands 45 to 48 are insulated from one another, and the external lands 45 to 48 are not electrically connected to other external lands 45 to 48.SELECTED DRAWING: Figure 4