336results about "Circuit electrical arrangements" patented technology

A circuit assembly includes a printed circuit board, an integrated circuit chip coupled to the printed circuit board, and a plurality of power phases associated with the integrated circuit chip arranged as grouped power phases. One or more power phases of the grouped power phases is physically distanced from a side of the integrated circuit chip associated with physically distanced power phase(s) of the grouped power phases.

The invention provides a PCB wiring method, device and equipment, a medium and a product, and relates to the technical field of computers, in particular to the field of printed circuit boards and automatic driving. According to the specific implementation scheme, the method comprises the steps of determining a DDR wiring layer used for DDR signal line deployment of the DDR memory, a ground layer used for ground wire deployment and a power supply layer used for power line deployment according to lamination information of the PCB; wherein the lamination information is used for indicating a top layer, a middle layer and a bottom layer of the PCB, and the DDR wiring layer is located in the middle layer; and wiring the DDR signal line, the ground line and the power line according to the DDR wiring layer, the ground layer and the power supply layer.

A riser card includes a circuit board and first, second, and third connectors. The first and second connectors are positioned at bottom and top edges of the circuit board, respectively. The third connector is mounted to a face of the circuit board. Such riser card may be mounted on a primary system board such that the first connector is detachably connected to a first complementary connector of the primary system board with the circuit board perpendicular to the primary system board, and the first connector receives power, data, and sideband signals from the first complementary connector. The second and third connectors may mate with second and third complementary connectors of an expansion card oriented parallel to the circuit board and a stackable secondary riser card oriented perpendicular to the circuit board, respectively. The riser card communicates power and sideband signals to the stackable secondary riser card via the third connector.

The embodiment of the invention provides a printed circuit board, a processing method, a test system and electronic equipment. The printed circuit board comprises a plurality of metal layers, a first metal transmission hole, a signal transmission line and a first signal interface. Wherein the plurality of metal layers form a board body structure of the printed circuit board. The first metal transmission hole is arranged in the board body structure, and the first end of the first metal transmission hole extends from the interior of the board body structure to the upper board surface side of the board body structure so as to be coupled with the first signal interface. The signal transmission line is arranged on a first metal layer in the plurality of metal layers, and a first end of the signal transmission line is coupled with a first contact point on the first metal transmission hole in the plate body structure. And a transmission path distance with a first length exists between the first contact point of the first metal transmission hole and the second end of the first metal transmission hole, so that the transmission impedance of the first via hole connecting part is improved. According to the embodiment, the process complexity and the design difficulty are reduced, and the impedance matching degree of the printed circuit board and an external device or structure is improved.

An antenna assembly includes a stack and an antenna structure. The stack includes at least one electrically conductive layer structure and at least one electrically insulating layer structure, and a component, at least partially embedded in the stack. At least a portion of the electrically conductive layer structure is provided at the external side of the stack and is configured to act at least as part of an electromagnetic wave coupling structure. The component is coupled to the electromagnetic wave coupling structure. The antenna structure provides an opening to a channel. The stack and the antenna structure are connected so that the electromagnetic wave coupling structure and the opening to the channel face each other.

Electrical connectors, electrical modules, and systems are provided. In one aspect, an electrical connector includes a housing defining a side surface, an electrical conductor supported by the housing and including an engagement portion proximate the side surface of the housing. The engagement portion is adapted to engage another electrical conductor of another electrical connector. The connector also includes a magnet supported by the housing proximate the side surface of the housing, a projection extending from the side surface of the housing, and a receptacle defined in the side surface of the housing. In other aspects, an electrical module includes at least one of these electrical connectors. In further aspects, a system includes a plurality of these modules and the modules are selectively couplable together.

According to the impedance test method for the multi-layer and multi-order printed circuit board and the circuit board provided by the embodiment of the invention, the through hole is formed in the inner layer circuit board, the impedance of the inner layer circuit board is tested through the through hole, and the impedance of the inner layer circuit board is tested, so that the circuit board can work normally, and the performance and reliability of electronic equipment are improved. After a layer of outer layer circuit board is added on the outer layer circuit board, a blind hole is manufactured on the outer layer circuit board based on a through hole PAD, a test PAD is made by using the blind hole, and impedance test is performed on the added outer layer circuit board, so that the impedance of the current layer can be measured in time during layer addition, and the impedance can be measured without waiting for a finished product. The actual impedance of each layer can be measured, the rejection rate of the impedance of a final finished product is reduced, the production efficiency is improved, and the cost is reduced.

Methods and systems for controlling charging of the battery in an electric vehicle. Lithium plating is monitored, measured, or estimated. Identification of lithium plating conditions is used to determine whether and when to reduce charging current. Conversely, if no lithium plating conditions are identified, charging current may be increased toward a maximum level determined based on the state, age and / or health of the battery.

Example approaches are directed to an apparatus for reducing smoke created by a surgical instrument in a procedure, e.g., as part of a surgical system. The apparatus may include an insulating vessel and a flexible printed circuit disposed within the vessel, with the vessel including an inlet and an outlet. The flexible printed circuit includes a substrate layer and a conductive layer disposed on the substrate. The conductive layer includes two charge conducting portions or electrodes having opposite electrical charges, which are spaced apart by an electrically insulated portion. The charge conducting portions are positioned between the inlet and outlet of the vessel such that particles entering the inlet are electrically charged and drawn to one of the charge conducting portions.

The signal transmission device includes first, second and third chips. The first and second chips includes respectively: a first input pad; an ADC that converts a first analog signal inputted to the first input pad into a first digital signal; a first transmission circuit that generates a first pulse signal in correspondence to the first digital signal; a first output pad that outputs the first pulse signal; a second input pad; a first reception circuit that generates a second digital signal in correspondence to a second pulse signal inputted to the second input pad; a DAC that converts the second digital signal into a second analog signal; and a second output pad that outputs the second analog signal. The third chip, upon receiving the first pulse signal from the first output pad of the first chip, outputs the second pulse signal to the second input pad of the second chip.

The invention discloses a BGA fan-out structure of a PCB and a manufacturing method of the BGA fan-out structure, at least one surface of the PCB is provided with a plurality of BGA bonding pads which are distributed in a square array mode, no wiring is conducted between the BGA bonding pads, the circle of BGA bonding pads arranged on the outermost periphery are peripheral bonding pads, the other BGA bonding pads are inner bonding pads, the center of each inner bonding pad is provided with an in-disc hole with an internal partition, and the in-disc hole is formed in the center of each inner bonding pad. The hole diameter of the in-plate hole is smaller than the outer diameter of the BGA bonding pad, and each inner circuit layer of the PCB is provided with a row of hole rings which are arranged around the in-plate hole in a one-to-one correspondence manner and are communicated with the in-plate hole, and a plurality of fan-out wires which are communicated with the hole rings in a one-to-one correspondence manner. The fan-out wires transversely penetrate through the middle of a gap between every two adjacent in-plate holes which are longitudinally arranged or transversely penetrate through the outer sides of the in-plate holes, and the hole rings in the different inner circuit layers are in one-to-one correspondence with the inner bonding pads in the different columns respectively. According to the invention, the design of fan-out of the BGA bonding pad from the inner layer is realized through the via in the pad and the inner layer wiring, and the problem of difficult fan-out wiring of the high-density bonding pad is solved.

The present invention provides a storage device with one-button destruction function, which comprises a case, a circuit board, a control unit, a storage unit, a button, and a power supply. The destruction function comprises steps of: generating a pressing signal when the button is pressed; the control unit obtains a pressing time according to the pressing signal; the control unit generating an erasing signal according to a time threshold value, a second time threshold value, and the pressing time; and the control unit executing a destruction process on the storage unit according to the erasing signal.

Clips serving as vertical interconnect are disclosed herein. In certain embodiments, an electronic assembly such as an electronic module includes a first circuit board and an electronic component attached to the first circuit board. The electronic component includes a dielectric body and at least one clip secured to the dielectric body. The clip is electrically connected to the first circuit board to operate as vertical interconnect.

The invention relates to a display module and a display device, in the display module, a protective layer on a first part of a flexible circuit board is in lap joint with a binding part of a display panel, so that back glue does not need to be arranged at the joint of the first part and the binding part, and therefore, when a mother board of the display panel is cut, a linear cutting process does not need to be adopted, and the production efficiency is improved. The utilization rate of the mother board is improved; meanwhile, the first adhesive layer between the first back plate and the binding part is expanded outwards; the end part of the first adhesive layer exceeds the end part of the binding part and is connected with the protective layer of the flexible circuit board, so that the joint of the binding part and the first part is sealed; therefore, the waterproof, salt mist-proof and sweat-proof capabilities of the display module can be improved, so that the reliability of the display module is improved.

The invention provides a rigid-flexible combined board, a satellite, a satellite system and a satellite manufacturing method, the rigid-flexible combined board is suitable for connecting each subsystem in the satellite to realize information interaction among the subsystems, and the rigid-flexible combined board comprises a rigid board comprising a signal transmission line; and a plurality of flexible plates, one end of each flexible plate is electrically connected with the rigid plate, and the other end of each flexible plate is electrically connected with the corresponding subsystem. The rigid-flexible combined board is electrically connected with each subsystem of the satellite through each flexible board electrically connected with one rigid board, so that data interaction among the subsystems in the satellite is realized, complicated and disordered data cables in the prior art can be integrated, and more concise and effective spatial layout in the satellite is realized.

A bus bar including a first end comprising a first material and a second end comprising a second material and a method of manufacture are provided. The first end is designed to be coupled to a terminal of a first battery cell of a battery module and includes a first collar disposed on the first end designed to receive and surround the terminal of the first battery cell of the battery module. The second end is designed to be coupled to a terminal of a second battery cell of the battery module and includes a second collar disposed on the second end designed to receive and surround the terminal of the second battery of the battery module. The first and second batteries of the battery module are adjacent to one another. Moreover, the bus bar includes a joint electrically and mechanically coupling the first end and the second end.

A coated article includes: a substrate; a first dielectric layer over at least a portion of the substrate; a first metallic layer over at least a portion of the first dielectric layer; a first primer layer over at least a portion of the first metallic layer; and a second dielectric layer over at least a portion of the first primer layer; where the first primer layer is selected from the group consisting of zinc, aluminum-doped silver, aluminum zinc, vanadium zinc, tungsten tantalum, titanium niobium, zirconium niobium, tungsten niobium, aluminum niobium, aluminum titanium, tungsten titanium, tantalum titanium, zinc titanium, zinc tin, indium zinc, silver zinc, gallium zinc, indium tin, mixtures thereof, combinations thereof, and alloys thereof.

A power terminal includes first and second conductive sheets. The first conductive sheet includes a first joining portion, first fingers extending from the first joining portion, and a first mounting portion extending from the first joining portion and configured to mount to a substrate. The first fingers have hooked ends connected to the first joining portion by first beams. The second conductive sheet includes a second joining portion, second fingers extending from the second joining portion, and a second mounting portion extending from the second joining portion and configured to mount to the substrate. The two second fingers have curved ends connected to the second joining portion by second beams. The hooked ends and the curved ends include contact surfaces configured to contact a same side of a card. At least one of the first and second mounting portions includes at least two mounting tails.

A battery module includes a housing, a plurality of battery cells disposed in the housing, and a printed circuit board (PCB) assembly disposed in the housing. The PCB assembly includes a PCB and a shunt disposed across a first surface of the PCB. A second surface of the shunt directly contacts the first surface of the PCB, and the shunt is electrically coupled between the battery cells and a terminal of the battery module.

An integrated field output terminal assembly for traffic controller cabinets includes a circuit board carrying high-density flash-transfer relays and output terminals on a front side, and a short-circuit protection subassembly on a rear side. The protection subassembly has rows of plug-in fuse holders electrically connected through the board to incoming power channels from high-density switch packs, with surge suppressors located between fuse sections. An insulating panel, spaced by standoffs, shields the rear circuitry while providing labeled openings for rapid fuse access. A swing-down mounting bracket lets the board pivot within the cabinet for tool-less inspection and replacement of fuses. By placing circuit protection on the same footprint as the output board, the assembly eliminates separate fuse panels and bulky harnesses, cutting cabinet volume, material cost, and service time while safeguarding switch packs against shorts, lightning, and wiring faults.

A method for providing an electrical connection comprises connecting a first cable to a first conductive structure on a printed circuit board, connecting a second cable to a second conductive structure on the printed circuit board, comparing the following two items: a propagation delay of a first signal path including the first cable and the first conductive structure on the printed circuit board, and a propagation delay of a second signal path including the second cable and the second conductive structure on the printed circuit board; and depending on the result of the comparison, removing conductive material of the first conductive structure and / or the second conductive structure so as to modify the electrical length of the first conductive structure and / or the second conductive structure to obtain a first conductive path and a second conductive path, thereby reducing the difference in propagation delay between the first signal path and the second signal path.

The present disclosure relates to a power module designed to have balanced current flow for each parallel power switch such that each power switch has a similar current path length. The power module can include a first plurality of power switches electrically coupled to a first region and a second plurality of power switches electrically coupled to a second region. A first plurality of conductive clips is configured to conduct a first plurality of currents and a second plurality of conductive clips is configured to conduct a second plurality of currents. The power module can include a first leadframe configured to apply a positive voltage to the first region, a second leadframe configured to conduct current from the second region, and a third leadframe configured to conduct current from the third region.

Methods and systems for controlling fast-charging of the battery in an electric vehicle. Battery characteristics are communicated from the electric vehicle to an analyzer, which may be cloud based or may be part of a charging station. The analyzer generates temperature control signals that are communicated to the electric vehicle, and charging current control signals that are provided to charging circuitry of the charging station.

The application discloses a circuit board conductive accessory, a circuit board assembly and an electronic device. The circuit board assembly comprises a circuit board, at least two conductive mounting seats and at least one conductive piece. The conductive mounting seats are connected to the circuit board, and each conductive mounting seat is formed with a first conductive plug-in structure. The conductive piece comprises a conductive main body part and at least two second conductive plug-in structures connected to the conductive main body part, and each first conductive plug-in structure is plugged with at least one second conductive plug-in structure. The circuit board conductive accessory, the circuit board assembly and the electronic device provided by the application can reduce manufacturing cost.

The invention provides a circuit board, a preparation method of the circuit board and electronic equipment. The circuit board comprises a substrate; the solder mask layer is arranged on the end face of at least one side of the substrate, and a groove is formed in the end face of the side, away from the substrate, of the solder mask layer; and the reinforcing layer is connected with the side, where the groove is formed, of the solder mask layer, and an adhesive layer is arranged on the reinforcing layer and located in the groove. Through the mode, the adhesive layer can be placed in the groove, so that the adhesive layer is prevented from overflowing from the solder mask layer through the groove, and the edge area, forming the groove, of the solder mask layer is connected with the reinforcing layer, so that the edge area of the reinforcing layer can support the reinforcing layer, and the flatness of the surface of the reinforcing layer is effectively ensured.

The invention discloses a flexible circuit board and a maintenance method thereof, an integrated busbar, a battery pack and a vehicle, the flexible circuit board comprises a conductive layer, a first covering film and a second covering film, the conductive layer comprises a line, a first fuse and a second fuse, the first fuse is electrically connected with the line, and the second fuse is electrically connected with the first covering film. A gap is formed between the second fuse and the circuit; the first covering film and the second covering film are arranged on the two sides of the conducting layer in the thickness direction respectively and connected with the conducting layer, and the first covering film is provided with a first window, a second window, a third window and a fourth window; wherein the first window and the second window are respectively arranged corresponding to bonding pads at two ends of the first fuse, and the third window and the fourth window are respectively arranged corresponding to bonding pads at two ends of the second fuse. According to the flexible circuit board, the fuse can be maintained, so that the flexible circuit board is prevented from being scrapped due to fusing of the fuse.

A display apparatus includes: a substrate including a display region and a non-display region outside the display region; a first line disposed on an upper surface of the substrate in the non-display region of the substrate, where the first line has a first height; a flexible printed circuit board; a second line disposed on a lower surface of the flexible printed circuit board, where the second line has a second height; and a connection line located in a portion in which the substrate and the flexible printed circuit board overlap each other and disposed between the substrate and the flexible printed circuit board, where in the connection lines has a third height greater than each of the first height and the second height, one end of the connection line is connected to the first line, and another end of the connection line is connected to the second line.

To provide a laminated coupling coil component capable of obtaining the desired coupling coefficient while reducing the height of the component.SOLUTION: A laminated coupling coil component 1 has conductor layers L1, L3, L5 including spiral coils 11-13, conductor layers L2, L4, L6 including spiral coils 21-23, and a conductor layer L7 including spiral coils 31, 41 provided at different planar positions from each other. The spiral coils 11-13 and 21-23 overlap each other when viewed from the laminated direction. Spiral coils 11-13 and 31 are connected in series between terminal electrodes E1 and E2, and spiral coils 21-23 and 41 are connected in series between terminal electrodes E4 and E3. This allows the coupling coefficient to be adjusted, making it possible to obtain the desired coupling coefficient while reducing the height of the components.SELECTED DRAWING: Figure 2

The invention relates to a component carrier (100) comprising a stack having a stack direction, a method for manufacturing a component carrier and a package having a component carrier (100), wherein the stack (30) comprises: at least one electrically conductive layer structure; at least one electrically insulating layer structure; a first main surface (MS1) and a second main surface (MS2), wherein the first main surface (MS1) and the second main surface (MS2) are disposed one above the other in a stacking direction and are opposite to each other; and a first side wall (W1) and a second side wall (W2), the first side wall (W1) and the second side wall (W2) being located between the first main surface (MS1) and the second main surface (MS2) and connecting the opposite main surfaces (MS1, MS2). The extension (L1) of the first main surface (MS1) differs from the extension (L2) of the second main surface (MS2) in at least a first extension direction (ED) at least in the planarized state of the stack (30).

The invention relates to the technical field of circuits, and provides a stacked semiconductor circuit, which comprises a plurality of circuit boards, the plurality of circuit boards are arranged in an attached manner, and each circuit board comprises a plurality of pins; the two ends of each connecting column are respectively connected with the first ends of the pins corresponding to the two adjacent circuit boards; and the first ends of the plurality of pins in one circuit board are respectively connected to the electric control board. According to the stacked semiconductor circuit, the parallel stacked integration of a plurality of circuit boards is realized, the miniaturization of electric control is realized, the arrangement is more flexible, and the cost is lower.