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289results about How to "Simple and low-cost" patented technology

Reactive sensor modules using pade' approximant based compensation and providing module-sourced excitation

Reactive sensors typically exhibit nonlinear response to the combination of an excitational signal (e.g., sinusoidally oscillating signal) and a physical parameter under measure (e.g., position of magnetic core member). Such sensors are typically sensitive to temperature variation. Systems and methods are disclosed for compensating for the nonlinear and / or temperature dependant behavior of reactive sensors and for calibrating the post-compensation output signals relative to known samples of the physical parameter under measure (e.g., position). One class of embodiments comprises a housing containing at least part of a reactive sensor, a monolithic integrated circuit and a timing reference (e.g., an oscillator crystal). The integrated circuit includes a waveform generator for generating a sensor exciting signal, a detector for detecting the response of the sensor to the combination of the exciting signal and the under-measure physical parameter, a temperature compensating unit and a Pade' Approximant based, nonlinearity compensating unit. The temperature compensating unit and the Pade' Approximant nonlinearity compensating unit are tuned by use of digitally programmed coefficients. The coefficients calibrate the final output as well as compensating for nonlinearity and temperature sensitivity. A highly accurate measurement of the under-measure physical parameter is made possible even though each of the sensor and compensating circuitry may be relatively simple, compact, and low in cost.
Owner:SEMICON COMPONENTS IND LLC +1

Low noise full integrated multilayers magnetic for power converters

A multilayer structure in which all the magnetic elements have the windings edged in the inner layers and the magnetic core which surrounds the winding has the legs penetrating through the multilayer structure. The interconnection between the magnetic elements and the rest of electronic components is done through the layers of the multilayer board, horizontally and vertically through via. For higher power components special cuts are performed in the multilayer board to accommodate the body of the components which may be connected to an external heatsink. The winding arrangement in the transformer is done in a such way to minimize and even eliminate the common mode noise injected through the capacitance between primary and secondary winding. The input filter is constructed to exhibit a differential and a common mode impedance. Supplementary capacitors are incorporated in the multilayers structure to offer a low impedance to the noise to short it to the source, or for injecting currents of opposite polarity to cancel the common mode current transferred through the transformer's inter winding capacitance and through the parasitic capacitance of the switching elements to the secondary. The insulation between winding can be in accordance with the safety agency requirements, allowing much shorter creapage distances inside of the multilayer PCB structure than in the air due to the compliance with coating environment.
Owner:DET INT HLDG LTD
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