Soft and hard combined semi-finished product board, manufacturing method thereof and soft and hard combined board manufacturing method

A combination of soft and hard, semi-finished board technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, circuit lamination, etc., can solve the problems of slow processing speed, low efficiency, and inability to mass produce, so as to achieve high production efficiency and improve production Efficiency and ease of mass production

Inactive Publication Date: 2017-11-03
MFS TECH HUNAN
View PDF4 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] In the existing production process of rigid-flex boards, it is necessary to manually fill epoxy resin blocks at the window openings, which is very inefficient, and the filling material is easy to slide and shift, resulting in defective products after laminat

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Soft and hard combined semi-finished product board, manufacturing method thereof and soft and hard combined board manufacturing method
  • Soft and hard combined semi-finished product board, manufacturing method thereof and soft and hard combined board manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] Such as figure 2 As shown, the soft-hard combination semi-finished board of the present invention includes a soft board layer 1, the number of layers of the soft board layer 1 is greater than or equal to 2 layers, and one side of the soft board layer 1 is pressed from bottom to top with an upper covering film layer 2, an upper The first film layer 3, the upper hard board layer 4, the upper second film layer 5 and the upper copper foil layer 6, and the other side of the soft board layer 1 is laminated with the lower cover film layer 7 and the lower first film layer from top to bottom. 8. The lower rigid board layer 9, the lower second film layer 10 and the lower copper foil layer 11, wherein the upper first film layer 3 has a first window 31 corresponding to the bending area I of the soft board layer, and the lower The first film layer 8 is provided with a second window 81 corresponding to the bending area I of the soft board layer. Corresponding to the third window 41...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a soft and hard combined semi-finished product board, a manufacturing method thereof and a soft and hard combined board manufacturing method. The soft and hard combined semi-finished product board comprises a soft board layer, wherein an upper cover film layer, an upper first film layer, an upper hard board layer, an upper second film layer and an upper copper foil layer are laminated on one surface of the soft board layer from bottom to top, and a lower cover film layer, a lower first film layer, a lower hard board layer, a lower second film layer and a lower copper foil layer are laminated on the other surface of the soft board layer from top to bottom; a first window is formed in the upper first film layer; a second window is formed in the lower first film layer; a third window is formed in the upper hard board layer; a fourth window is formed in the upper second film layer; a fifth window is formed in the lower hard board layer; a sixth window is formed in the lower second film layer; an upper etching-resistant printing ink layer is printed on the upper surface of the bending area of the soft board layer, and a lower etching-resistant printing ink layer is printed on the lower surface of the bending area of the soft board layer. An uncovering technology does not need to be carried out, the production efficiency is high, the product quality is good, and volume production is facilitated.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a rigid-flex semi-finished board and a manufacturing method thereof, and a rigid-flex board manufacturing method. Background technique [0002] Such as figure 1 Shown is the soft-rigid combination semi-finished board obtained after the lamination process in the prior art, which includes a soft board layer, and one side of the soft board layer is provided with an upper covering film layer, an upper first film layer, an upper hard board layer from bottom to top. Board layer 4, upper second film layer 5 and upper copper foil layer 6, the other side of the soft board layer is provided with a lower cover film layer 7, a lower first film layer 8, a lower hard board layer 9, a lower second Two film layers 10 and a lower copper foil layer 11, wherein the upper first film layer is provided with a first window 31 corresponding to the bending area of ​​the soft b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/46H05K1/02
CPCH05K3/4691H05K1/02H05K2203/06H05K2203/14
Inventor 唐川张国兴
Owner MFS TECH HUNAN
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap