18results about "Circuit lamination" patented technology

The embodiment of the application discloses a method for improving the thickness uniformity of a PCB (Printed Circuit Board), which comprises the following steps: preparing a substrate and a prepreg to be fused, alternately and overlappingly placing the substrate and the prepreg to obtain a PCB to be fused, arranging a hot-melt block between the substrate and the prepreg of the PCB to be fused, the hot-melt block having a copper grid structure, placing the PCB to be fused with the hot-melt block arranged thereon on a processing platform of a hot-melt machine, starting the hot-melt machine, heating the hot-melt block, and pressing the PCB to be fused to obtain a fused PCB. The hot-melt block with the copper grid structure is arranged between the substrate and the prepreg of the PCB to be fused, and then the PCB to be fused is heated and pressed, so that the hot-melt block area is uniformly heated, and then the thickness of the produced PCB is uniform, and it is not easy to form wrinkles, and the probability of the PCB being scrapped is reduced.

Power module comprising a power semiconductor die and at least one substrate comprising an insulating layer in contact with a metallized connection surface of said die and at least one conductive path on a conductive layer on a face of the insulating layer opposite to the metallized connection surface of the die and wherein said insulating layer comprises vias filled with conductive material to provide connecting pads between said metallized connection surface of said die and said conductive path, and wherein said vias are arranged with a decreasing density from at least one hot spot position of said metallized connection surface when the die is in operation to a peripheral area of said metallized connection surface.

The invention relates to the field of flexible circuit board manufacturing, and provides a preparation method for improving interlayer layering and warping of a bending area of a flexible circuit board. The method comprises the following steps: determining the width of a non-adhesive region of a bending region of the flexible circuit board based on analysis of bending stress distribution; the method comprises the following steps: replacing an adhesive-free electrolytic copper foil used by a base material in a bending area with an adhesive-free rolled copper foil, and utilizing a grain structure which is formed by the rolled copper foil due to a rolling process and is internally compact and axially arranged; manufacturing a flexible circuit board, and manufacturing a non-glue area in a bending area of the flexible circuit board according to the determined width of the non-glue area; carrying out press-fit encapsulation, and carrying out overall press-fit on the flexible circuit board with the manufactured non-glue area; cutting the laminated and encapsulated flexible circuit board into single pieces by adopting high-precision laser cutting equipment; and carrying out a bending test, carrying out bending operation on the flexible circuit board which is cut into the single pieces, and verifying the bending effect and the improvement condition of the warping problem.

The present invention is directed to provide novel laminates for wiring boards. Novel laminates for wiring boards according to the present invention includes an insulating substrate layer and copper wiring, the laminate having a circuit linearity of 1.0 or more and 1.7 or less.

A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.

An electronic apparatus includes: an electronic component; a substrate including a first layer at which the electronic component and a first ground pattern are disposed, and a second layer at which a second ground pattern is disposed; and a case which is in contact with the first ground pattern, covers the electronic component, reduces magnetic noise, and is fixed to the substrate, and plural conductors connecting the first ground pattern and the second ground pattern are disposed along a portion of the first ground pattern, the portion being in contact with the case.

To provide: a copper / ceramic assembly which is capable of suppressing the generation of cracks of a ceramic member even if a severe cold heat cycle is loaded, and also which is excellent in migration resistance; an insulated circuit board; a method for producing a copper / ceramic assembly; and a method for producing an insulated circuit board.SOLUTION: There is provided a copper / ceramic assembly in which a copper member 12 comprising copper or a copper alloy is bonded to a ceramic member 11 comprising a nitrogen-containing ceramic. A Mg solid solution layer in which Mg is solid-solved in a Cu matrix phase is formed at a bonding interface between the copper member 12 and the ceramic member 11, and an active metal nitride layer 41 containing nitrides of one or two or more active metals selected from among Ti, Zr, Nb and Hf is formed on the ceramic member 11 side of the bonding interface. The thickness of the active metal nitride layer 41 is within the range of 0.05 μm or more and 1.2 μm or less.SELECTED DRAWING: Figure 2

The invention provides a thick copper plate double-face corrosion plate surface structure, which comprises a first copper foil, a second copper foil and a PP layer, and is characterized in that the PP layer is arranged between the first copper foil and the second copper foil; the two sides of the first copper foil and the two sides of the second copper foil are each provided with a first etching area and a second etching area, and the inner side faces of the two first etching areas are provided with a plurality of supporting pieces. According to the plate surface structure for double-sided etching of the thick copper plate provided by the invention, the supporting piece is arranged on the inner side surface of the first etching region, so that in the pressing process, the supporting piece can provide stable and uniform supporting force, the pressing pressure is effectively dispersed, the situation that the first etching region is depressed and sunken due to insufficient supporting force after a part of copper layer is removed is avoided, and the service life of the first etching region is prolonged. Therefore, the lamination alignment degree is improved, the first copper foil, the second copper foil and the PP layer are ensured to be accurately aligned, the flatness of the laminated plate surface is ensured, the problem of uneven dielectric thickness is reduced, a good foundation is provided for a subsequent etching process, and adverse effects on subsequent etching are avoided.

The embodiment of the invention relates to the technical field of PCB (Printed Circuit Board) manufacturing, in particular to a method and equipment for pressing, baking and straightening a PCB, which comprises the following steps of: obtaining bending data and board data, carrying out scientific lamination by combining a gravity coupling mechanism and a support counterforce mechanism, and carrying out pressing and baking treatment; the problems of stress unbalance and low correction precision caused by an unreasonable lamination structure in the prior art are effectively solved, the lamination structure can be scientifically designed, stress distribution and heat transfer are optimized, and the precision and stability of pressing, baking and straightening of the PCB are improved.

A metal plate of the present invention has a structure in which one surface of the metal plate has an uneven shape including a protrusion in which the metal plate protrudes toward an insulating resin member side and a recess in which the metal plate retracts from the insulating resin member side, at least one of a kurtosis Rku of contour curve at the bonded interface of the metal plate and a kurtosis Sku of contour surface at the bonded interface of the metal plate is in a range of 2.75 or more and 6.00 or less, and an overhang rate that indicates a length ratio of regions overlapping in a lamination direction in a direction along the bonded interface is 7% or more.

The invention discloses a CCD electromagnetic fusion line system and a pre-stacking method thereof, and relates to the technical field of circuit board production equipment. Comprising a rack, and a truss is arranged on the rack; the material staggered stacking, grabbing and feeding device is used for grabbing and conveying a plurality of PP plates which are sequentially stacked in a staggered mode from top to bottom. The CCD alignment table is used for aligning the PP plate and the core plate which are respectively grabbed; the fusing table is used for alternately stacking the aligned PP plates and core plates and fusing the stacked PP plates and core plates; the board collecting table is used for grabbing and stacking the fused PP boards and the core boards; the material staggered stacking, grabbing and feeding device, the CCD alignment table, the fusing table and the plate collecting table are sequentially arranged on the rack. The method has the advantages that the short circuit phenomenon of the circuit board can be avoided, and the fusion efficiency is improved.

Examples are disclosed that relate to printed circuit board (“panel”) arrangements for vertical power delivery from voltage regulators to an integrated electronic device mounted to the circuit board arrangement. One disclosed example assembly comprises a base power panel, a raised power panel mounted to the base power panel, a signal panel mounted to the base power panel such that a surface of the signal panel is generally flush with a surface of the raised power panel, and an integrated electronic device mounted to the raised power panel and the signal panel.

The present invention provides a manufacturing method of a printed wiring board which can improve the stain removal and reduce the roughness of the surface of the insulating layer. The manufacturing method of the printed wiring board comprises the following first to fifth processes in order: In the first process, a resin sheet is prepared, which comprises a support, a release layer, and a resin composition layer in order; in the second process, the resin composition layer is laminated with a substrate; in the third process, the resin composition layer is cured; in the fourth process, the support is peeled off to obtain an intermediate multilayer body, which comprises the substrate, the resin composition layer, and at least a part of the release layer in order; and in the fifth process, an oxidizing agent is contacted with the surface of the release layer side of the intermediate multilayer body.

The embodiment provides a soft and hard combined plate transition area height difference control method and device, a first initial size of a soft plate area CVL layer is acquired; a second initial size of a hard plate area is acquired; an initial stagger size is calculated according to the first initial size and the second initial size; application scene parameters corresponding to the soft and hard combined plate are acquired; the initial stagger size is adjusted according to the application scene parameters to obtain a characteristic stagger size; a cutting operation is performed on the soft plate area CVL layer or the hard plate area according to the characteristic stagger size; the soft plate area CVL layer or the hard plate area after the cutting operation is completed is staggered and attached, and a preset operation is performed to obtain a soft and hard combined plate; the CVL stagger design reduces the height difference, reduces the use of CVL, reduces the material use cost, reduces the product scrap material waste, different stagger lengths are set according to different product application scenes, and the production efficiency is improved.

The application provides a thick copper winding coil circuit board manufacturing method, which comprises the following steps: first, a through-hole metalization manufacturing is performed on an inner core plate; after inner photo-etching is performed on the inner core plate, high-temperature pressing is performed through a pressing formula; after pressing, controlled depth drilling is performed according to the conduction requirement; then, metalization manufacturing is performed to realize controlled depth hole conduction; after inner photo-etching is performed, high-temperature pressing is performed through a pressing formula to fill the controlled depth hole and increase the number of electroplated plate layers. The application is not limited by the number of electroplated plate layers and the thickness of copper, and can improve quality defects such as expansion and shrinkage deviation, and can realize mass production.

A control method for improving the quality of a cross-sectional hole, the control method comprising: first preparing, on the basis of the size of a cross-sectional hole to be filled, a high-Tg prepreg matching the cross-sectional hole in terms of size, and filling the cross-sectional hole with the high-Tg prepreg, such that a surface of the high-Tg prepreg is flush with a surface of a circuit board. Multiple laminations can be performed by using the heat resistance of the high-Tg prepreg; after actual operation verification, the condition of a laminated surface is not defective, and no bubbles or local delamination occur on an electroplated product board; and after electroplating, the problem of liquid medicine seepage does not occur, so that the manufacturing process is not affected, and the production quality of the circuit board is effectively improved. By means of matching the size of the high-Tg prepreg with that of the cross-sectional hole to be filled, only the high-Tg prepreg needs to be plugged into the cross-sectional hole during filling, so that operation is simple, and the convenience of filling the cross-sectional hole with the high-Tg prepreg is improved.

The invention provides a multilayer circuit board press-fit processing device with precise positioning, which comprises a bottom plate, supporting rods are fixedly mounted on the periphery of the top of the bottom plate, and top plates are fixedly mounted on the tops of the four supporting rods; the driving telescopic rod is fixedly mounted at the top of the top plate; and the pressing assembly is arranged at the moving end of the driving telescopic rod. According to the multi-layer circuit board press-fit processing device with the precise positioning function, through mutual cooperation of structures such as the press-fit assembly, the pushing assembly, the clamping assembly and the placing assembly, when the device is used, the press-fit assembly pushes the assembly to move downwards, so that the pushing assembly pushes a fixing plate to move downwards synchronously, and the pressing efficiency of the multi-layer circuit board is improved. When the circuit board is pressed, the pull rope, the moving block and the clamping plate of the clamping assembly are driven to gather and clamp the circuit board from the four sides, accurate positioning is achieved, circuit board sliding and positioning deviation in the pressing process are avoided, and the production efficiency and the productivity are improved.