89results about "Circuit lamination" patented technology

The invention belongs to the technical field of circuit boards, and discloses a composite pressing process of a high multilayer rigid-flex circuit board, which comprises the following steps: performing microstructure processing on the surface of a rigid base material to form a three-dimensional reinforced interface, and performing chemical grafting modification treatment on a flexible base material to generate a multilayer pretreated substrate; identifying the positioning mark of each layer of substrate through an optical positioning system, establishing a lamination stress prediction model in combination with the thermodynamic parameters of the material, and outputting a lamination configuration scheme containing an interlayer matching relationship; placing the configured laminated structure in a multi-temperature-zone press, and executing a three-stage gradient heating and pressurizing program to realize interface fusion between adjacent layers of substrates; monitoring an interlayer deformation difference value of the substrate in real time through a sensing network, and eliminating the deformation difference to obtain a press-fit molded circuit substrate; through heterogeneous interface strengthening design, multi-physical field cooperative pressing and real-time deformation compensation, accurate interface fusion and low-warpage forming of the high-multilayer rigid-flex circuit board are realized.

A method for producing a core substrate for wiring boards, which includes hot pressing an intermediate base material including a fiber base material and a thermosetting resin composition impregnated into the fiber base material, thereby forming a core substrate having a core portion having a first main surface and a second main surface on the rear side of the first main surface, the core portion including the fiber base material and an insulating resin layer that is the cured or semi-cured thermosetting resin composition; and planarizing at least one surface of the first main surface or the second main surface, thereby forming a flat surface.

The invention discloses an IC carrier plate vacuum hot pressing device and method, and relates to the technical field of vacuum hot pressing, the IC carrier plate vacuum hot pressing device comprises a sealed hot pressing bin, two angle-adjustable hot pressing tables installed in the sealed hot pressing bin, a lower heating unit arranged below the hot pressing tables, and a liftable upper heating unit arranged above the hot pressing tables, vertical supports are arranged on the two sides of the hot-pressing table respectively, two moving grooves corresponding to the side edges of the adjacent hot-pressing table in position are formed in the vertical supports, moving wheels capable of sliding horizontally are arranged in the moving grooves, and second belt wheels are arranged between the moving wheels and the side edges of the adjacent hot-pressing table. A first belt pulley is arranged on the vertical support located above the hot pressing table, and the upper heating unit comprises a winder arranged on the first belt pulley away from the vertical support and an upper electric heater connected with the winder through a traction rope. And the stability of the temperature to the to-be-hot-pressed material of the IC support plate in the hot pressing process is ensured.

The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board alignment device and method.The printed circuit board alignment device comprises a base, a working cover is fixedly arranged at the top of the base, a hydraulic cylinder is fixedly inserted into the top of the working cover, the extending end of the hydraulic cylinder is fixedly connected with an upper template, and a positioning mechanism used for fixing a copper foil is arranged on one side of the upper template; a leveling mechanism for straightening the copper foil is arranged on the other side of the upper template; one end of a copper foil on a flat plate is pressed and fixed through a second rubber strip, the extension end of a first air cylinder is controlled to extend, a turnover frame is turned over, then the extension end of a second air cylinder is controlled to extend, and a pressing wheel provides thrust to the end, away from the first rubber strip, of a rotating rod, so that the rotating rod rotates; and the copper foil is straightened and leveled through cooperation of the second rubber strip and the first rubber strip, so that flatness of the copper foil is guaranteed, and the condition of wrinkles is prevented.

The invention relates to the technical field of circuit board slicing, and particularly discloses a control method for improving slice hole quality, which comprises the following steps: preparing a high Tg prepreg matched with a slice hole in size according to the size of the slice hole to be filled, and filling the slice hole by using the high Tg prepreg to enable the high Tg prepreg to be flush with the surface of a line-in-line board, by utilizing the heat resistance of the high-Tg prepreg, multiple lamination can be carried out, and after actual operation verification, the laminated surface condition is not bad, an electroplated product board does not have bubbles and local layering, the problem of liquid medicine permeation is not found after electroplating, the process manufacturing is not influenced, and the production quality of the circuit board is effectively improved; the size of the high-Tg prepreg is matched with the size of the to-be-filled slice hole, and only the high-Tg prepreg needs to be plugged into the slice hole during filling, so that the operation is simple, and the filling convenience of the high-Tg prepreg and the slice hole is improved.

The invention discloses a stacking device and a circuit board hot melting production machine, and the stacking device comprises a mounting rack which can lift and translate to move and stack materials; the material taking mechanism is mounted on the mounting frame and comprises a rotating frame, a material sucking assembly and a material pressing assembly, the material sucking assembly and the material pressing assembly are arranged on the rotating frame, and the rotating frame is connected with the mounting frame and used for driving the to-be-stacked products to horizontally rotate so as to be aligned; and the detection mechanism is mounted on the mounting frame and comprises a CCD detector and a translation assembly used for driving the CCD detector to translate, and the translation assembly is connected with the mounting frame. According to the stacking device and the circuit board hot melting production machine, materials can be conveniently stacked in an aligned mode, and repeated adjustment caused by specification changes is reduced.

The embodiment of the application discloses a method for improving the thickness uniformity of a PCB (Printed Circuit Board), which comprises the following steps: preparing a substrate and a prepreg to be fused, alternately and overlappingly placing the substrate and the prepreg to obtain a PCB to be fused, arranging a hot-melt block between the substrate and the prepreg of the PCB to be fused, the hot-melt block having a copper grid structure, placing the PCB to be fused with the hot-melt block arranged thereon on a processing platform of a hot-melt machine, starting the hot-melt machine, heating the hot-melt block, and pressing the PCB to be fused to obtain a fused PCB. The hot-melt block with the copper grid structure is arranged between the substrate and the prepreg of the PCB to be fused, and then the PCB to be fused is heated and pressed, so that the hot-melt block area is uniformly heated, and then the thickness of the produced PCB is uniform, and it is not easy to form wrinkles, and the probability of the PCB being scrapped is reduced.

The joint body of the present invention has a structure formed by joining an insulating resin part made of insulating resin and a metal part made of metal, wherein the joining interface between the insulating resin part and the metal part is in a concave-convex shape with convex portions and concave portions, wherein the convex portion is formed by the metal part protruding toward the insulating resin part side, and the concave portion is formed by the metal part retreating from the insulating resin part side, at least one of the kurtosis Rku of the contour curve at the joining interface of the metal part and the kurtosis Sku of the contour surface at the joining interface of the metal part is within the range of greater than 2.75 and less than 6.00, and the overhang rate of the metal part is greater than 7%, and the overhang rate represents the length ratio of the area overlapping the stacking direction in the direction along the joining interface.

Power module comprising a power semiconductor die and at least one substrate comprising an insulating layer in contact with a metallized connection surface of said die and at least one conductive path on a conductive layer on a face of the insulating layer opposite to the metallized connection surface of the die and wherein said insulating layer comprises vias filled with conductive material to provide connecting pads between said metallized connection surface of said die and said conductive path, and wherein said vias are arranged with a decreasing density from at least one hot spot position of said metallized connection surface when the die is in operation to a peripheral area of said metallized connection surface.

The invention discloses a full-automatic four-head high-speed laminating device, and relates to the technical field of flexible circuit board processing, the full-automatic four-head high-speed laminating device comprises a device body, the device body is fixedly connected with a mounting seat, and the mounting seat is fixedly connected with a fixing frame; the positions, located on the two sides of the fixing frame, of the mounting base are both slidably connected with lifting mechanisms used for supporting the reinforcing pieces, the bottom end of the fixing frame is fixedly connected with a suction mechanism, and the suction mechanism is slidably connected with a rolling mechanism used for pressing the reinforcing pieces. According to the invention, the lifting mechanism is arranged to support the reinforcing sheet when the absorbing mechanism absorbs the reinforcing sheet, so that the reinforcing sheet is prevented from falling off in the moving process, and the situation of missing mounting is avoided; and the arranged rolling mechanism rolls the reinforcing sheet, so that the reinforcing sheet can be more firmly mounted, and the mounting effect is improved.

The invention discloses a pressing process based on a novel air bag pressing structure and a pressing machine, and aims to provide the pressing process based on the novel air bag pressing structure, which is uniform in pressure and high in finished product quality. The method comprises the following steps: (1) feeding; (2) low-pressure air inflation: low-pressure air is inflated into an air inlet of the novel air bag pressing structure, so that the middle part of the air bag bulges downwards under the action of self weight and the low-pressure air; (3) exhausting: the upper pressing mechanism drives the novel air bag pressing structure to move downwards, the raised part in the middle of the air bag firstly makes contact with the middle position of the upper surface of the to-be-pressed FPC, then the upper pressing mechanism continues to move downwards, the air bag gradually covers and presses the to-be-pressed FPC from the middle position of the upper surface of the to-be-pressed FPC to the edge, and then the to-be-pressed FPC is pressed. Until the upper press-fit mechanism and the lower press-fit mechanism are completely closed; (4) pressing; and (5) blanking. The flexible circuit board pressing mechanism is applied to the technical field of flexible circuit board pressing mechanisms.

The invention relates to the field of flexible circuit board manufacturing, and provides a preparation method for improving interlayer layering and warping of a bending area of a flexible circuit board. The method comprises the following steps: determining the width of a non-adhesive region of a bending region of the flexible circuit board based on analysis of bending stress distribution; the method comprises the following steps: replacing an adhesive-free electrolytic copper foil used by a base material in a bending area with an adhesive-free rolled copper foil, and utilizing a grain structure which is formed by the rolled copper foil due to a rolling process and is internally compact and axially arranged; manufacturing a flexible circuit board, and manufacturing a non-glue area in a bending area of the flexible circuit board according to the determined width of the non-glue area; carrying out press-fit encapsulation, and carrying out overall press-fit on the flexible circuit board with the manufactured non-glue area; cutting the laminated and encapsulated flexible circuit board into single pieces by adopting high-precision laser cutting equipment; and carrying out a bending test, carrying out bending operation on the flexible circuit board which is cut into the single pieces, and verifying the bending effect and the improvement condition of the warping problem.

The invention relates to the technical field of printed circuit boards, and discloses a metal-based multi-layer PCB and a manufacturing method thereof, and the manufacturing method of the metal-based multi-layer PCB comprises the steps: providing a metal substrate which is provided with a first side and a second side, and comprises a molding region; manufacturing a first blind groove in the forming area from the first side; sequentially stacking a first filling assembly and a daughter board on the first side; pressing the metal substrate, the first filling assembly and the daughter board together; manufacturing a second blind groove in the forming area from the second side; stacking a second filling assembly on the second side; and pressing the metal substrate and the second filling assembly together. The metal-based multi-layer PCB and the manufacturing method thereof provided by the invention are used for solving the problems that the metal substrate is seriously warped due to stress release of the metal substrate after the two sides of the metal substrate are etched and then filled with resin, and the resin is easy to break due to the fact that the resin needs to be filled and cured for multiple times in the related technology. And the resin cured for multiple times also has the problem of chromatic aberration.

The present application belongs to the technical field of printed wiring board, and particularly relates to a soft and hard combination board with multiple layers of soft board and a processing technology for ultra-fine lines in the bending area, which comprises the following steps: preparing multiple soft boards and respectively making lines and pasting cover films; preparing adhesive materials and opening windows; superimposing and pressing the soft boards and the adhesive materials; making drill holes and plating copper for the pressed multiple-layer board, then making ultra-fine lines in the bending area and pasting cover films; processing protection films in the bending area of the multiple-layer board; preparing semi-cured adhesive sheets and opening windows in the bending area, and superimposing and pressing the semi-cured adhesive sheets with the multiple-layer board; making drill holes, plating copper, lines, and removing the protection films; processing protection films in the bending area of the multiple-layer board; preparing semi-cured adhesive sheets and opening windows in the bending area, and superimposing and pressing the semi-cured adhesive sheets; making drill holes, plating copper, lines, and removing the protection films, and producing to finished products; the present application can not only reduce the height difference of the soft board, but also ensure the flatness of the board surface, and can process ultra-fine lines in the bending area of the soft board.

The present invention is directed to provide novel laminates for wiring boards. Novel laminates for wiring boards according to the present invention includes an insulating substrate layer and copper wiring, the laminate having a circuit linearity of 1.0 or more and 1.7 or less.

The present invention relates to a printed circuit board for a battery pack capable of measuring temperature and a method for manufacturing same. The printed circuit board for a battery pack according to the present invention, capable of measuring temperature and provided in a battery pack including a plurality of secondary batteries, includes: a film; a conductive pattern provided on a first portion of the film; and a temperature element provided on a second portion of the film and measuring the temperature inside the battery pack.

A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.

An electronic apparatus includes: an electronic component; a substrate including a first layer at which the electronic component and a first ground pattern are disposed, and a second layer at which a second ground pattern is disposed; and a case which is in contact with the first ground pattern, covers the electronic component, reduces magnetic noise, and is fixed to the substrate, and plural conductors connecting the first ground pattern and the second ground pattern are disposed along a portion of the first ground pattern, the portion being in contact with the case.

A laminated structure includes metal tracks. In a method for making, a first layer of a first dielectric material is deposited on a substrate. One or more openings are then made in the first layer. A second dielectric material is then deposited within the openings formed in the first layer. The second dielectric material has dielectric properties distinct from the dielectric properties of the first dielectric material.

To provide: a copper / ceramic assembly which is capable of suppressing the generation of cracks of a ceramic member even if a severe cold heat cycle is loaded, and also which is excellent in migration resistance; an insulated circuit board; a method for producing a copper / ceramic assembly; and a method for producing an insulated circuit board.SOLUTION: There is provided a copper / ceramic assembly in which a copper member 12 comprising copper or a copper alloy is bonded to a ceramic member 11 comprising a nitrogen-containing ceramic. A Mg solid solution layer in which Mg is solid-solved in a Cu matrix phase is formed at a bonding interface between the copper member 12 and the ceramic member 11, and an active metal nitride layer 41 containing nitrides of one or two or more active metals selected from among Ti, Zr, Nb and Hf is formed on the ceramic member 11 side of the bonding interface. The thickness of the active metal nitride layer 41 is within the range of 0.05 μm or more and 1.2 μm or less.SELECTED DRAWING: Figure 2

The invention relates to the technical field of circuit boards, in particular to a manufacturing process of an ultrathin printed circuit board for a Mini LED. The problems that the printed circuit board for the Mini LED is not light and thin enough and poor in quality are solved. The size stability of the circuit board is improved by changing the baking temperature and the baking time and using a lamination technology combining vacuum hot pressing and a flexible mold; the wettability of the surface of the circuit board is enhanced by changing process parameters of low-temperature plasma treatment, and a good welding joint is formed; by preparing the solder resist ink, the acid and alkali resistance, the yellowing resistance and the reflectivity of the prepared circuit board are improved; ultrasonic assistance is introduced in the drilling process, the pulse laser power of micro-etching treatment is changed, and the bonding welding spot quality of the circuit board is improved; by using plasma pretreatment, the copper deposition temperature, the copper deposition time and the current density during copper deposition are controlled, and the manufactured circuit board is lighter and thinner, so that the quality of the circuit board is comprehensively improved.

The invention provides a thick copper plate double-face corrosion plate surface structure, which comprises a first copper foil, a second copper foil and a PP layer, and is characterized in that the PP layer is arranged between the first copper foil and the second copper foil; the two sides of the first copper foil and the two sides of the second copper foil are each provided with a first etching area and a second etching area, and the inner side faces of the two first etching areas are provided with a plurality of supporting pieces. According to the plate surface structure for double-sided etching of the thick copper plate provided by the invention, the supporting piece is arranged on the inner side surface of the first etching region, so that in the pressing process, the supporting piece can provide stable and uniform supporting force, the pressing pressure is effectively dispersed, the situation that the first etching region is depressed and sunken due to insufficient supporting force after a part of copper layer is removed is avoided, and the service life of the first etching region is prolonged. Therefore, the lamination alignment degree is improved, the first copper foil, the second copper foil and the PP layer are ensured to be accurately aligned, the flatness of the laminated plate surface is ensured, the problem of uneven dielectric thickness is reduced, a good foundation is provided for a subsequent etching process, and adverse effects on subsequent etching are avoided.

The present application discloses a circuit board and a manufacturing method thereof. The manufacturing method of the circuit board includes: preparing two sub-boards, and forming a first conductive layer on the first side of at least one sub-board; opening a first through-hole on the first side of the sub-board and electroplating to form a first conductive hole, and the first conductive hole electrically connects the first conductive layer and at least one conductive circuit layer; laminating and fixing the two sub-boards to form a mother board, wherein the opposite sides of the mother board are respectively the first sides of the corresponding sub-boards; covering a protective layer on the opposite side surfaces of the mother board, and the protective layer partially covers the first conductive hole; opening a first slot on the protective layer to expose the first side of the corresponding sub-board from the first slot; forming a second through-hole penetrating the mother board at the position of the first slot, and the second through-hole communicates along the direction of penetrating the opposite sides of the mother board; electroplating the first through-hole to form a second conductive hole, and the second conductive hole is connected to the first conductive layer to electrically connect at least two specified conductive circuit layers on the mother board; removing the protective layer.

The invention discloses a method for solving LDI cross-layer alignment, relates to a multi-layer PCB preparation process, and provides a scheme for solving the problem of short circuit caused by layer deviation in the prior art. Before each daughter board is laminated, the alignment PAD is preset in the secondary inner layer circuit; a positioning copper sheet for indicating the position of the counterpoint PAD is arranged in the outermost layer of circuit; all the daughter boards are pressed into a whole; when a graphical window needs to be punched, firstly, material removal is carried out at the corresponding position of the positioning copper sheet until the counterpoint PAD is exposed; and carrying out windowing work by using an LDI exposure machine according to the alignment PAD. The method has the advantages that the alignment PAD and the effective part of the secondary inner layer circuit synchronously deviate, so that windowing can be accurately carried out according to the alignment PAD no matter which direction the secondary inner layer circuit deviates and no matter how much the deviation value is, and the corresponding circuit cannot be broken down. The short circuit phenomenon caused by the layer deviation problem is completely avoided, and the waste plate rate is effectively reduced.

A transparent article has a transparent laminating film; and an electrically-conductive, metal-containing pattern disposed over a surface of the transparent laminating film. The electrically-conductive, metal-containing pattern has a metallic pattern comprising a first surface facing the transparent laminating film and an opposing second surface. Such articles can be prepared using steps A) and B′), in order: A) providing a metallic pattern on a surface of a first substrate; and B′) transferring the metallic pattern to a surface of a second substrate, thereby providing an electrically-conductive metal-containing pattern on the surface of the second substrate, wherein the second substrate is a transparent laminating film.

The present invention provides a lamination method for realizing a base depression in a specific BGA area of ​​a PCB, wherein a mold is used to perform total lamination together with a PCB to be pressed, and a base depression is formed at a specific position on the PCB to be pressed where a BGA area is to be formed, which is used to carry BGA components in the future, thereby reducing the probability of desoldering and pulling after the BAG components are installed on the PCB, and reducing the influence of the board bending phenomenon on the connection and installation of the BGA components and the PCB board surface. Furthermore, in the lamination method provided by the present invention, during hot pressing, the mold and the PCB to be pressed are arranged in a group, and a buffer structure is synchronously and fully arranged on both sides of the mold and the PCB to be pressed, forming a symmetrically arranged stacked plate structure, thereby avoiding uneven pressure and temperature conduction on the surface of the PCB to be pressed due to the convex structure arranged on the mold during pressing, aggravating the problem of board bending of the PCB to be pressed during the pressing process, improving the stability of pressing, and improving the precision and reliability of pressing and manufacturing of the PCB to be pressed.

To provide an insulating material for a circuit substrate, which has excellent dielectric characteristics in a high frequency area, has low coefficients of linear expansion all in a MD direction, a TD direction, and a ZD direction, is easily manufactured and has excellent productivity, and a method for manufacturing the same and a metal foil-clad laminate.SOLUTION: An insulating material for a circuit substrate, comprising a laminate having a thermoplastic liquid crystal polymer film and a woven fabric of an inorganic fiber, wherein the thermoplastic liquid crystal polymer film contains an inorganic filler, and the laminate is a dry laminate in which the thermoplastic liquid crystal polymer film and the woven fabric are thermocompression bonded.SELECTED DRAWING: Figure 1

A circuit board module includes a first circuit board, a second circuit board and a connection layer. The first circuit board includes two first conductive layers, a first dielectric core layer and a first conductive via, the first dielectric core layer is formed between the two first conductive layers, and the first conductive via connects the two first conductive layers. The second circuit board includes two second conductive layers, a second dielectric core layer and a second conductive via, the second dielectric core layer is formed between the two second conductive layers, and the second conductive via connect the two second conductive layers. The connection layer is formed between the first circuit board and the second circuit board and combines the first circuit board with the second circuit board. The second circuit board is disposed on a side of the first circuit board.

Provided is a novel modified fluororesin material having a low linear expansion coefficient, a material for a circuit board, a laminate for a circuit board, a circuit board, and a method for producing the modified fluororesin material. The modified fluororesin material contains a modified fluororesin. The modified fluororesin contains a tetrafluoroethylene unit, a modifying monomer unit based on a modifying monomer copolymerizable with tetrafluoroethylene, and a tertiary carbon atom. The tertiary carbon atom is present in an amount of 0.001 to 0.100 mol% of a total amount of the tetrafluoroethylene unit and the modifying monomer unit. The modified fluororesin material has a linear expansion coefficient at 20°C to 200°C that is 5% or more lower than that of a non-modified fluororesin material. The non-modified fluororesin material contains a tetrafluoroethylene unit and a modifying monomer unit based on a modifying monomer copolymerizable with tetrafluoroethylene and containing no tertiary carbon atom.