65results about "Circuit lamination" patented technology

The invention belongs to the technical field of circuit boards, and discloses a composite pressing process of a high multilayer rigid-flex circuit board, which comprises the following steps: performing microstructure processing on the surface of a rigid base material to form a three-dimensional reinforced interface, and performing chemical grafting modification treatment on a flexible base material to generate a multilayer pretreated substrate; identifying the positioning mark of each layer of substrate through an optical positioning system, establishing a lamination stress prediction model in combination with the thermodynamic parameters of the material, and outputting a lamination configuration scheme containing an interlayer matching relationship; placing the configured laminated structure in a multi-temperature-zone press, and executing a three-stage gradient heating and pressurizing program to realize interface fusion between adjacent layers of substrates; monitoring an interlayer deformation difference value of the substrate in real time through a sensing network, and eliminating the deformation difference to obtain a press-fit molded circuit substrate; through heterogeneous interface strengthening design, multi-physical field cooperative pressing and real-time deformation compensation, accurate interface fusion and low-warpage forming of the high-multilayer rigid-flex circuit board are realized.

A method for producing a core substrate for wiring boards, which includes hot pressing an intermediate base material including a fiber base material and a thermosetting resin composition impregnated into the fiber base material, thereby forming a core substrate having a core portion having a first main surface and a second main surface on the rear side of the first main surface, the core portion including the fiber base material and an insulating resin layer that is the cured or semi-cured thermosetting resin composition; and planarizing at least one surface of the first main surface or the second main surface, thereby forming a flat surface.

The invention relates to the technical field of circuit board slicing, and particularly discloses a control method for improving slice hole quality, which comprises the following steps: preparing a high Tg prepreg matched with a slice hole in size according to the size of the slice hole to be filled, and filling the slice hole by using the high Tg prepreg to enable the high Tg prepreg to be flush with the surface of a line-in-line board, by utilizing the heat resistance of the high-Tg prepreg, multiple lamination can be carried out, and after actual operation verification, the laminated surface condition is not bad, an electroplated product board does not have bubbles and local layering, the problem of liquid medicine permeation is not found after electroplating, the process manufacturing is not influenced, and the production quality of the circuit board is effectively improved; the size of the high-Tg prepreg is matched with the size of the to-be-filled slice hole, and only the high-Tg prepreg needs to be plugged into the slice hole during filling, so that the operation is simple, and the filling convenience of the high-Tg prepreg and the slice hole is improved.

The invention discloses a stacking device and a circuit board hot melting production machine, and the stacking device comprises a mounting rack which can lift and translate to move and stack materials; the material taking mechanism is mounted on the mounting frame and comprises a rotating frame, a material sucking assembly and a material pressing assembly, the material sucking assembly and the material pressing assembly are arranged on the rotating frame, and the rotating frame is connected with the mounting frame and used for driving the to-be-stacked products to horizontally rotate so as to be aligned; and the detection mechanism is mounted on the mounting frame and comprises a CCD detector and a translation assembly used for driving the CCD detector to translate, and the translation assembly is connected with the mounting frame. According to the stacking device and the circuit board hot melting production machine, materials can be conveniently stacked in an aligned mode, and repeated adjustment caused by specification changes is reduced.

The embodiment of the application discloses a method for improving the thickness uniformity of a PCB (Printed Circuit Board), which comprises the following steps: preparing a substrate and a prepreg to be fused, alternately and overlappingly placing the substrate and the prepreg to obtain a PCB to be fused, arranging a hot-melt block between the substrate and the prepreg of the PCB to be fused, the hot-melt block having a copper grid structure, placing the PCB to be fused with the hot-melt block arranged thereon on a processing platform of a hot-melt machine, starting the hot-melt machine, heating the hot-melt block, and pressing the PCB to be fused to obtain a fused PCB. The hot-melt block with the copper grid structure is arranged between the substrate and the prepreg of the PCB to be fused, and then the PCB to be fused is heated and pressed, so that the hot-melt block area is uniformly heated, and then the thickness of the produced PCB is uniform, and it is not easy to form wrinkles, and the probability of the PCB being scrapped is reduced.

Power module comprising a power semiconductor die and at least one substrate comprising an insulating layer in contact with a metallized connection surface of said die and at least one conductive path on a conductive layer on a face of the insulating layer opposite to the metallized connection surface of the die and wherein said insulating layer comprises vias filled with conductive material to provide connecting pads between said metallized connection surface of said die and said conductive path, and wherein said vias are arranged with a decreasing density from at least one hot spot position of said metallized connection surface when the die is in operation to a peripheral area of said metallized connection surface.

The invention relates to the field of flexible circuit board manufacturing, and provides a preparation method for improving interlayer layering and warping of a bending area of a flexible circuit board. The method comprises the following steps: determining the width of a non-adhesive region of a bending region of the flexible circuit board based on analysis of bending stress distribution; the method comprises the following steps: replacing an adhesive-free electrolytic copper foil used by a base material in a bending area with an adhesive-free rolled copper foil, and utilizing a grain structure which is formed by the rolled copper foil due to a rolling process and is internally compact and axially arranged; manufacturing a flexible circuit board, and manufacturing a non-glue area in a bending area of the flexible circuit board according to the determined width of the non-glue area; carrying out press-fit encapsulation, and carrying out overall press-fit on the flexible circuit board with the manufactured non-glue area; cutting the laminated and encapsulated flexible circuit board into single pieces by adopting high-precision laser cutting equipment; and carrying out a bending test, carrying out bending operation on the flexible circuit board which is cut into the single pieces, and verifying the bending effect and the improvement condition of the warping problem.

The invention relates to the technical field of printed circuit boards, and discloses a metal-based multi-layer PCB and a manufacturing method thereof, and the manufacturing method of the metal-based multi-layer PCB comprises the steps: providing a metal substrate which is provided with a first side and a second side, and comprises a molding region; manufacturing a first blind groove in the forming area from the first side; sequentially stacking a first filling assembly and a daughter board on the first side; pressing the metal substrate, the first filling assembly and the daughter board together; manufacturing a second blind groove in the forming area from the second side; stacking a second filling assembly on the second side; and pressing the metal substrate and the second filling assembly together. The metal-based multi-layer PCB and the manufacturing method thereof provided by the invention are used for solving the problems that the metal substrate is seriously warped due to stress release of the metal substrate after the two sides of the metal substrate are etched and then filled with resin, and the resin is easy to break due to the fact that the resin needs to be filled and cured for multiple times in the related technology. And the resin cured for multiple times also has the problem of chromatic aberration.

The present application belongs to the technical field of printed wiring board, and particularly relates to a soft and hard combination board with multiple layers of soft board and a processing technology for ultra-fine lines in the bending area, which comprises the following steps: preparing multiple soft boards and respectively making lines and pasting cover films; preparing adhesive materials and opening windows; superimposing and pressing the soft boards and the adhesive materials; making drill holes and plating copper for the pressed multiple-layer board, then making ultra-fine lines in the bending area and pasting cover films; processing protection films in the bending area of the multiple-layer board; preparing semi-cured adhesive sheets and opening windows in the bending area, and superimposing and pressing the semi-cured adhesive sheets with the multiple-layer board; making drill holes, plating copper, lines, and removing the protection films; processing protection films in the bending area of the multiple-layer board; preparing semi-cured adhesive sheets and opening windows in the bending area, and superimposing and pressing the semi-cured adhesive sheets; making drill holes, plating copper, lines, and removing the protection films, and producing to finished products; the present application can not only reduce the height difference of the soft board, but also ensure the flatness of the board surface, and can process ultra-fine lines in the bending area of the soft board.

The present invention is directed to provide novel laminates for wiring boards. Novel laminates for wiring boards according to the present invention includes an insulating substrate layer and copper wiring, the laminate having a circuit linearity of 1.0 or more and 1.7 or less.

The present invention relates to a printed circuit board for a battery pack capable of measuring temperature and a method for manufacturing same. The printed circuit board for a battery pack according to the present invention, capable of measuring temperature and provided in a battery pack including a plurality of secondary batteries, includes: a film; a conductive pattern provided on a first portion of the film; and a temperature element provided on a second portion of the film and measuring the temperature inside the battery pack.

A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.

An electronic apparatus includes: an electronic component; a substrate including a first layer at which the electronic component and a first ground pattern are disposed, and a second layer at which a second ground pattern is disposed; and a case which is in contact with the first ground pattern, covers the electronic component, reduces magnetic noise, and is fixed to the substrate, and plural conductors connecting the first ground pattern and the second ground pattern are disposed along a portion of the first ground pattern, the portion being in contact with the case.

A laminated structure includes metal tracks. In a method for making, a first layer of a first dielectric material is deposited on a substrate. One or more openings are then made in the first layer. A second dielectric material is then deposited within the openings formed in the first layer. The second dielectric material has dielectric properties distinct from the dielectric properties of the first dielectric material.

To provide: a copper / ceramic assembly which is capable of suppressing the generation of cracks of a ceramic member even if a severe cold heat cycle is loaded, and also which is excellent in migration resistance; an insulated circuit board; a method for producing a copper / ceramic assembly; and a method for producing an insulated circuit board.SOLUTION: There is provided a copper / ceramic assembly in which a copper member 12 comprising copper or a copper alloy is bonded to a ceramic member 11 comprising a nitrogen-containing ceramic. A Mg solid solution layer in which Mg is solid-solved in a Cu matrix phase is formed at a bonding interface between the copper member 12 and the ceramic member 11, and an active metal nitride layer 41 containing nitrides of one or two or more active metals selected from among Ti, Zr, Nb and Hf is formed on the ceramic member 11 side of the bonding interface. The thickness of the active metal nitride layer 41 is within the range of 0.05 μm or more and 1.2 μm or less.SELECTED DRAWING: Figure 2

The invention relates to the technical field of circuit boards, in particular to a manufacturing process of an ultrathin printed circuit board for a Mini LED. The problems that the printed circuit board for the Mini LED is not light and thin enough and poor in quality are solved. The size stability of the circuit board is improved by changing the baking temperature and the baking time and using a lamination technology combining vacuum hot pressing and a flexible mold; the wettability of the surface of the circuit board is enhanced by changing process parameters of low-temperature plasma treatment, and a good welding joint is formed; by preparing the solder resist ink, the acid and alkali resistance, the yellowing resistance and the reflectivity of the prepared circuit board are improved; ultrasonic assistance is introduced in the drilling process, the pulse laser power of micro-etching treatment is changed, and the bonding welding spot quality of the circuit board is improved; by using plasma pretreatment, the copper deposition temperature, the copper deposition time and the current density during copper deposition are controlled, and the manufactured circuit board is lighter and thinner, so that the quality of the circuit board is comprehensively improved.

The invention provides a thick copper plate double-face corrosion plate surface structure, which comprises a first copper foil, a second copper foil and a PP layer, and is characterized in that the PP layer is arranged between the first copper foil and the second copper foil; the two sides of the first copper foil and the two sides of the second copper foil are each provided with a first etching area and a second etching area, and the inner side faces of the two first etching areas are provided with a plurality of supporting pieces. According to the plate surface structure for double-sided etching of the thick copper plate provided by the invention, the supporting piece is arranged on the inner side surface of the first etching region, so that in the pressing process, the supporting piece can provide stable and uniform supporting force, the pressing pressure is effectively dispersed, the situation that the first etching region is depressed and sunken due to insufficient supporting force after a part of copper layer is removed is avoided, and the service life of the first etching region is prolonged. Therefore, the lamination alignment degree is improved, the first copper foil, the second copper foil and the PP layer are ensured to be accurately aligned, the flatness of the laminated plate surface is ensured, the problem of uneven dielectric thickness is reduced, a good foundation is provided for a subsequent etching process, and adverse effects on subsequent etching are avoided.

The present application discloses a circuit board and a manufacturing method thereof. The manufacturing method of the circuit board includes: preparing two sub-boards, and forming a first conductive layer on the first side of at least one sub-board; opening a first through-hole on the first side of the sub-board and electroplating to form a first conductive hole, and the first conductive hole electrically connects the first conductive layer and at least one conductive circuit layer; laminating and fixing the two sub-boards to form a mother board, wherein the opposite sides of the mother board are respectively the first sides of the corresponding sub-boards; covering a protective layer on the opposite side surfaces of the mother board, and the protective layer partially covers the first conductive hole; opening a first slot on the protective layer to expose the first side of the corresponding sub-board from the first slot; forming a second through-hole penetrating the mother board at the position of the first slot, and the second through-hole communicates along the direction of penetrating the opposite sides of the mother board; electroplating the first through-hole to form a second conductive hole, and the second conductive hole is connected to the first conductive layer to electrically connect at least two specified conductive circuit layers on the mother board; removing the protective layer.

The present invention provides a lamination method for realizing a base depression in a specific BGA area of ​​a PCB, wherein a mold is used to perform total lamination together with a PCB to be pressed, and a base depression is formed at a specific position on the PCB to be pressed where a BGA area is to be formed, which is used to carry BGA components in the future, thereby reducing the probability of desoldering and pulling after the BAG components are installed on the PCB, and reducing the influence of the board bending phenomenon on the connection and installation of the BGA components and the PCB board surface. Furthermore, in the lamination method provided by the present invention, during hot pressing, the mold and the PCB to be pressed are arranged in a group, and a buffer structure is synchronously and fully arranged on both sides of the mold and the PCB to be pressed, forming a symmetrically arranged stacked plate structure, thereby avoiding uneven pressure and temperature conduction on the surface of the PCB to be pressed due to the convex structure arranged on the mold during pressing, aggravating the problem of board bending of the PCB to be pressed during the pressing process, improving the stability of pressing, and improving the precision and reliability of pressing and manufacturing of the PCB to be pressed.

To provide an insulating material for a circuit substrate, which has excellent dielectric characteristics in a high frequency area, has low coefficients of linear expansion all in a MD direction, a TD direction, and a ZD direction, is easily manufactured and has excellent productivity, and a method for manufacturing the same and a metal foil-clad laminate.SOLUTION: An insulating material for a circuit substrate, comprising a laminate having a thermoplastic liquid crystal polymer film and a woven fabric of an inorganic fiber, wherein the thermoplastic liquid crystal polymer film contains an inorganic filler, and the laminate is a dry laminate in which the thermoplastic liquid crystal polymer film and the woven fabric are thermocompression bonded.SELECTED DRAWING: Figure 1

A circuit board module includes a first circuit board, a second circuit board and a connection layer. The first circuit board includes two first conductive layers, a first dielectric core layer and a first conductive via, the first dielectric core layer is formed between the two first conductive layers, and the first conductive via connects the two first conductive layers. The second circuit board includes two second conductive layers, a second dielectric core layer and a second conductive via, the second dielectric core layer is formed between the two second conductive layers, and the second conductive via connect the two second conductive layers. The connection layer is formed between the first circuit board and the second circuit board and combines the first circuit board with the second circuit board. The second circuit board is disposed on a side of the first circuit board.

The application relates to the technical field of copper-clad plate processing, and discloses a copper-clad plate laminating forming system based on a multi-region independent pressurizing structure, which comprises a rack, a processing table arranged at the top of the rack, a supporting frame fixedly connected to the top of the processing table, a laminating part arranged in the supporting frame, a limiting part arranged at the top of the processing table, wherein the limiting part comprises a guide hole arranged at the top of the processing table, a limiting block slidably connected to the guide hole, a locking piece arranged in the limiting block, and an adjusting part arranged at the bottom of the processing table and used for adjusting the position of the limiting block. The copper-clad plate laminating forming system based on the multi-region independent pressurizing structure can effectively solve the problem that, in the prior art, a fixed baffle is arranged at the side edge of a processing table of a laminating device to fix raw materials, however, the side edge extrusion limiting is prone to causing uneven stress of the raw materials, and the laminating process produces deviation or wrinkles, thereby affecting the laminating effect.

The invention discloses a circuit board pressing process which comprises a material pressing table, a base and a supporting frame. In the using process of the circuit board pressing process, a first electric rotating shaft is driven to rotate a first calibration roller of a part of a movable arm to be close to one side of the edge of a board layer; then an electric rotating shaft III is driven to drive a calibration roller II to rotate and unfold, so that the calibration roller II is close to the other side of the edge of the plate layer, the calibration roller I and the calibration roller II in each group of vertical column areas can synchronously calibrate the edge of the plate in the X-axis direction and the Y-axis direction, and heat is supplied and transmitted by driving a heat supply high-temperature gas bin I; heat output by the first heat supply high-temperature gas bin enters the hot pressing bin, the part of heat gas is guided by a gas fan arranged in the backflow gas bin in the injection direction, and the heat gas is circularly injected to the area of the top pressing plate under the guide of cooperation of an airflow guide plate and the built-in gas fan, so that the top pressing plate is preheated; the heat can be effectively supplied to the top layer part of the board group material, and the hot pressing treatment effect of the circuit board is ensured.

TITLE: Device with a laminated structure and method for manufacturing a laminated structure comprising dielectric layers The present description relates to a method for manufacturing a laminated structure (100) comprising one or more metal tracks, the method comprising: depositing on a substrate (104) a first layer of a first dielectric material (106); forming one or more openings (108) in the first layer; and depositing a second dielectric material (112), with dielectric properties distinct from the dielectric properties of the first dielectric material, at the location of the openings made in the first layer. Figure for abstract: Fig. 1A

A pre-packaged chip includes a chip having at least one electrical top contact at a top side of the chip and at least one electrical bottom contact at a bottom side, a first laminate layer on the top side, a second laminate layer on the bottom side, the first laminate layer and the second laminate layer being laminated together to sandwich the chip therebetween, a first metal layer on the first laminate layer and electrically contacted to the at least one electrical top contact via at least one top contact hole through the first laminate layer, and a second metal layer on the second laminate layer and electrically contacted to the at least one electrical bottom contact via at least one bottom contact hole through the second laminate layer. The pre-packaged chip is free from any contact hole extending from the first metal layer to the second metal layer.

The invention discloses an RFPC and a manufacturing method thereof. The manufacturing method comprises the following steps: performing drilling, black hole treatment, electroplating, dry film attachment treatment, pattern exposure and DES treatment on a flexible copper-clad plate in inner layer manufacturing to form an inner conductive layer; carrying out oil printing, exposure, development and curing treatment on the inner conductive layer to form a covering layer; the method comprises the following steps of: attaching EMI (Electro-Magnetic Interference) with a PI (Polyimide) insulating layer to the middle part of a covering layer, carrying out hot pressing treatment on RFPC (Radio Frequency Poly Carbonate) attached with the EMI, then removing a release film of the EMI, and finally carrying out thermocuring treatment on the RFPC attached with an EMI film. And carrying out lamination press-fit, resistance welding, laser uncovering and gold immersion treatment on the EMI attached part. The EMI is attached to the inner layer of the RFPC in advance in the inner layer manufacturing process, the problems that due to the fact that obvious height difference exists in the structure of the RFPC after the outer layer is uncovered, local bubbles of the EMI exist, and pressing is not compact are solved, and therefore the production efficiency and the quality yield of the RFPC are improved, and the material supplementing situation caused by insufficient yield is effectively reduced.

The embodiment of the invention relates to the technical field of PCB (Printed Circuit Board) manufacturing, in particular to a method and equipment for pressing, baking and straightening a PCB, which comprises the following steps of: obtaining bending data and board data, carrying out scientific lamination by combining a gravity coupling mechanism and a support counterforce mechanism, and carrying out pressing and baking treatment; the problems of stress unbalance and low correction precision caused by an unreasonable lamination structure in the prior art are effectively solved, the lamination structure can be scientifically designed, stress distribution and heat transfer are optimized, and the precision and stability of pressing, baking and straightening of the PCB are improved.

To provide a method for manufacturing a wiring board that can suppress an occurrence of resin chipping due to cutting of a resin sheet, suppress changes in the thickness of an insulating layer even when the board undergoes processes including vacuum hot pressing, and achieve good metal foil adhesion and glass transition temperature.SOLUTION: There is provided a method for manufacturing a wiring board, including: (1) heating and laminating a resin sheet having a support and a resin composition layer provided on the support onto a substrate so that the resin composition layer of the resin sheet is bonded to the substrate; (2) peeling the support from the resin composition layer; and (3) heating and pressing a metal foil onto the resin composition layer using a vacuum hot press, in which in the above (3), a minimum melt viscosity of the resin composition layer before heat and pressure bonding is 2,000 poise to 20,000 poise when measured in a temperature range from 60°C to 200°C.SELECTED DRAWING: None

The invention discloses a high-flatness circuit board and a preparation method thereof, and belongs to the technical field of circuit board preparation, and the method comprises the steps: preparing a second layer to a penultimate layer of the circuit board, and pressing the second layer to the penultimate layer to prepare a circuit board semi-finished product; placing the prepreg, the pretreated glass, the prepreg and the copper foil on the circuit board semi-finished product from bottom to top in sequence, placing the prepreg, the pretreated glass, the prepreg and the copper foil on the lower portion of the circuit board semi-finished product from top to bottom in sequence, and then conducting pressing to obtain a circuit board finished product; the glass is embedded between the first layer and the second layer of the circuit board and between the last but one layer and the last but one layer of the circuit board, the flatness of the circuit board is improved on the upper side and the lower side, the CTE of the glass is lower than that of a traditional material of the circuit board, the warping problem of the circuit board can be further solved, high flatness can be achieved only by introducing the glass in one step, and the production cost is reduced. The method is low in process implementation difficulty, and is universal for the preparation process of all circuit boards.