Rigid-flex board with different flexible appearances and preparation method of rigid-flex board

Abstract

The invention relates to a rigid-flex board with different flexible appearances and a preparation method of the rigid-flex board. The preparation method comprises the following steps: fabricating flexible core boards, rigid core boards and prepregs; stacking all flexible core boards and rigid core boards in a set order; carrying out laminating, drilling, degumming, copper deposition, electroplating, outer line fabrication, screen-printing and resistance welding procedures; conventionally carrying out surface treatment; carrying out uncapping operation on a circuit board which is subjected to surface treatment and exposing a flexible region; and carrying out laser appearance operation on the uncapped circuit board, so as to obtain the rigid-flex board with different flexible appearances. According to the method, appearance treatment is carried out on a flexible substrate overlapping region before lamination, so that the randomness in a hierarchical structure design on the rigid-flex board can be improved; multi-branch interconnection requirements are met; multi-branch current wiring space can also be saved; the bending performance of branch circuits is met; and the space of the printed board is saved.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, in particular to a rigid-flex board with different flexible shapes and a preparation method thereof. Background technique [0002] With the continuous development of electronic products in the direction of multi-functionality, miniaturization, light weight and high performance, the requirements for miniaturization and high density of printed circuit boards are also increasing, and its products are also changing from traditional printed circuit boards to high-density Build-up printed board development. For rigid-flex boards, the rigid main board connects multiple branch rigid boards through the flexible area is also a direction of high-density development, such as figure 1 shown. [0003] The existing technology is to arrange the flexible lines of each branch side by side on a flexible core board when they are parallel; or to arrange them in layers on a multi-layer flexible cor...

AI Technical Summary

Problems solved by technology

[0003] The existing technology is to arrange the flexible lines of each branch side by side on a flexible core board when they are parallel; or to arrange them in layers on a multi-layer flexible core board. Both methods have great limitations:

[0004] (1) In the case of single-layer wiring, the flexible area where each branch converges will occupy a large area, which greatly wastes the wiring space

[0005] (2) In multi-layer wiring, the flexible part of the branch is only wired on one of the core boards, and for the convenience of production, the unwired flexible core board will also be pressed together with the branch to the rigid area, resulting in too thick a flexible area of ​​the branch line , which seriously affects the bending performance

[0006] (3) Single-layer wiring and multi-layer wiring have the same shape in the branch line convergence area, which cannot meet the installation requirements of the limited width of the flexible area

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