34results about How to "Save wiring space" patented technology

The invention relates to the technical field of rewiring structures, and discloses a preparation method of a rewiring structure and the rewiring structure, and the method comprises the steps: providing a semiconductor substrate; forming a barrier layer, a seed layer and a photoresist layer on the surface of one side of the semiconductor substrate; exposing and developing the photoresist layer to form a via hole window and a wiring window on the photoresist layer, and exposing the seed layer from the via hole window; forming a first metal layer on the seed layer exposed by the via hole window; removing part of photoresist reserved in the wiring window; forming a second metal layer on the first metal layer and the seed layer exposed by the wiring window; removing the photoresist layer, removing the seed layer and the barrier layer which are not covered by the first metal layer, and removing the seed layer and the barrier layer which are not covered by the second metal layer to form a via hole and a wiring layer; and forming a plastic package layer on the surface of one side of the semiconductor substrate to form a rewiring structure. The alignment deviation of the wiring layer and the via hole can be eliminated, so that the I / O density is improved.

The coupler assembly comprises an upper coupler and a lower coupler which are matched with each other, the bottom of a shell of the upper coupler is recessed upwards to form an accommodating cavity, a first row of pin groups and a second row of pin groups are arranged in the accommodating cavity, and the number of pins of the first row of pin groups is larger than that of pins of the second row of pin groups. The contact pins of the two rows of contact pin groups are distributed in a staggered mode to form a trapezoidal structure, wires connected with the contact pins of the second row of contact pin groups can penetrate through gaps between the contact pins of the first row of contact pin groups, and then the wires connected with the contact pins of the first row of contact pin groups extend out of the upper coupler shell on one side of the first row of contact pin groups together with the wires connected with the contact pins of the second row of contact pin groups. A wire connected with the pins of the second row of pin group can be connected with an electronic device on one side of the first row of pin group without being bent, and the phenomena of wire pressing and wire clamping easily occurring on the bent part of the wire in the coupler installation process are avoided. Without bending the lead, the probability of lead damage is reduced, and the service life of the lead is prolonged.

The invention discloses an artificial surface plasmon microstrip transmission line with a crosstalk suppression effect. The transmission line conduction band is provided with a periodic internal notch groove structure which is used for transmitting microwave artificial surface plasmons with strong local field constraint performance. The periodic notch grooves can be S-shaped, spiral, T-shaped, cross-shaped, KoCh-shaped, Moore Curve-shaped and other forms and are distributed in the microstrip conduction band, and the width of the conduction band is not increased, so that the remarkable inhibition effect that the far-end crosstalk is lower than-30dB is realized on the premise that the size of the microstrip line is not changed. The microstrip transmission line has the low-pass characteristic, the frequency response falling edge is steep, the cut-off frequency can be flexibly adjusted by adjusting the notch groove width and the number of iterations, and application requirements of different frequency bands can be met by scaling. The structure is simple, the size is compact, inter-line crosstalk can be effectively suppressed, the signal transmission quality is improved, the strict signal integrity requirement is met, and the high-frequency and high-speed signal transmission and functional devices are widely applied, and the wide application prospect is achieved.

The invention provides a connecting wire harness for a vehicle and a vehicle, and relates to the technical field of automobile wire harnesses, the connecting wire harness for the vehicle comprises a flat main wire formed by an FFC or an FPC, a part of the area of the flat main wire is divided into a plurality of flat branch wires, the plurality of flat branch wires are folded towards one side of the flat main wire, and the flat main wire is connected with the FFC or the FPC. One end of each flat wire harness is provided with a connector used for being connected with an electric appliance assembly in an automobile, and the other end of each flat wire harness is connected with the corresponding flat branch wire. According to the connecting wire harness for the vehicle, the problems that in the prior art, wires on the interior trim of the vehicle roof are difficult to arrange, the weight of the wire harness is large, and the gluing amount is large are solved.

The invention relates to the technical field of Ethernet, and relates to a pluggable EtherCAT device and a bus expansion system. The pluggable EtherCAT device comprises an EtherCAT coupler and an IO module group, the IO module group comprises at least one IO module, the EtherCAT coupler is used for being electrically connected with a master station module through a first bus, a signal output interface of the EtherCAT coupler is connected with a signal input interface of a first IO module of the IO module group in a pluggable mode, when the IO module group comprises at least two IO modules, all the IO modules are arranged in a cascade mode, and the IO modules are connected with the signal input interface of the first IO module of the IO module group in a pluggable mode. The signal output interface of the previous IO module is in pluggable connection with the signal input interface of the next IO module, and the EtherCAT coupler is used for sequentially transmitting data frames through the cascaded IO modules. The IO module can be flexibly configured according to the requirements of an industrial site, and the expansibility is high.

The embodiment of the invention provides a current monitoring circuit and method, a power supply chip, a storage medium, electronic equipment and a program product, and the circuit comprises a plurality of power supply circuits which respectively supply power to a plurality of groups of memory modules included in a server, an amplifier and the power supply chip, the non-reverse input end of the amplifier is connected with the current inlet end of each first voltage divider included in the multiple power supply circuits through a first monitoring link, the reverse input end of the amplifier is connected with the current outlet end of each first voltage divider through a second monitoring link, and the output end of the amplifier is connected with the power supply chip. The power supply chip is used for monitoring current of the plurality of power supply circuits; the multiple groups of memory modules are distributed on multiple sides of a central processing unit included in the server, in any power supply circuit, the current inlet end of the first voltage divider is connected with input voltage, and the current outlet end of the first voltage divider is connected with one group of memory modules.

The utility model provides a forward and reverse junction box applied to an electromagnetic pushing system, comprising a box body and a box cover, the box body is respectively provided with a forward wiring hole and a reverse wiring hole; a wiring terminal is arranged in the box body; the wire tube is connected with the forward wiring hole or the reverse wiring hole; an electric wire in the electric wire tube is connected with the wiring end through the forward wiring hole or the reverse wiring hole; the box body is detachably connected with the box cover; a sealing part is arranged at the joint of the box cover and the box body; according to the utility model, the forward and reverse wiring holes are arranged, so that the space can be reduced during wiring, wires can be locked, and left and right reversing is facilitated; and the box body and the box cover are in threaded connection, and the sealing rings are arranged at the clamping grooves where the box body and the box cover are combined, so that water vapor cannot permeate. The use scene of the junction box is widened, and the service life of the junction box is prolonged.

The present application belongs to the technical field of display panels, and provides an array substrate, a manufacturing method and a display panel, wherein the array substrate comprises a substrate, a common electrode line, a first insulating layer, a first metal layer, a second insulating layer, a second metal layer, a third insulating layer, a common electrode layer, a fourth insulating layer and a pixel electrode layer which are stacked in sequence; the first metal layer is formed with a scanning line, and at least part of the common electrode line is stacked with at least part of the scanning line; the common electrode layer is formed with a common electrode and a first connecting portion connected to the common electrode, and the first connecting portion is electrically connected to the common electrode line. The array substrate provided by the embodiment of the present application has a large aperture ratio and a flat surface.

The invention relates to the technical field of circuit boards, and discloses a printed circuit board, a wiring method of the printed circuit board, a detection method and electronic equipment. A target part located on the circuit board body; wherein the signal pins arranged on the outer side of the target part adopt layer wiring close to the part surface; and the signal pins arranged on the inner side of the target part use layer wiring far away from the part surface. In this way, the signal lines connected with the signal pins on the outer side of the target part are arranged on the layer close to the part face for wiring, the signal lines connected with the signal pins on the inner side of the target part are arranged on the layer away from the part face for wiring, and the signals corresponding to the layer away from the part face pass through the via holes in the layer close to the part face when penetrating out of the chip. Signal interference can be effectively avoided, the cost can be reduced, the wiring space is saved, and the wiring difficulty is reduced.

The present invention discloses a wireless transmission remote assistance battery management communication method, including a main matching box and an optional matching box, wherein the main matching box and the optional matching box are connected via a serial port; the main matching box and the battery module are connected via a communication module, and the main matching box is used to verify, monitor, and forward communication data; the optional matching box and the user end are connected via wireless, and the user end accesses a server via the Internet; the optional matching box and the battery module are connected via Bluetooth, and the battery module includes a Bluetooth communication unit, and the optional matching box is used to transmit communication data between the user end and the battery module. The present invention is specifically used for battery management, and can remotely and quickly view battery status and data, remotely upgrade battery programs, and solve battery failures; it is convenient for users to use and technicians to repair; it saves wires, saves wiring space, and reduces manual operations.

The invention provides terminal equipment, a packaging module and a preparation method of the packaging module. The packaging module comprises a modified plastic base material, the modified plastic base material comprises an organic metal compound, and the modified plastic base material is provided with a groove part. And the metal bonding pad is arranged in the groove part. And the component is arranged on one side, far away from the bottom wall of the groove part, of the metal bonding pad. And the shielding cover is arranged at the opening of the groove part in a covering manner, and the metal bonding pad and the component are packaged in the groove part by the shielding cover. The groove part is arranged on the modified plastic base material, and the metal bonding pad and the component are packaged in the groove part through the shielding cover, so that an additional built-in soft board or a connector does not need to be added, the product volume can be reduced, the wiring space of PCB layout is saved, the assembly process cost is reduced, and the thin development trend of terminal equipment is met; and the miniaturization design requirement is met.

The utility model discloses a kind of interlayer interconnection structures for multilayer circuit board in the technical field of circuit board processing, multilayer circuit board includes multiple layer plates, multiple layer plates are integrally formed by once compression, and multiple different depth blind holes are provided on multilayer circuit board, each blind hole extends to set depth from surface layer or bottom layer of multilayer circuit board, the surface of blind hole is provided with conductive layer, and the inside of blind hole is also filled with plug hole medium for making up the current deficiency problem of conductive layer. The utility model solves the defects that interlayer interconnection structure in existing multilayer circuit board is difficult to process, yield is low, cost is difficult to control, etc., greatly reduces the process flow steps of processing, saves processing time, reduces processing cost, improves yield, and the utility model can also make up the problem of insufficient conductive current caused by insufficient copper of mechanical blind hole.

The present application proposes a Fan‑out-based Mirco‑LED display screen and its manufacturing process, comprising: a substrate; an LED chip array comprising a plurality of LED chips and a TFT array comprising a plurality of TFTs, which are bonded to the upper and lower sides of the substrate through solder joints on the upper and lower sides of the substrate respectively; at least one metal trace is arranged on the upper and / or lower sides of the substrate, and a via is provided on the substrate for the metal trace to pass through up and down, one end of the metal trace is connected to the solder joint on the upper side of the substrate, and the other end extends horizontally outward to exceed the edge of the LED chip array and connects to the solder joint on the lower side of the substrate, thereby achieving electrical conduction between the LED chip array and the TFT array. The Mirco‑LED display screen of the present application has a simple manufacturing process and low cost.

The utility model relates to the technical field of temperature and humidity monitoring, and discloses a temperature and humidity conversion unibus circuit, which comprises a temperature and humidity sensor chip U1, a 1-Wire bus interface chip U2, a 100nF filter capacitor C1, a 2uF filter capacitor C2 and a Schottky diode D1, the IO pin 1 of the 1-Wire bus interface chip U2 is connected with a DQ line, the DQ line is a data signal line connected with a bus, and the IO pin 2 of the 1-Wire bus interface chip U2 is connected with the Schottky diode D1. And the anode of the Schottky diode D1 is connected with a DQ line, the cathode of the Schottky diode D1 is connected with VDD, and the Schottky diode D1 is used for providing reverse voltage protection for a pin IO of the 1-Wire bus interface chip U2. According to the technical scheme of the utility model, DS28EA00U + Tamp is adopted. The R1-Wire bus interface chip U2 and the IC bus of the SHT30-DIS-B temperature and humidity sensor chip U1 are multiplexed, a set of communication line does not need to be independently arranged for each chip, and the design of a power supply loop is simplified.

The invention discloses a fire-fighting communication optical cable capable of extinguishing fire and a production method, a framework is provided with a plurality of groove bodies arranged at intervals, optical fibers are arranged in the groove bodies in a penetrating manner, each groove body is filled with a dry powder extinguishing agent, and a POE film wraps the outer side of the framework and then is arranged in a POE sheath. The dry powder extinguishing agent is applied to a communication optical cable structure, so that the communication optical cable has certain fire extinguishing capacity. A 70 DEG C hot-melt POE film is used for wrapping the framework groove, the groove body is sealed and fixed, and meanwhile when the temperature reaches 70 DEG C, the film can be automatically melted. The light and thin 70-DEG C hot-melt-grade POE sheath is used, when a fire point is generated around the optical cable and the temperature rises to 70 DEG C, the light and thin hot-melt-grade POE sheath melts, the hot-melt-grade POE film melts, the dry powder extinguishing agent naturally falls off and makes contact with flames, and the fire extinguishing purpose is achieved through the effects of chemical inhibition, isolation, cooling, suffocation and the like.

The utility model relates to a drive and control integrated DC permanent magnet brushless motor for solar power generation, which comprises a motor body, a rear cover and a drive circuit board, an outer groove is arranged on the outer peripheral surface of the rear end of a shell of the motor body, a cable hole is arranged at the rear end of the shell of the motor body, and the drive circuit board is arranged in the rear cover. An inner groove connected with the outer groove is formed in an opening of the rear cover, and an aviation plug connected with the driving circuit board is installed on the outer side of the rear cover. In the integrated direct current permanent magnet brushless motor, the driver and the motor are integrated, the cable installation process is simplified, and the manufacturing cost is reduced. Driving control and the motor are integrated, so that the external driving space is greatly saved, cables and accessories for connecting the motor and the driver are reduced, the cost of driving control is reduced, and the risks of water leakage and aging during outdoor use are reduced.

The invention provides a serial port-to-wireless transmission module and transmission method based on a star flash protocol, and the module comprises a transmitting end and a receiving end, each of the transmitting end and the receiving end comprises an MCU control circuit, a star flash circuit module, a power conversion circuit, a TTL-to-USB circuit, an RS422 serial port communication circuit, and an upper computer. The MCU control circuit is used for processing data received by the RS422 serial port communication circuit and performing data communication with the star flash circuit module; the power conversion circuit is used for supplying power to the MCU control circuit, the star flash circuit module and the RS422 serial port communication circuit; the TTL to USB circuit is used for communication between the MCU control circuit and an upper computer; and the RS422 serial port communication circuit is used for communication between the MCU control circuit and a serial port. The wireless transmission requirement of RS422 signals is met through the serial port to wireless transmission module, data unvarnished transmission is achieved by adopting a star flash protocol, and the wiring space is saved.

The invention discloses a periodic branch microstrip double-line with a wing-shaped compensation structure for suppressing microstrip line far-end crosstalk, and the periodic branch microstrip double-line comprises two parallel periodic branch microstrip lines, and discrete wing-shaped compensation units which are uniformly distributed between the two periodic branch microstrip lines. And the wing-shaped compensation units and the microstrip line branches are arranged in a staggered manner. According to the periodic branch microstrip double-line with the wing-shaped compensation structure, the periodic microstrip line structure and the wing-shaped compensation structure are designed, capacitive coupling between the compensation lines is realized, so that far-end crosstalk is reduced, and the suppression effect is optimal by scanning and optimizing structural parameters. Compared with a traditional microstrip line, the microstrip line is lower in far-end crosstalk, small in line spacing and capable of effectively saving wiring space.

This invention discloses a display panel, driving method, and display device, relating to the field of display technology. The display panel includes a pixel driving circuit and scan lines and light-emitting control lines connected to the pixel driving circuit. The pixel driving circuit includes a driving transistor, a first reset module, and a light-emitting element. The output terminal of the first reset module is connected to the gate of the driving transistor, and the output terminal of the driving transistor is electrically connected to the light-emitting element. The input terminal of the first reset module is connected to either the scan line or the light-emitting control line. The scan signal provided by the scan line, or the light-emitting control signal provided by the light-emitting control line, is multiplexed into a first reset signal provided by the first reset module to the gate of the driving transistor. This invention multiplexes the scan signal or the light-emitting control signal into a first reset signal, eliminating the need for additional reset lines and saving wiring space. In high-density display panels, it avoids the problems of small trace spacing, leakage current, and crosstalk caused by excessive traces.

The present disclosure provides a servo valve control system and a robot. The system comprises a controller and a plurality of voltage output digital-to-analog converters, the chip select signal input ends of the plurality of voltage output digital-to-analog converters are connected to the same chip select signal output end of the controller, the clock signal input ends of the plurality of voltage output digital-to-analog converters are connected to the same clock signal output end of the controller, the serial data input ends and the serial data output ends of the controller and the plurality of voltage output digital-to-analog converters are connected in sequence in a ring, the controller is configured to output the digital signals required by the plurality of voltage output digital-to-analog converters in sequence through the serial data output end thereof, and the plurality of voltage output digital-to-analog converters are configured to transmit the digital signals received thereby to the serial data output ends thereof and convert the digital signals received thereby within a set period into analog voltage signals to drive corresponding servo valves. The system saves the number of ports and wiring space.

The utility model relates to a current detector. The current detector comprises a base body, the base body comprises a first shell, a processing module and a first contact, the processing module and the first contact are arranged in the first shell, and the first contact is connected with the processing module; the adapter comprises a second shell and a second contact, the second contact is arranged in the second shell, the second shell is detachably connected with the first shell, and the second contact can abut against the first contact; at least one end of the current measuring part is detachably connected with the adapter, the current measuring part is used for detecting current signals, and the processing module is used for processing the signals output by the current measuring part. All the components of the current detector are connected in an abutting mode, and the stability and reliability of signal transmission are improved.

This application provides a flat ribbon cable for use in a formation and capacity testing device, and the device itself. The flat ribbon cable includes a ribbon cable, mating terminals, an insulating film, and a shielding layer. The ribbon cable includes multiple parallel conductors, at least one end of which is connected to a device in the formation and capacity testing device. The mating terminals are connected to one end of each conductor in the ribbon cable, and the conductors are connected to the device in the formation and capacity testing device via the mating terminals. The insulating film is adhered to the upper and lower surfaces of the ribbon cable to cover it. The shielding layer covers the outer layer of the insulating film opposite to the ribbon cable. Using a flat ribbon cable can shorten equipment assembly time, reduce wiring space, and effectively shield against external electromagnetic interference, ensuring high accuracy of sampling data obtained using the flat ribbon cable.

The invention provides a manufacturing method of a circuit board with an in-hole partition structure and the circuit board. The method comprises the following steps: acquiring a target circuit board substrate; positioning and calibrating the target circuit board substrate to obtain a calibrated substrate; performing mechanical drilling on the calibration substrate according to preset drilling parameters to obtain a first substrate; according to the first substrate and preset groove body parameters, a groove body machining track is obtained; performing laser etching treatment on the first substrate according to preset laser processing parameters and the groove body processing track to obtain a second substrate; forming the second substrate to obtain a first circuit board; and detecting the first circuit board according to a preset detection condition to obtain a target circuit board. According to the invention, the efficiency and quality of slotting in the hole are improved, and partition in the hole is realized; the wiring space of the board is saved, the wiring density of the circuit board is improved, and high-density miniaturized electronic products are adapted.

The invention relates to a combined electrostatic suppressor, comprising a suppressor body and a combined bracket, wherein the combined bracket comprises a clamping piece, a clamping positioning groove matched with the clamping piece is arranged in the middle of the suppressor body, and the clamping piece is electrically connected to the ground pin of the suppressor body when clamping the suppressor body; a metal heat-conducting column is connected to the clamping piece, and a positioning through hole matched with the metal heat-conducting column is arranged on the circuit board; the combined bracket also comprises a bracket circuit board, and a plurality of grounding pads directly and fixedly connected to the metal heat-conducting columns one by one, sensors corresponding to the temperature of the grounding pads and an alarm are arranged on the bracket circuit board, and the alarm gives an alarm to the outside world when the induced temperature of the sensor exceeds a threshold value, and the grounding pad is grounded; while achieving the purpose of conductive heat dissipation and temperature monitoring alarm, the grounding pin of the suppressor body is also led out to the grounding pad on the bracket circuit board, saving the wiring space of the circuit board and greatly reducing the complexity of the circuit design.

The utility model provides a chip packaging structure and electronic equipment. The chip packaging structure comprises a carrier plate, a first chip and a second chip, a mounting part is arranged on the carrier plate, and the mounting part is a dug hole, or the mounting part is a groove; at least part or all of the second chip is located in the mounting part, and the second chip is interconnected with the first chip; the area, except for the area where the second chip is connected with the first chip, on the first chip is connected with the carrier plate. According to the chip packaging structure, the mounting part is arranged on the carrier plate to accommodate and mount the second chip, so that the packaging occupied area of the second chip on the carrier plate is reduced, the processing difficulty and the processing cost of the first connecting piece of the chip are reduced, and the packaging efficiency of the first chip and the second chip is improved. And the processing difficulty and the processing cost of welding between the first chip and the carrier plate are reduced, and the overall product thickness is reduced. Meanwhile, the interconnection path between the first chip and the carrier plate and the interconnection path between the first chip and the second chip are shortened, and the performance of a packaged chip product is improved.

The present application discloses a cable-free airborne chassis, which relates to the technical field of electrical chassis. The cable-free airborne chassis includes a box, a motherboard, an adapter board and at least two functional modules; the vertical side wall of the box is provided with an avoidance through hole; the motherboard is laid flat on the bottom of the inner cavity of the box, and at least two first connection ends electrically connected to each other are arranged at intervals on the upper surface of the motherboard; the adapter board is connected to the motherboard through a flexible circuit board, the adapter board and the motherboard are perpendicular to each other, the adapter board is provided with a number of aviation plugs, the aviation plugs are inserted in the avoidance through hole and extend to the outside of the box, and the aviation plugs are electrically connected to at least two first connection ends; at least two functional modules are vertically plugged into the inner cavity of the box, and the functional module has a second connection end, which is connected to the first connection end one by one. The cable-free airborne chassis can solve the technical problems that there are too many cables inside the conventional airborne chassis, which leads to confusion inside the chassis, the risk of use, and a large amount of assembly work.

The invention relates to a display panel and a display device. The display panel comprises a display area and a frame area, the frame area comprises a first sub-frame area and a second sub-frame area, the first sub-frame area is located on the side, in the first direction, of the display area, and the second sub-frame area is located on the side, in the second direction, of the display area; the display panel comprises a substrate, a first shifting register, a first signal line and a first connecting line, the first shifting register, the first signal line and the first connecting line are located on one side of the substrate, the first shifting register is located in the first sub-frame area, the first signal line is electrically connected with the output end of the first shifting register, and the first connecting line extends to the display area from the first sub-frame area. And extending from the display area to the second sub-frame area. Therefore, according to the display panel and the display device provided by the invention, the narrow frame design of the display panel can be realized.

The invention discloses a differential via hole structure, a design method and a printed circuit board, relates to the field of circuit design, and is used for solving the problem that a differential via hole occupies a large space of the printed circuit board. According to the scheme, by designing the structure that the two backflow via holes are tangent and the two backflow via holes are tangent to the two signal via holes respectively, symmetry is kept between the signal via holes and the backflow via holes, the via hole layout of differential signals is optimized, the distance between the differential via holes is shortened, the wiring space on the printed circuit board is effectively saved, and the wiring efficiency of the printed circuit board is improved. The structure is divided into three parts by adding the milling grooves in the printed circuit board, so that differential signals can obtain good isolation and backflow channels among different parts, the isolation and backflow effects of GND signals are enhanced, the integrity of high-speed signals is improved, signal crosstalk in high-density design can be reduced, and the reliability of the circuit board is improved. Therefore, high-density and miniaturized design is supported under the condition that the production difficulty is not increased, and the flexibility and the replicability of the design are improved.

The present invention relates to a touch display device, comprising a display panel and a main flexible circuit board and a first bridge flexible circuit board connected to the display panel, wherein the first bridge flexible circuit board is provided with touch components including a touch IC, the first bridge flexible circuit board comprises a first binding area bound and connected to the display panel, a first electrode signal line led out from the display panel is connected to the first bridge flexible circuit board through the first binding area, and is connected to the touch IC through the routing on the first bridge flexible circuit board.

The embodiment of the present invention discloses a display substrate, a manufacturing method thereof and a display device. By arranging a flat layer with a relatively flat surface facing the second metal layer between the first metal layer and the second metal layer, the second metal layer deposited on the flat layer is also relatively flat. When the second metal layer is subsequently patterned by a photoresist process to form a plurality of second metal traces, the photoresist thickness of the fan-shaped area can be ensured to be uniform, and the manufacturing accuracy of the second metal traces of the second metal layer can be improved, so that the second metal traces with the same width and spacing as the first metal traces can be formed. In the scheme of the present invention, the etching resolution of the metal traces in the fan-shaped area corresponding to the first metal layer and the second metal layer can be the same, which can reduce the wiring space of the fan-shaped area and further realize a narrow frame.