87 results about "Differential line" patented technology

The invention belongs to the technical field of geophysical exploration, and particularly discloses a differential transient electromagnetic method device and an unexploded ordnance detection method thereof.The differential transient electromagnetic method device is characterized in that a transmitter injects emission current into an emission loop, and the emission loop generates a primary field excitation signal; the underground anomalous body target generates a secondary field excitation signal under the action of the primary field excitation signal; the receiving coil assembly is based on the structure of a differential coil, synchronously counteracts a primary field excitation signal and a uniform background signal in an induced voltage, and expands a local asymmetric differential signal generated by an underground anomalous body target; and the receiver carries out time sequence analysis on the local asymmetric differential signals and extracts differential signal features so as to realize positioning and identification of an underground anomalous body target. The device is suitable for detection of shallow-buried small bodies such as UXO, the overall arrangement range of the device is small, and rapid arrangement and mobile observation in the field are facilitated.

An interface for an optical modulator and the optical modulator are described. The interface includes first and second differential line pairs. The first differential line pair has a first negative line and a first positive line arranged on opposing sides of a first waveguide. The first negative line is on a distal side of the first waveguide relative to a second waveguide. The first positive line is on a proximal side of the first waveguide relative to the second waveguide. The second differential line pair has a second negative line and a second positive line arranged on opposing sides of the second waveguide. The second negative line is on a distal side of the second waveguide relative to the first waveguide. The second positive line is on a proximal side of the second waveguide relative to the first waveguide. The first and second waveguides each include lithium niobate and / or lithium tantalate.

The invention discloses a spatial orthogonal differential eddy current probe based on magnetic flux directional extraction and a detection device, the probe is formed by vertically arranging four groups of excitation coils and detection coils with the same parameters in a rectangular-ambulatory-plane manner to form two groups of differential coils; differential signals are taken during detection, if double peaks appear, the defect is judged, the center of the double peaks is the defect position, the amplitude difference delta Vpp is equal to the depth d, the speed v meets the conditions that d = kd * delta Vpp + bd and delta Vpp = kv * v + bv, the array probe works independently, and through real-time calculation of a multi-channel A / D and an FPGA, cracks with the width of 0.5 mm and the positioning error lt can be detected at the speed of 2 m / s under the lift-off of 0.5 mm; 2 mm, the depth error lt; compared with a traditional probe signal, the signal is improved by 3.3 times, the support can be fixed or held by hand, and the device is suitable for online nondestructive testing of metal plates and pipelines.

The application discloses a kind of grid shielding structure differential impedance calculation method and system, equipment, medium, the method is based on the conductor width and pitch of grid shielding layer first Calculation obtains escape ratio, then signal escape radiation is equivalent to the increase of dielectric thickness farther, to calculate equivalent dielectric thickness, based on time equivalence principle Calculation obtains the equivalent dielectric constant between electric ground, finally calculates differential impedance.The application first proposes the calculation theory and calculation model of grid shielding structure differential impedance, considers the influence of the escape effect of grid shielding layer on differential impedance calculation, by the signal escape of grid shielding layer is equivalent to the increase of dielectric thickness, and based on time equivalence principle Calculation equivalent dielectric constant, different from the dielectric constant of pure dielectric between transmission line, greatly improve the precision of grid shielding structure differential impedance calculation, can be well applied to the differential line design of grid shielding structure, is conducive to improving the first pass rate of differential impedance design.

The present disclosure relates to a differential line conversion structure and an antenna device with which further size reduction can be achieved. This differential line conversion structure comprises: a single line in which one wire is disposed; a differential line in which two wires are disposed substantially parallel to each other; a propagation mode conversion region which converts the propagation mode of a signal to be inputted to the differential line at a connection point where one wire constituting the differential line is electrically connected to the wire constituting the single line; and a filter structure which is disposed adjacent to the propagation mode conversion region on the differential line side thereof and suppresses the propagation of a common mode through the differential line. The present technology can be applied to, for example, a differential line conversion structure used in a millimeter-wave radar.

The invention relates to a simulation scanning method for guiding the routing angle of adjacent layers, and the method comprises the steps: building a transmission line model containing two pairs of differential lines with the vertical projections of the adjacent layers coinciding, setting a center coordinate, controlling the two pairs of differential lines to rotate reversely at the same value, scanning the angle, obtaining crosstalk data of different angles through simulation, and improving the amplitude. Therefore, the wiring angle design of adjacent layers is guided. According to the method, two pairs of differential lines of adjacent layers are set as reverse same-value rotation variables, the angle difference and a single variable are associated, control is simplified, and traceability is achieved; a projection center is used as a rotation reference, so that accurate control and reliable simulation are guaranteed; crosstalk data are obtained through angle scanning, quantization limitation is broken through, and efficiency is improved; the data shows that the difference is improved, the optimal angle is selected by combining the assistance with the space limitation, crosstalk exceeding or space waste is avoided, and experience dependence is got rid of.

The application discloses a method for compensating internal skew of a differential via channel, comprising the steps of: calculating skew time between differential signals; using obtained material parameters to establish a model of a PCB and a differential via; simulating the established high-precision differential model to obtain S parameters of the differential via structure through simulation; obtaining S parameters and differential internal skew values of a design measurement to calibrate a scale factor of 3D modeling; optimizing stub length difference h in the differential via structure; comparing whether the optimization result meets a design allowed differential internal skew target value, if yes, optimization is completed, and if not, stub length difference h is continuously optimized. The application occupies small layout and wiring space, and the proposed differential via structure compensates for skew of differential phase in time, effectively avoiding the influence of internal skew.

The invention belongs to the field of circuit design, and discloses a differential line structure, a printed circuit board and electronic equipment. The differential line structure comprises a differential signal line and a capacitor structure; the differential signal line comprises a first signal line and a second signal line, a differential gap is formed between the first signal line and the second signal line, the differential gap comprises a first gap section and a second gap section, and the width of the second gap section is greater than that of the first gap section; and the capacitor structure is arranged in the two gap sections and is used for increasing the capacitance of the first signal line and the second signal line at the second gap section. According to the differential line structure provided by the invention, the capacitor structure is correspondingly arranged in the second gap section, so that the effective gap of the second gap is reduced, the capacitive coupling between the first signal line and the second signal line is increased, and the differential impedance at the second gap is further reduced.

A circuit board includes a first circuit layer, a second circuit layer, a third circuit layer, a first differential line group, a second differential line group, a third differential line group, and a fourth differential line group. The first and third differential line groups are disposed between the first and second circuit layers. The second and fourth differential line groups are disposed between the first and third circuit layers. A first distance exists between the first differential line group and the first circuit layer, a second distance exists between the second differential line group and the first circuit layer, a third distance exists between the third differential line group and the first circuit layer, and a fourth distance exists between the fourth differential line group and the first circuit layer, wherein the first distance is less than the third distance, and the second distance is less than the fourth distance. The conductive structure of the differential lines is composed of graphene, and the insulating structure of the differential lines is composed of graphene oxide. Therefore, the circuit board of this invention can reduce signal loss and possesses a certain degree of heat resistance in high-temperature environments.

The utility model provides a printed circuit board and an optical module. The circuit board comprises a first surface layer and a second surface layer which are opposite, and a first signal layer and a second signal layer which are laminated between the first surface layer and the second surface layer; one end of the circuit board is provided with an electric connection part, and the electric connection part comprises a second transmitting end golden finger and a second receiving end golden finger which are located on the first surface layer, and a first transmitting end golden finger and a first receiving end golden finger which are located on the second surface layer; the first surface layer is provided with a signal processor, a plurality of pairs of receiving differential lines electrically connected with the first receiving end golden finger, the second receiving end golden finger and the signal processor are arranged on the first signal layer, and a plurality of pairs of transmitting differential lines electrically connected with the first transmitting end golden finger, the second transmitting end golden finger and the signal processor are arranged on the second signal layer. Therefore, transmitting end signals and receiving end signals are isolated. According to the invention, the problems of dense PCB high-speed signal lines and wiring caused by the increase of optical module signal channels can be solved, and the high-frequency performance and the anti-interference capability are improved.

The invention provides a camera triggering circuit, method, device and equipment. The circuit comprises a coupling circuit, a differential driving circuit and a camera driving circuit which are connected in sequence, the coupling circuit comprises an optical coupler, the input end of the optical coupler is connected with an initial single-ended signal, and the output end of the optical coupler outputs a TTL signal; the differential driving circuit comprises a differential line driver chip, the input end of the differential line driver chip is connected with a TTL signal, and the output end of the differential line driver chip outputs a differential signal; the camera driving circuit comprises a differential line connector chip and a switch element which are connected, the input end of the differential line connector chip is connected with a differential signal, the output end of the differential line connector chip outputs a trigger level, and the switch element is connected with the trigger level and outputs a signal for triggering camera driving. Therefore, the optical coupler is utilized to realize electrical isolation and block common-mode noise, and differential signals are utilized to improve the anti-interference capability in a complex electromagnetic environment, so that the anti-interference capability of the whole circuit can be remarkably improved.

This utility model relates to the field of circuit board packaging technology, and in particular to a circuit board and a solid-state drive. The circuit board provided by this utility model sets high-speed differential line pairs as inner layer traces, and uses vias / through holes through the pads of the high-speed differential lines to electrically connect the high-speed connector and the controller. Since the vias / through holes only need to pass through the pads, the number of wiring layers through which the vias / through holes pass is greatly reduced, which makes it possible to use back drilling process to better reduce the number of residual posts and shorten the length of residual posts, effectively reduce signal reflection or crosstalk, and improve signal quality.

A coupler includes a plurality of unit circuits connected to a plurality of differential line pairs and a single-ended line; and a plurality of isolation resistors connected between the plurality of differential line pairs, wherein each unit circuit of the plurality of unit circuits includes: a transformer including a primary side connected to one differential line pair among the plurality of differential line pairs, and a secondary side connected to the single-ended line, and a secondary-side capacitor connected in parallel to the secondary side.

The utility model discloses an anti-EMC radiation circuit for an RJ45 network port, which relates to the technical field of EMC protection and comprises a network transformer module and an information socket connector module. According to the network transformer module, electrical isolation between a primary winding and a secondary winding is achieved through magnetic coupling, interference and fault propagation between different circuits are prevented, and the influence of common-mode interference is reduced; the EMC transmission energy of the network cable is reduced through common-mode inductors on four pairs of differential lines at the processing chip end of the network transformer; through common-mode inductors on four pairs of differential lines at the end, connected with the information socket connector, of the network transformer, radiation signals are restrained, and electromagnetic interference is reduced; the information socket connector module ensures reliable transmission of signals. According to the utility model, the common-mode inductors are additionally arranged at the two ends of the network transformer module, so that EMC transmission energy and radiation signals are effectively reduced, and the anti-interference capability of the whole circuit is improved.

The invention discloses an anti-transition resistance semi-decoupling multi-terminal differential line fault positioning and distance measuring method, belongs to the field of power system relay protection, and solves the problems of complex calculation, weak anti-transition resistance and difficult equipment upgrading caused by multi-terminal data coupling in the existing method. The method comprises the following steps: S1, calculating a distance ratio based on local side voltage and current, and preliminarily positioning a fault branch; s2, constructing an equation containing transition resistance R and fault impedance ZL-1, and generating a transition resistance matrix r and a fault impedance matrix z (dimensionality is adaptive to CPU computing power); s3, denoising through a Hankel matrix and singular value decomposition to obtain an accurate sequence; and S4, verifying the sequence consistency within 20-40ms after the fault, and outputting a result or repositioning. The method is free of iteration and high in transition resistance resistance, the complexity is linearly improved along with the number of T-connection terminals, hardware computing power and old equipment upgrading are adapted, and the method is suitable for a new energy T-connection multi-terminal network.

A communication device includes a duplexer differentially coupled to a receiver and a transmitter. The duplexer may include phase shifters on the differential lines to provide differential received signals to the receiver and receive differential transmission signals from the transmitter for transmission. For example, the phase shifter are positioned such that single-ended received signals may be converted to differential received signals and convert the differential transmission signals to single-ended transmission signals for transmission. Moreover, the phase shifters may provide the single-ended transmission signals to antennas for transmission and to the differential lines of the receiver for cancellation / isolation. Furthermore, the phase shifters may provide the differential received signals to the receiver for reception and provide the single-ended received signals to the differential lines of the transmitter for cancellation / isolation. Accordingly, the duplexer may convey communication signal while reducing signal interference by providing improved isolation.

The invention discloses a PLL (Phase Locked Loop) shared transceiver circuit for a USB3 (Universal Serial Bus 3) interface. The circuit comprises a receiving module, a sending module and a phase-locked loop, and the receiving module is used for receiving data from a differential line and analyzing frequency information from the received data; generating a frequency control word according to the frequency information; the sending module is used for sending data through a differential line; the phase-locked loop is used for generating a recovery clock according to the frequency control word generated by the receiving module, and sending the generated recovery clock to the receiving module and the sending module, so that the receiving module generates a sampling clock according to the recovery clock when sampling data on a differential line, and the sending module sends the sampling clock to the receiving module when sending the data. And taking the recovered clock as a sending clock. The receiving module and the sending module share the same phase-locked loop, the power consumption is low, and the area is small; and the USB3 Link layer and the Physic layer share one clock, so that the design complexity is reduced.

Systems and methods are disclosed for routing differential communication lines to different integrated circuits based on printed circuit board (PCB) unit variants. In one example, a system for routing signals comprises a location for mounting either a first resistor or a second resistor and another location for mounting either a third resistor or fourth resistor, the location for receiving either the first resistor or the second resistor being shaped such that, when populated with the first resistor, the first resistor is in a first orientation, and when populated with the second resistor, the second resistor is in a second orientation perpendicular to the first orientation.

The invention discloses a domain controller PCIe (Peripheral Component Interconnect Express) signal layout and wiring method, a PCB (Printed Circuit Board) and a vehicle. The method comprises the following steps: setting a standard impedance value of a PCIe 3.0 wire to be 80 omega, and setting the length of the PCIe 3.0 wire to be within 3000 mils; wiring of PCIe3.0 routing is set to be inner-layer routing, the routing width is 5.6 mil, and the distance between differential lines is 5.4 mil. According to the method disclosed by the invention, the layout and the wiring of the PCIe3.0 routing are limited in various aspects, so that the layout and the wiring of the PCIe3.0 routing can well cope with a complicated vehicle-mounted environment, and effective transmission and processing of the PCIe3.0 signal are ensured. And the reliability of the corresponding PCB is improved. And furthermore, the reliability and the safety of the whole vehicle are improved. The invention is mainly used in the technical field of vehicles.

The invention relates to the field of differential line performance detection, in particular to a differential signal testing system and method for detecting differential line performance, and the method comprises the steps: enabling collected data of a pressure sensor and a temperature sensor to pass through a time domain branch based on an LSTM-KAN architecture, so as to generate a multi-time scale fusion clamping feature; obtaining differential signal frequency domain data of a vector network analyzer test differential line, and generating multiband fusion differential line performance characteristics through a frequency domain branch based on an LSTM-KAN architecture; and passing the multi-time scale fusion clamping features and the multi-band fusion differential line performance features through a regression head based on a cross-modal attention mechanism architecture to generate a comprehensive differential line quality grade. According to the invention, the fluctuation characteristics of the differential line clamped by the test fixture are accurately extracted, the defect characteristics of the multi-band differential line are accurately extracted, and the test accuracy of the performance of the differential line is improved.

The invention discloses a printed circuit board and electronic equipment, and the printed circuit board comprises a multi-layer board and a differential wire. The multi-layer board is provided with a signal via hole, and the signal via hole penetrates through the multi-layer board; the differential wires comprise a first differential wire and a second differential wire, the first differential wire and the second differential wire are located on different laminates, and the first differential wire is electrically connected with the second differential wire through a pair of signal via holes; the pair of signal via holes comprises a first signal via hole and a second signal via hole, and at least one isolated metal piece is arranged between the first signal via hole and the second signal via hole. The structural arrangement of the printed circuit board can reduce the inductive jump of the differential impedance of the differential wire at the position of the signal via hole, and facilitates the optimization of the overall impedance uniformity of the differential channel.

The invention relates to the technical field of electronic wire harness automatic wiring, and discloses an electronic wire harness automatic wiring design method, and the scheme comprises the following steps: 1, designing a function level target; 2, designing a physical level target; 3, designing a process level target; step 4, limitation confirmation of an electrical constraint level; 5, limitation confirmation of the mechanical constraint level is carried out; step 6, limitation confirmation of an environmental constraint level; step 7, using a Dijkstra algorithm and an A * algorithm; step 8, modeling by using a voxelization three-dimensional space; and step 9, thermal-structural coupling analysis. The design of a functional level target in the application is to ensure signal integrity (such as differential line pair delay matching) and power supply and ground loop impedance minimization; the design of the physical level target is to adapt to a three-dimensional space (such as a complex curved surface of an automobile engine cabin) of equipment, and interference between cables and moving parts is avoided.

The utility model relates to the technical field of modularized equipment communication, in particular to a modularized equipment bus system based on a 485 serial port, which comprises host equipment and slave equipment. The host device comprises a first microcontroller (an integrated serial port and a timer), a first 485 transceiver and a host side auxiliary logic circuit. And the logic circuit is connected with the timer output and the serial port sending end, and controls the sending enabling of the first 485 transceiver. And the slave equipment comprises a second microcontroller and a second 485 transceiver. And the 485 transceivers of the host equipment and the slave equipment are connected through a differential line. According to the utility model, the combination of the MCU serial port, the DMA, the timer, the 485 and the auxiliary logic is utilized, the bus communication with high speed, interference resistance, low cost and strong universality is realized, and the bandwidth is easy to expand.

The application provides a shielded differential cable, which can be used for high-speed signal transmission and has a top adhesive tape, a bottom adhesive tape and a plurality of differential wire bundles. The plurality of differential wire bundles are adjacent and have substantially equal heights, so that the top adhesive tape and the bottom adhesive tape can be respectively adhered to the top surfaces and the bottom surfaces of the plurality of differential wire bundles in a substantially flat manner. The plurality of differential wire bundles are positioned by the top adhesive tape and the bottom adhesive tape, and the top adhesive tape, the bottom adhesive tape and the plurality of differential wire bundles are similar to FPC flat cable, so that the plurality of differential wire bundles can be easily arranged, aligned and connected in limited space.

The application provides a device for realizing long-distance transmission of KVM multi-channel audio, comprising module A, module B and a controlled host computer, wherein module A comprises an FPGA, an RJ45 interface 1, an RJ45 interface 2 and an RJ45 interface 3, module B comprises an RJ45, an FPGA, an MCU and a USB interface, the controlled host computer is bidirectionally connected with the USB interface of module B, the FPGAs of module A and module B are both used for transmission by using BLVDS interfaces, the transmission medium is a pair of differential lines, half-duplex communication is formed, the communication signal is a BLVDS level signal, the RJ45 of module B is bidirectionally connected with the RJ45 interface 1 of module A, and the FPGA of module A is used for audio decoding output. The application has the beneficial effects that the FPGA chip is used for processing in the host processor, and the BLVDS signal is directly used for data transmission, so that the cost is saved, and a faster transmission rate can be achieved.

The invention discloses a receiver, a digital isolator and a disconnection protection method thereof. The digital isolator includes a transmitter and a receiver connected via a differential line. The receiver comprises an amplifier, an envelope detector and a driver which are connected in sequence, and the envelope detector is configured to perform envelope detection on a differential input signal received by the receiver so as to generate a corresponding envelope signal; the switch module is configured to control the on-off state of an input signal path of the envelope detector; and the broken line protection module is used for detecting the line fault of the differential line according to the signal change of the envelope signal in different on-off states during the power-on reset period, and stopping providing the output signal when the line fault exists in the differential line.

The embodiment of the invention discloses a PCB differential line wiring method, a design method and a PCB, and relates to the technical field of PCBs, through different-layer wiring of differential lines, the wiring space is saved, the wiring pressure of a BGA area is reduced, rapid coupling of the differential lines is carried out in a vertical coupling mode, and the coupling effect of the differential lines is higher. The embodiment of the invention provides a PCB differential line wiring method, a PCB at least comprises a first differential line, and the method comprises the steps: carrying out the fan-out wiring of the first differential line in a middle layer of the PCB, and carrying out the fan-out curved wiring of the first differential line around a wiring bonding pad in a spherical grid array region based on a principle that the first differential line does not enter a bonding pad distribution forbidding region.

The application discloses an electric connector and electronic equipment, comprising a plug and a socket, the plug comprises a first shielding member and a plurality of first connecting members, the first shielding member is provided with a plurality of first holes, and the plurality of first connecting members are matched in the plurality of first holes one by one to realize shielding isolation of adjacent two first connecting members; the socket comprises a second shielding member and a plurality of second connecting members, the second shielding member is provided with a plurality of second holes, and the plurality of second connecting members are matched in the plurality of second holes one by one to realize shielding isolation of adjacent two second connecting members; when the plug and the socket are plugged and matched, the plurality of first connecting members and the plurality of second connecting members are electrically connected one by one, and the first shielding member and the second shielding member abut against each other. The electric connector can realize crosstalk shielding isolation between differential lines, improve the crosstalk problems of far ends and near ends between the differential lines, and improve the quality and stability of signal transmission.

This invention provides a motor control method, apparatus, computer equipment, and storage medium. The method includes: when the motor controller restores power, obtaining the current phase value, current rotation direction, and speed of the target motor by detecting the differential line voltage signal of the two phases of the target motor; filtering and rectifying the differential signal to obtain a square wave signal; determining the frequency value of the square wave signal and determining the current speed of the target motor based on the frequency value of the square wave signal; generating a control signal based on the current speed, current rotation direction, and current phase value, and using the control signal to control the target motor to accelerate and start. The motor control method, apparatus, computer equipment, and storage medium provided by this invention can process the differential signal to obtain a square wave signal, and achieve direct acceleration and start of the target motor based on the current phase value, current rotation direction, and speed determined by the square wave signal, saving significant time and resources.

The invention relates to the technical field of electrical measurement, in particular to a PCB (printed circuit board) electrical performance test system based on multichannel signal feedback, which comprises a data acquisition unit used for acquiring impedance deviation of a plurality of differential wire pairs on a printed circuit board through multichannel time domain reflection test. And the data screening unit is used for screening effective impedance deviation related to dielectric layer thickness fluctuation from the impedance deviation of the plurality of differential line pairs. And the model construction unit is used for constructing a lamination alignment error model based on the effective impedance deviation and the spatial position information of the differential line pair corresponding to the effective impedance deviation on the printed circuit board. And the process optimization unit is used for determining process compensation parameters according to the lamination alignment error model and the newly obtained impedance deviation of the printed circuit board, and outputting adjustment guidance for subsequent design or manufacturing of the printed circuit board according to the process compensation parameters. According to the method, the impedance change of the PCB caused by the thickness fluctuation of the dielectric layer can be accurately identified, and a basis is provided for process optimization.