High-cooling-efficiency FPC board used for camera module group and manufacturing method thereof

A camera module, heat dissipation efficiency technology, applied in circuit thermal devices, printed circuit manufacturing, flexible printed circuit boards, etc., can solve the problem that the heat dissipation effect of the substrate is not too ideal, and achieve the effect of reducing accumulated heat

Inactive Publication Date: 2016-05-11
SHENZHEN HUALIN CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] At present, consumer-grade camera modules mostly use rigid-flex boards (glass fiber as the insulating layer) and flexible circuit boards (PI as the insulating layer). If no additional heat dissipation structure is used, the heat dissipation effect of the substrate at the camera image chip not ideal

Method used

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  • High-cooling-efficiency FPC board used for camera module group and manufacturing method thereof
  • High-cooling-efficiency FPC board used for camera module group and manufacturing method thereof
  • High-cooling-efficiency FPC board used for camera module group and manufacturing method thereof

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Embodiment Construction

[0029] Such as figure 1 , 2 As shown, the high heat dissipation efficiency of the present invention is used for the FPC board of the camera module. In the area (also known as the circuit board area 11) where the chip 2 is mounted on the FPC soft board 1, a number of holes passing through the FPC soft board 1 are arranged. The through hole is referred to as the window hole 3. At the same time, the strength of the FPC soft board 1 at the place where the chip 2 is installed is installed on the back of the FPC soft board 1 (that is, the side where the chip 2 is mounted on the FPC soft board 1 is set as the front side. , the other side of the FPC soft board 1 at that place is the back side) the steel sheet reinforcing sheet 4 is designed as a steel sheet with a boss 41, and the number of the boss 41 is the same as the number of the window holes 3.

[0030] The shape of the window hole 3 is not limited, it can be square, regular polygon, regular trapezoid, circular or elliptical, a...

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Abstract

The invention provides a high-cooling-efficiency FPC board used for a camera module group and a manufacturing method thereof. The high-cooling-efficiency FPC board used for the camera module group is simple in structure, low in cost and quick in effect realization. The vacant positions in a circuit board area corresponding to mounted chip on the FPC board are provided with multiple window holes capable of penetrating through the FPC board. The positions, which are opposite to the window holes, of a steel reinforced piece arranged at the other surface opposite to the mounted chip on the FPC board are provided with bosses capable of inserting in the window holes. The mesa of the bosses is contacted with the heat-radiating surface of the mounted chip. The mesa of the bosses stretches out of the window holes to be contacted with the heat-radiating surface of the chip fit on the FPC board so that a part of heat generated by the chip is conducted to the whole steel reinforced piece through the bosses and guided away by the other surface of the steel reinforced piece in working of the chip. The phenomenon of heat accumulation caused by long time of working of the chip can be reduced so that the chip is enabled to work in the more stable state.

Description

technical field [0001] The invention relates to an FPC soft board, in particular to an FPC flexible circuit board used in digital camera module products such as mobile phones and computers and a manufacturing method thereof. Background technique [0002] FPC is the English abbreviation of Flexible Printed Circuit Board. It is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability. However, the process requirements of SMT on the surface of FPC are quite different from the SMT solutions of traditional rigid PCB. Because the FPC board is very soft, its ability to carry components is slightly poor, so setting steel reinforcement sheets on flexible circuit boards with soldered components is one of the most common means to improve its strength. [0003] With the continuous advancement of technology, people have hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18H05K3/00
CPCH05K1/0204H05K1/189H05K3/0061H05K2201/05H05K2201/066H05K2201/2009H05K2203/06
Inventor 潘陈华李明张本凯
Owner SHENZHEN HUALIN CIRCUIT TECH
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