6results about How to "Reduce heat accumulation" patented technology

The utility model discloses electrical insulation paper for preventing insulation breakdown, which comprises a polyethylene core layer, heat dissipation coatings, a hollow fiber layer and a high-temperature-resistant external insulation layer, the heat dissipation coatings are arranged on two sides of the polyethylene core layer, the hollow fiber layer is arranged on one side of the heat dissipation coatings, and the high-temperature-resistant external insulation layer is arranged on one side of the hollow fiber layer. The electric insulation paper is reasonable in structural design, the loose and porous heat dissipation coating is adopted, the edge part of the heat dissipation coating is arranged outside, the heat accumulation amount of the area of the electric insulation paper can be reduced, and meanwhile the hollow fiber layer is matched, so that the circulation performance of air flow in the electric insulation paper can be enhanced, and the flexibility and elasticity of the electric insulation paper can be enhanced.

The invention discloses a movable gantry welding robot for a welding production line, and belongs to the technical field of welding robots, the movable gantry welding robot comprises a moving track, gantry moving equipment is arranged at the top of the moving track, horizontal moving sliding rails are arranged on the front side and the rear side of the gantry moving equipment, and sliding equipment is arranged on the outer sides of the horizontal moving sliding rails; a multi-degree-of-freedom mechanical arm is arranged at the bottom of the sliding equipment, and a storage bin is arranged at the bottom of the multi-degree-of-freedom mechanical arm; a first hydraulic block is fixedly connected into the storage bin, a first pushing block is movably connected to the front side of the first hydraulic block, a spherical protruding block is fixedly connected to the front side of the first pushing block, the rear side of the first hydraulic block is fixedly connected with the top of a second hydraulic block through a first hose, and the inner side of the second hydraulic block is fixedly connected with the right side of the storage bin. The bottom of the second hydraulic block is movably connected with the welding gun through a transmission piece. The problem that the vertical height of a welding gun cannot be automatically and accurately adjusted rapidly through original equipment is solved.

The present disclosure provides a semiconductor package device and a manufacturing method thereof. By stacking each wafer package structure along a direction perpendicular to the first substrate, i.e. each wafer package structure is arranged vertically to the substrate, and the electrical path length between each wafer package structure and the first substrate is relatively consistent, the problem of inconsistent electrical path length in the PoP in the prior art can be solved. In addition, each wafer package structure can dissipate heat through the first substrate, which can alleviate the heat accumulation problem of the intermediate wafer package structure in the prior art.

The invention belongs to the field of graphics card heat dissipation, and particularly relates to a graphics card liquid cooling type rapid heat dissipation device which comprises a plate body. A heat dissipation groove, a cooling groove, a circulating cavity and a flowing groove are formed in the plate body, the heat dissipation groove, the cooling groove, the circulating cavity and the flowing groove are filled with heat conduction liquid, a through hole is formed between the cooling groove and the heat dissipation groove, one end of the flowing groove is communicated with the circulating cavity, and the other end of the flowing groove is communicated with the cooling groove. A circulation assembly is arranged on the plate body, a heat dissipation assembly for cooling the heat conduction liquid is further arranged on the plate body, when the GPU works to generate heat, the heat conduction liquid rapidly absorbs the heat, then the circulation assembly pushes the heat conduction liquid to fluctuate in the flowing groove, and then the heat conduction liquid is cooled through the heat dissipation assembly. In this way, rapid heat transfer is achieved, the problem of heat accumulation caused by slow heat transfer is solved, and the heat dissipation effect of the display card under high-load operation is effectively improved.

A high-efficiency heat dissipation compact busbar trunking includes a housing and a busbar structure disposed within the housing. The housing includes a first outer shell and a second outer shell disposed on both sides of the busbar structure, as well as a heat dissipation structure. The heat dissipation structure includes a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure includes a first horizontal heat dissipation section and a first vertical heat dissipation section. The second heat dissipation structure includes a second horizontal heat dissipation section and a second vertical heat dissipation section. A storage space with openings at both ends is formed between the first outer shell and the second outer shell for placing the busbar structure. The first horizontal heat dissipation section closes one end of the storage space, and the first vertical heat dissipation section enters the storage space. The second horizontal heat dissipation section closes the other end of the storage space, and the second vertical heat dissipation section enters the storage space. This invention achieves high-efficiency heat dissipation while maintaining a small size and large capacity, meeting the requirements of miniaturization and high efficiency of modern power transmission equipment.