34results about How to "Reduce heat accumulation" patented technology

The light emitting element includes a first electrode and a second electrode opposite each other and electrically connected respectively to a first conductive-type layer and a second conductive type layer constituting a semiconductor structure. The first electrode has a pair of electrode extending portions disposed opposite each other on an electrode forming surface over the first conductive-type layer which is positioned at the light extracting side. In the opposing direction of the pair of electrode extending portions, a half distance I1 between the electrode extending portions is smaller than the distance L2 from the electrode extending portions to an end edge of the electrode forming surface.

The invention discloses the roller surface high-frequency impulse laser induced directional discharging hair device, comprising impulsing power source, high frequency pulse laser generator, discharged electrode and control device. The device comprises the following characteristics: the bipolar of impulsing power source connected with roller and discharged electrode, the discharged electrode placed on the laser focal point of laser generator, the control device controlling the impulsing power source and high frequency pulse laser generator. The device has good directionality, high working frequency, big power, and good hair controllability and homogeneity.

The invention provides an IGBT parallel static current sharing circuit which has advantages of static current sharing, accurate and reliable current sharing adjustment, stable switching frequency, long service life, and high suitability for power electronic equipment which requires IGBT parallel connection and is on for a long time period. The IGBT parallel static current sharing circuit comprises a global control circuit, at least two parallel IGBTs, and local feedback control circuits which are arranged in one-to-one correspondence with the IGBTs. The emitter electrode of each IGBT is connected with the input end of a corresponding local feedback control circuit, and the gate electrode is connected with the output end of the corresponding local feedback control circuit. The local feedback control circuits are connected with the global control circuit. The local feedback control circuits are used for adjusting the amplitude of a driving signal transmitted to the corresponding IGBT according to the acquired feedback signals and a reference signal that is transmitted by a global driving time delay control module. The global control circuit is used for computing the reference signal of the local feedback control circuit according to each IGBT current.

The invention discloses an anti-track bituminous pavement cooling structure and a material composition of each layer thereof. The anti-track bituminous pavement cooling structure comprises a low-heatconduction upper face layer, a heat storage intermediate face layer and a high-heat-conduction lower face layer from top to bottom. During construction, layered paving and rolling are combined, and tack coat is scattered between the layers. According to the anti-track bituminous pavement cooling structure, a pavement structure actively carries out temperature control on a bituminous pavement, andpavement tracks are reduced by reducing the temperature of the intermediate face layer and the lower face layer of the bituminous pavement. According to the anti-track bituminous pavement cooling structure, the bituminous pavement structure with the low-heat conduction upper face layer, the heat storage intermediate face layer and the high-heat-conduction lower face layer is adopted, the pavementtemperature is reduced to the maximum degree through heat induction and phase change heat storage, and the cooling effect is remarkable. According to the anti-track bituminous pavement cooling structure, heat insulation fibers are added to the material of the low-heat conduction upper face layer, the high-temperature performance of a mixture can be improved while the heat conduction performance ofthe pavement, and the anti-track capacity of the upper face layer is improved.

The present invention relates to a method of writing data on a master substrate (10) for optical recording, the master substrate comprising a recording layer (12) and a substrate layer (14), and the recording layer comprising a phase-change material the phase of which can be transferred from crystalline to amorphous by projecting light on the recording 5 layer, the method comprising the steps of: writing a first amorphous mark (32) from a plurality of amorphous marks on the master substrate by at least one write pulse, and providing a cooling gap before the next amorphous mark (32) will be written.

The invention belongs to the technical field of airplane fuel heat managing, and particularly relates to a differential pressure type self-adjusting valve. The valve comprises a shell, a base, a valvebody, a top cover and a piston. The shell is provided with a first connecting part, a second connecting part and a third connecting part, the third connecting part is provided with a cavity C, a baseis arranged in the shell, the base is connected with the second connecting part, the base is provided with a cavity B, a valve connecting part of the valve body is in abut joint with the base, a center shaft is sleeved with a first spring, one end of the top cover is connected with the first connecting part of the shell, the other end of the top cover is provided with a twisting-in type pipe joint, a piston head of the piston is arranged in the first connecting part of the shell and is in abut joint with the top cover, a cavity A is formed between the head of the piston and the twisting-in type pipe joint, a piston rod penetrates through a first through hole of the base and a second through hole of a valve body, the ladder part of the piston rod is in abut joint with the first spring, thepiston is sleeved with a second spring, and the two ends of the second spring are limited through the head of the piston and the base correspondingly. According to the self-adjusting valve, the opening degree of the valve can be self-adjusted, and the cooling property can be improved.

The invention relates to a forming structure of the fluorescent powder colloid of a light-emitting module and a manufacture method thereof. The manufacture method comprises the following steps of: forming a circuittopology line on the surface of a circuit board; arranging a plurality of line points on the circuittopology line; then, respectively and electrically connecting electronic elements and a plurality of luminescent grains with the line joints; encircling the exteriors of the plurality of luminescent grains on the surface of the circuit board with a colloid ring; coating in a fixed range by the encirclement of the colloid ring with fluorescent powder colloid so that the visible light-emitting surfaces of the luminescent grains and the surface of the circuit board between the adjacent sides of the luminescent grains are coated with the fluorescent powder colloid; and roasting to form the light-emitting module. In the manner, the fluorescent powder colloid coated on the surface of the circuit board can generate a ductile surface light source because of a light overlapping area formed by lateral light between the adjacent sides of the luminescent grains. The fluorescent powder coating manner can improve the luminescence efficiency, the ray casting illumination and the luminescence evenness.

The invention relates to a heat dissipation module of a circuit board. The heat dissipation module comprises a main circuit board, a first heat dissipation base, a heat-conducting fin and a pneumatic pump, wherein the first heat dissipation base is arranged at the upper side of the main circuit board and is provided with an air inlet, an air vent and an air runner communicated with the air inlet and the air vent. In addition, the heat-conducting fin is clamped between the main circuit board and the first heat dissipation base; the pneumatic pump is connected to the air inlet; heat accumulated in the main circuit board is conducted to the first heat dissipation base by virtue of the heat-conducting fin; airflow generated by the pneumatic pump flows through the air runner so as to take away the heat accumulated in the first heat dissipation base, so that a heat source generated by the main circuit board can be effectively reduced.

The invention relates to the technical field of carbon fiber production, and discloses a pre-oxidation furnace for carbon fiber production. The pre-oxidation furnace comprises an outer sleeve, tows, an air blower and a heater, wherein an air collecting hole is formed in the top of an inner cavity of the outer sleeve; the air collecting hole communicates with the air blower through a guide pipe; and the air blower communicates with the heater through a guide pipe. Through the arrangement of a supporting pipe and a movable plate, when hot air is injected into the right side of the movable plate,the movable plate is pushed to move leftwards after the pressure becomes larger and larger and reaches a certain pressure value, a conical nozzle is movably connected with a high-temperature-resistant rubber sleeve II in a sleeved mode, a ventilation groove channel in the supporting pipe is opened, the hot air on the right side of the movable plate is ejected leftwards in parallel with relativelyconstant pressure along a ventilation groove to heat the tows, the hot air and the tows are in a horizontal state, a certain temperature gradient is presented in an oxidation furnace from right to left, and the temperature is sequentially decreased from right to left, so that the tows are gradually heated and pre-oxidized after entering the oxidation furnace from the left side of the oxidation furnace.

The invention relates to the technical field of semiconductor packaging, and discloses a packaging structure and a packaging method of a semiconductor chip. The packaging structure of the semiconductor chip comprises a wafer, an insulation structure and a conductive part. A functional area and electrodes are arranged on the first surface of the wafer, the electrodes are distributed at intervals in the circumferential direction of the functional area, and the side walls, away from the functional area, of the electrodes are obliquely arranged; the insulating structure covers the first surface, one side of the insulating structure facing the wafer is provided with an accommodating space, the functional area is arranged between the accommodating space and the first surface, and the side wall of the insulating structure is obliquely arranged and is coplanar with the side wall of the electrode away from the functional area to form a cutting slope inclining towards the middle of the insulating structure; and the conductive part covers the cutting inclined surface and is electrically connected with the electrode, and the conductive part extends to the end surface, opposite to the wafer, of the insulating structure along the outer contour of the insulating structure. According to the invention, the conductive part is of a planar structure on the side wall of the chip, so that the number of inflection points on the conductive part is reduced, and the structural strength and durability of the conductive part are ensured.

The invention discloses a novel energy-saving lamp. The novel energy-saving lam comprises a lamp holder, a ballast cover, a lamp filament, a tube, an energy-saving electronic rectifier and a tube connected thermal protection shield, wherein the lamp filament is installed in the tube; rare earth powder is sprayed on the inner wall of the tube; the energy-saving electronic rectifier is installed in the ballast cover; the tube connected thermal protection shield is arranged at the combing part of the tube and the ballast cover; a screw connecting column and a lamp wick wire jacket base are arranged on the upper end surface of the tube connected thermal protection shield; a cavity is arranged at the lower end of the tube connected thermal protection shield; a positioning base and a control system are arranged in the cavity; a radiator is arranged in the tube connected thermal protection shield; heat emission holes are formed in the tube connected thermal protection shield; and the radiator is connected with the control system. The novel energy-saving lamp has the advantages that the tube connected thermal protection shield is arranged at the combining part of the tube and the ballast cover and adopts a rotatable structure, and a self-locking buckle is arranged on the inner wall of the tube connected thermal protection shield, so that the novel energy-saving lamp can not only emit heat inside the tube and reduce accumulated heat heating inside the energy-saving lamp, but also effectively prevent mosquitoes and dust from entering the lamp and increase the service life of the tube.

A method for manufacturing an embedded package comprises the steps of: coupling at least one first embedded body including at least one connection port with a first circuit substrate and packaging the first embedded body and the first circuit substrate to form a package; and exposing the connection port of the package on an outer side of the package for other electronic carriers to couple with. The invention can overcome the disadvantage of the conventional System in Package manufacturing process which integrally packages multiple ICs in a same package to result in discard of the entire package because of failure of a single IC. The method of the invention makes assembly simpler, expansion, test and replacement of IC components easier, and also can reduce manufacturing time and accumulated heat, lower the cost and improve yield rate.