Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device

A technology of copper foil with carrier and printed wiring board, which is applied in the fields of printed circuit manufacturing, printed circuit, electronic equipment, etc., can solve the problem of reduced adhesion and achieve the effect of fine circuit formation
CN106455342AActive Publication Date: 2017-02-22JX NIPPON MINING & METALS CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JX NIPPON MINING & METALS CORP
Publication Date
2017-02-22

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Abstract

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2-D1 is 0.30 to 3.83 [mu]m, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the carrier and the interlayer, and D2 is the maximum thickness of the layer remaining on a bismaleimide-triazine resin substrate in case of detaching the carrier after the carrier-attached copper foil is laminated to the resin substrate from the ultrathin copper layer side by being heat pressed under a pressure of 20 kgf / cm2 at 220 DEG C for 2 hours.
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Description

technical field

[0001] The present invention relates to a method for manufacturing copper foil with a carrier, a laminate, a printed wiring board, and an electronic device. Background technique

[0002] A printed wiring board is usually produced through a step of forming a conductive pattern on the surface of the copper foil by etching after bonding an insulating substrate to copper foil to form a copper-clad laminate. With the increasing demand for miniaturization and high performance of electronic equipment in recent years, high-density mounting of mounted parts or high frequency of signals has been continuously developed, and the miniaturization of conductor patterns (fine pitch) is required for printed wiring boards. ) or high-frequency response, etc.

[0003] In response to fine-pitching, the industry currently requires copper foil with a thickness of 9 μm or less, and a further thickness of 5 μm or less. However, due to the low mechanical strength of this type of ultr...

Claims

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