Method for manufacturing copper foil with carrier, method for manufacturing copper-clad laminate, method for manufacturing printed wiring board and method for manufacturing electronic device, and products thereof

A technology of copper foil with carrier and printed wiring board, which is applied in the manufacture of printed circuit precursors, printed circuits, printed circuit manufacturing, etc., and can solve problems such as poor insulation of circuit patterns and residual copper particles

Active Publication Date: 2016-03-09
JX NIPPON MINING & METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, even in printed wiring boards, if such an ultra-thin copper layer with a large outline (concave-convex, roughness) is used on a semiconductor package substrate required to form a particularly fine circuit pattern, undesired copper will remain during circuit etching. Necessary copper particles may cause problems such as poor insulation between circuit patterns

Method used

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  • Method for manufacturing copper foil with carrier, method for manufacturing copper-clad laminate, method for manufacturing printed wiring board and method for manufacturing electronic device, and products thereof
  • Method for manufacturing copper foil with carrier, method for manufacturing copper-clad laminate, method for manufacturing printed wiring board and method for manufacturing electronic device, and products thereof
  • Method for manufacturing copper foil with carrier, method for manufacturing copper-clad laminate, method for manufacturing printed wiring board and method for manufacturing electronic device, and products thereof

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Experimental program
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Effect test

Embodiment

[0331] Hereinafter, it demonstrates based on an experimental example. In addition, this experimental example is only an example, and is not limited to this example.

[0332] 1. Manufacture of copper foil with carrier

[0333] Copper foil with a carrier was produced by the following procedure.

[0334] First, long electrodeposited copper foil or rolled copper foil having the thickness described in Table 1 was prepared as a carrier.

[0335] Electrodeposited copper foil was produced under the following conditions.

[0336] (Electrolytic Bath Composition)

[0337] Cu: 80~120g / L

[0338] h 2 SO 4 : 80~120g / L

[0339] Cl: 20~80mg / L

[0340] Varnish: 0.1~6.0mg / L

[0341] (electrolysis conditions)

[0342] Liquid temperature: 55~65℃

[0343] Current density: 100A / dm 2

[0344] Electrolyte flow rate: 1.5m / s

[0345] As for the rolled copper foil, in Examples 9 and 12, refined copper (refined copper specified in JISH3100C1100) was used, and in Examples 10 and 11, oxygen-f...

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Abstract

The invention provides a method for manufacturing copper foil with carrier. The method comprises the following heating and processing steps: a copper foil with a carrier comprises a carrier, a middle layer, a ultrathin copper layer and a surface processing layer comprising a silane coupling processing layer, the copper foil with the carrier is performed a heating process for 1 hour to 8 hours at the heating temperature of 100 DEG C to 220 DEG C, or a heating process for 1 hour to 6 hours at the heating temperature of 100 DEG C to 220 DEG C, or a heating process for 2 hour to 4 hours at the heating temperature of 160 DEG C to 220 DEG C.

Description

technical field [0001] The present invention relates to a method of manufacturing copper foil with a carrier, a method of manufacturing a copper-clad laminate, a method of manufacturing a printed wiring board, a method of manufacturing an electronic device, a copper foil with a carrier, a laminate, and a printed wiring board and electronic machines. Background technique [0002] A printed wiring board is usually produced through a process of forming a conductor pattern on the copper foil surface by etching after bonding an insulating substrate and copper foil to form a copper-clad laminate. In recent years, with the miniaturization of electronic equipment and the increase in the demand for high performance, the high-density packaging of mounted parts and the high frequency of signals have been promoted, and the miniaturization of conductor patterns (narrow pitch) is required for printed wiring boards. ) or high-frequency response, etc. [0003] Corresponding to the narrow ...

Claims

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Application Information

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IPC IPC(8): H05K3/02
CPCH05K3/025H05K2203/0147H05K2203/0264C25D1/04H05K3/384H05K2203/0723
Inventor 森山晃正永浦友太
Owner JX NIPPON MINING & METALS CO LTD
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