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Lamination method for multi-layer flexible board and multi-layer flexible board

A flexible board and lamination technology, applied in the field of flexible boards, can solve problems such as easy deformation and wrinkling, achieve good coverage and combination, solve wrinkling, and have a wide range of applications.

Inactive Publication Date: 2016-05-11
SHENZHEN KINWONG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] In view of the above deficiencies in the prior art, the purpose of the present invention is to provide a method for laminating multilayer flexible boards and multilayer flexible boards, aiming to solve the problem that the existing multilayer flexible boards are prone to wrinkle and deformation during lamination. question

Method used

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  • Lamination method for multi-layer flexible board and multi-layer flexible board
  • Lamination method for multi-layer flexible board and multi-layer flexible board

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Embodiment Construction

[0021] The present invention provides a lamination method of a multi-layer flexible board and a multi-layer flexible board. In order to make the purpose, technical solution and effect of the present invention more clear and definite, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0022] see figure 1 , figure 1 It is a flow chart of a preferred embodiment of a lamination method of a multi-layer flexible board of the present invention, as shown in the figure, which includes steps:

[0023] S1: The flexible board is sequentially cut, drilled, and then made into graphics;

[0024] S2: On a flexible board 10 (combined with figure 2 ) on the graphic side with pure glue 11 to fit it up, and then cold press;

[0025] S3: After cold pressing, attach another flexible board 10 with graphics to the pure rubber 11 ...

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Abstract

The invention discloses a lamination method for a multi-layer flexible board and the multi-layer flexible board. The method disclosed by the invention is wide in application range, and can well solve the problem of wrinkling of copper foil for lamination of the multi-layer board with the copper foil outside; meanwhile, the flexible circuit board can be relatively well coated and combined through combination of an aluminum sheet and a PE film; the reliability is relatively well guaranteed; and the product yield is improved.

Description

technical field [0001] The invention relates to the field of flexible boards, in particular to a lamination method of a multilayer flexible board and the multilayer flexible board. Background technique [0002] Flexible board, its material is relatively soft, there are problems such as difficult to control the expansion and shrinkage during the lamination process, the core board is easily deformed, and the copper foil is wrinkled. This problem is currently the main difficulty in the lamination of multi-layer flexible board structures with copper foil on the outer layer. Conventional multi-layer flexible boards use silicone pads for cushioning. Although silicone pads are resistant to high temperatures and have good cushioning performance, they still suffer when applied to flexible boards, especially when the copper foil is on the outer layer. It is prone to the problem of copper foil wrinkling. Therefore, the prior art still needs to be improved and developed. Contents of...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K1/02
CPCH05K3/4611H05K1/0298H05K2203/06
Inventor 张霞王俊曾平
Owner SHENZHEN KINWONG ELECTRONICS
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