Press-fitting method and lamination structure for flexible circuit board

Abstract

The invention discloses a press-fitting method and a lamination structure for a flexible circuit board. The press-fitting method comprises the steps of laying a buffer layer on the lower carrier plate of a press-fitting machine; paying a lamination layer on the buffer layer, wherein the lamination layer comprises brown paper, a filling layer, a release layer, a circuit board to be press-fit, and a release layer, a filling layer and brown paper stacked on the circuit board; repeatedly laying a number of lamination layers in the step S20 from the bottom up; laying a buffer layer on the topmost lamination layer; and starting the press-fitting machine for hot-pressing, wherein each lamination layer and the corresponding buffer layer, as well as each two adjacent lamination layers are separated by a thermal-conductive rigid pressure plate, and the filling layers can be melted after heating to fill the gaps between the brown paper and the release layers. According to the press-fitting method, the melted PE liquid can be adsorbed, thus the cleanup work after press-fitting is reduced; the consistency of different batches of products can be effectively ensured, thus control on the product precision is facilitated; the layer number of the circuit boards in one time of press-fitting is increased, thus the production efficiency is greatly enhanced.

Description

technical field [0001] The invention relates to the field of manufacturing flexible circuit boards, in particular to a lamination method for flexible circuit boards and a lamination structure for realizing lamination of circuit boards. Background technique [0002] Flexible circuit board is a printed circuit board with high reliability and excellent flexibility made of polyimide or polyester film as the base material, referred to as soft board or FPC, which has high wiring density and light weight. The characteristics of lightness and thin thickness have been welcomed by people. Flexible circuit boards include single-layer boards and multi-layer boards. Multi-layer boards are made by crimping the circuit board as the main body and other multi-layer auxiliary materials into a whole. Most of the crimping of multi-layer boards is completed through the pressure transmission process. The pressed multi-layer materials are stacked vertically, and then the stacked circuit boards ar...

AI Technical Summary

Problems solved by technology

[0003] 1. The thickness of silica gel is relatively thick, and the pressing stroke of the press transmission machine is fixed, so the use of silica gel will increase the total thickness of the circuit board, resulting in a corresponding reduction in the number of superimposed layers, thereby reducing production capacity;

[0004] 2. The deformation of the silica gel during the pressing process is large, which is not conducive to ensuring the accuracy;

[0005] 3. Due to the high cost of silica gel, it is usually replaced after multiple uses, and the physical and chemical properties of silica gel will change with the increase in the number of uses, which indirectly leads to differences between different batches of products. Difficult to control product quality

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