Probe skates for electrical testing of convex pad topologies

Abstract

A probe for engaging a conductive pad is provided. The probe includes a probe contact end for receiving a test current, a probe retention portion below the contact end, a block for holding the probe retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a generally planar self-cleaning skate disposed perpendicular below the contact tip. The self-cleaning skate has a square front, a round back and a flat middle section. The conductive pad is of generally convex shape having a granular non-conductive surface of debris and moves to engage the skate, whereby an overdrive motion is applied to the pad causing the skate to move across and scrub non-conductive debris from the pad displacing the debris along the skate and around the skate round back end to a position on the skate that is away from the pad.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation-in-part application of the inventor's prior U.S. application Ser. No. 11 / 480,302 filed Jun. 29, 2006, for PROBES WITH SELF-CLEANING SKATES FOR CONTACTING CONDUCTIVE PADS, which claims the benefit of U.S. application Ser. No. 10 / 850,921 filed on May 21, 2004, now U.S. Pat. No. 7,148,709, U.S. application Ser. No. 10 / 888,347 filed on Jul. 9, 2004 and U.S. application Ser. No. 11 / 450,977 filed on Jun. 9, 2006.FIELD OF THE INVENTION[0002]The invention relates generally to an apparatus and method of using contacting tips of probes in scrubbing and electrical testing of a device under test. More particularly, the invention relates to an apparatus and method of using contacting tips having probe skates with geometries that provide self-cleaning and a reduction in sensitivity to overdrive motion.BACKGROUND[0003]Semiconductor wafer testing before dicing is a necessary and critical process step. Such testing provi...

AI Technical Summary

Benefits of technology

"The present invention provides a probe with a self-cleaning tip for engaging a conductive pad. The probe includes a contact end for receiving a test current, a retention portion, a block for holding the retention portion, a probe arm, a probe contact tip, and a generally planar self-cleaning skate. The skate has a generally square front end, a generally round back end, and a flat middle section therebetween. The skate is positioned above the conductive pad, and overdrive motion is applied to the conductive pad causing the skate to scrub debris from the conductive pad. The method is advantageous for removing debris from the skate and cleaning the conductive pad."

Problems solved by technology

A problem exists with a non-conductive layer of debris on the pad such as a non-conductive oxide layer impeding the conductive pad from receiving the test signal, where the debris is an artifact of the fabrication process.

Numerous problems arise from this method such as controlling the probe scrubbing action, managing undesirable debris accumulation on the probe tip, and the added need for a complicated and invasive probe cleaning processes to remove the debris from the probe tips.

A probe is often too sensitive to the overdrive motion from the pad, causing a scrub depth that is too deep that not only removes a portion of the non-conductive layer, but also damages or breaches the conductive pad, thus rendering the wafer unusable.

Debris accumulation on the probe tip degrades the electrical continuity between the probe and conductive pad, often times restricting the test signal and providing erroneous test results, where implementation of an undesirable test redundancy may then become necessary.

Such a technique not only disrupts the fabrication throughput, but also degrades the probe tip, resulting in shortened utility of the probes and requiring premature replacement.

While such an alloy lends itself for creating a tip that is more robust for scrubbing, the need to disrupt fabrication throughput for a probe tip cleaning process still exists.

Further, the geometry of the contact bump made from the alloy nub lends itself for undesirable accumulation of debris, thus necessitating relatively frequent cleaning.

Unfortunately, such geometry has been shown to lack scrubbing control and damage the pad due to the probe having a hyper-sensitivity to overdrive motion.

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