The invention discloses a
wafer whose back side is coated with
adhesive through adopting the silk
screen printing and a process for preparing a back
electrode of the
wafer, the preparation process comprises the following five steps: preparing a
wafer, and keeping the wafer flat in the subsequent steps, adopting the silk
screen printing to coat the
adhesive on the back side of the wafer and
drying, arranging the wafer which is coated with the
adhesive on a scribing blue film, separating, adhering and solidifying the separated wafer. The process eliminates the
flanging phenomenon which easily occurs during the preparation of the wafer, the dosage of bonding
slurry is reduced by one-third, the cost of the bonding
slurry is greatly reduced by about ten percent, and the flatness of the
coating surface of a back
electrode of the
chip is guaranteed, a scribing is easily
cut, the intensity of the combination between the
chip and the
electrode during the eutectic
welding is guaranteed, and the production time and cost are greatly saved. The wafer whose back side is coated with the adhesive of the invention can be stored for a long time, and the control to the quality of the stock is improved.