Press fit method for high-voltage-resistant PCB with thick copper plate

A high-voltage and pressure-resistant technology, which is applied in the lamination field of high-voltage-resistant thick copper PCBs, can solve problems that affect the production of plug-ins and subsequent circuit boards, and poor high-voltage resistance. board effect

Inactive Publication Date: 2016-04-06
SHENZHEN SUNTAK MULTILAYER PCB
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention lies in the existing printed circuit boards with thick copper plates. The dielectric layer mainly adopts FR-4 material, which has poor

Method used

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Embodiment

[0027] The invention provides a lamination method of a high-voltage-resistant thick copper PCB, which comprises the following steps:

[0028] S1. Cutting the material, cutting the outer layer of copper foil, polyimide medium, pure rubber prepreg, and polyimide copper-clad laminate into pieces according to the required size, and the thickness of the copper layer on the surface of the polyimide copper-clad laminate is not less than 2OZ;

[0029] S2. Inner layer graphics production, the polyimide core board is used to make inner layer circuit graphics by conventional technology. Before etching, the polyimide core board is connected to a belt board with adhesive tape, and the length of the belt board is not less than that of polyimide The length and width of the core board are not less than 15cm, the thickness is not less than 1mm, and the thickness of the belt board is greater than the thickness of the polyimide core board. When passing the horizontal etching line, the belt board...

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Abstract

The invention discloses a press fit method for a high-voltage-resistant PCB with a thick copper plate. The method includes the following steps: S1, cutting, i.e., cutting an outer-layer copper foil, a polyimide medium, pure-glue prepreg and a polyimide copper-clad plate according to required dimensions; S2, inner-layer pattern making; and S3, conducting press fit after plate lamination, the press fit including the first heating stage at the temperature of 100-140 DEG C, the second heating stage at the temperature of 140-180 DEG C, the third heating stage at the temperature of 180-220 DEG C, a warm-keeping stage, the first cooling stage at the temperature of 220-150 DEG C and the second cooling stage at the temperature of 150-100 DEG C. Conventional FR-4 prepreg is replaced by a polyimide material that has higher glass transition temperature and exhibits higher resistance to voltage, so a PCB with a thick copper plate is made to have the excellent resistance to voltage, and polyimide having high glass transition temperature can effectively ensure that resin is fully filled among lines during press fit. Moreover, press fit parameters can be adjusted and the operating time of a high-temperature and high-voltage stage can be prolonged, thus helping polyimide materials to fully fill line gaps in a high-temperature and high-voltage condition.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and in particular relates to a lamination method of a high-voltage-resistant thick copper PCB. Background technique [0002] In recent years, with the continuous development and maturity of the consumer electronics market, consumers have also put forward higher requirements for electronic products. As an important component of electronic products, power supplies have naturally become one of the focuses of attention. Printed circuit boards (PCBs) with thick copper plates (copper foil thickness greater than or equal to 2OZ) are widely used in the production of high-power, high-current central electrical power supply circuit boards, which have aging resistance, high and low temperature cycle resistance and glass transition temperature advanced features. [0003] At the same time, for printed circuit boards with thick copper plates, generally based on the requirements for th...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/4632H05K2203/06
Inventor 王佐王淑怡
Owner SHENZHEN SUNTAK MULTILAYER PCB
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