Ultra-multi-layer ultra-deep-cavity LTCC substrate manufacturing technology

A manufacturing process, ultra-multi-layer technology, applied in multi-layer circuit manufacturing, printed circuit manufacturing, circuit lamination, etc.

Active Publication Date: 2015-01-14
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the number of green ceramic layers of domestic LTCC substrates generally does not exceed 35 layers, and the cavity depth is less than 2.5mm. Internationally, there are only reports on 80-layer green ceramic LTCC substrates for packaging.

Method used

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  • Ultra-multi-layer ultra-deep-cavity LTCC substrate manufacturing technology

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Embodiment Construction

[0052] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0053] 1. Technical solution

[0054] The concise technical scheme of the patent application for the present invention is:

[0055] 1) LTCC substrate with cavity ( Figure 1a , Figure 1b , unit substrate) a total of 90 layers of raw porcelain, of which the bottom plate 1 is 18 layers, and the cavity 2 is 72 layers. The size is 42.50mm (length) × 42.50mm (width) × 6.94mm (depth); the upper and lower limit deviation of the length and width of the substrate and cavity is 0.25mm, the upper and lower limit deviation of the substrate thickness and cavity depth is 0.10mm, and the cavity The upper and lower limit deviation of side wall 3 wall thickness is 0.15mm;

[0056] 2) DuPont 951PT type LTCC ...

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Abstract

The invention discloses an ultra-multi-layer ultra-deep-cavity LTCC substrate manufacturing technology. A conventional solid flat plate LTCC substrate machining technology is broken through, after hole filling and screen printing, a cavity window in an unglazed porcelain layer is formed in a laser-cutting-up mode, the non-operability problem of hole filling and screen printing technologies on a large-size window unglazed porcelain piece is avoided, and the contraction amount and the unevenness of an unglazed porcelain piece obtained after filling and printing before piece stacking are lowered. After cofiring, an abrasive wheel cuts a ripe porcelain plate in a rotating mode, and the fact that an LTCC substrate which is regular in shape, accurate in size, thin in wall and ultra-deep in cavity is machined is guaranteed. Network multi-through-hole connecting is used in an ultra-deep-cavity ultra-multi-layer unglazed porcelain side wall, and the connecting pass rate is guaranteed through redundancy. Through a lamination tool set and an optimized overlying technology method, the lamination and stacking technology of the deep-large-cavity ultra-thick LTCC substrate is guaranteed. An abrasive wheel dicing saw is used for opposite cutting of a ripe porcelain body LTCC substrate from the bottom face and the top face of the ultra-thick substrate, and the problem that the maximum thickness can only reach 5 mm during blade unglazed porcelain hot cutting and abrasive wheel ripe porcelain rotating cutting is solved.

Description

[0001] technical field [0002] The invention relates to a manufacturing process of an LTCC substrate, in particular to a manufacturing process of an ultra-multilayer ultra-deep cavity LTCC substrate. Background technique [0003] LTCC (Low Temperature Co-fired Ceramics) substrate has remarkable characteristics such as high three-dimensional wiring density, embedded integrated components, good high-frequency transmission performance, strong environmental adaptability, and high long-term reliability. It has become a typical advanced substrate for modern microelectronic components. Multilayer interconnection LTCC substrates with cavities are high-performance and high-density components such as 3D-MCM (three-dimensional multi-chip components), SIP (system-in-package), MEMS (micro-electromechanical systems) devices, and T / R (transmit / receive) components. Integrate the important components of the product, which not only makes the assembly and packaging density of the product high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/40
CPCH05K3/4038H05K3/4611H05K3/4697H05K2203/06
Inventor 何中伟周冬莲俞瑛杜松濮嵩徐姗姗
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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