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Resin composition, prepreg, resin sheet, and metal foil-clad laminate

A resin composition and compound technology, applied in the fields of resin sheets, metal foil-clad laminates, prepregs, and resin compositions, can solve the problem of lowering the glass transition temperature of resin compositions, harmful nitrogen oxides, and deteriorating heat resistance. and other problems, to achieve the effects of excellent electrical properties, high industrial practicability, and excellent moisture absorption and heat resistance.

Inactive Publication Date: 2015-01-07
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of nitrogen-containing compounds, harmful nitrogen oxides may be generated, and in the case of conventionally used phosphorus-containing compounds, when the amount of addition is increased to impart high flame retardancy, heat resistance deteriorates, that is, The problem of lowering the glass transition temperature (Tg) of the resin composition (for example, refer to Patent Documents 6 and 7)

Method used

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  • Resin composition, prepreg, resin sheet, and metal foil-clad laminate
  • Resin composition, prepreg, resin sheet, and metal foil-clad laminate
  • Resin composition, prepreg, resin sheet, and metal foil-clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0146] Vinylbenzyl-modified polyphenylene ether (OPE-2St1200, polyphenylene oligomers with vinyl groups at both ends (2,2',3,3',5,5'-hexamethylbiphenyl- Reaction product of 4,4'-diol-2,6-dimethylphenol polycondensate and chloromethylstyrene), manufactured by Mitsubishi Gas Chemical Co., Ltd., number average molecular weight: 1187, vinyl equivalent: 590g / eq.) 55 parts by mass, 2.0 parts by mass of a phosphorous cyanate compound (FR-300, produced by Ronza Japan Co., Ltd., cyanate equivalent: 187g / eq.) in which m is 2 in the above formula (13), the above formula (14 ) in which n is a mixture of 3 to 6, 18.8 parts by mass of a cyclic phosphazene compound (FP-100, manufactured by Fushimi Pharmaceutical Co., Ltd.), cresol novolak type epoxy resin (N680, manufactured by DIC CORPORATION, epoxy equivalent: 215g / eq.) 8.9 parts by mass, bisphenol A type cyanate compound (CA210, manufactured by Mitsubishi Gas Chemical Co., Ltd., cyanate equivalent: 139g / eq.) 12.8 parts by mass, styrene ol...

Embodiment 2

[0155] The compounding quantity of the phosphorus cyanate compound (FR-300) was changed to 5.0 mass parts, the compounding quantity of the cyclic phosphazene compound (FP-100) was changed to 17.0 mass parts, and the cresol novolak type epoxy The compounding quantity of the resin (N680) was changed to 9.3 parts by mass, the compounding quantity of the cyanate compound (CA210) was changed to 11.2 parts by mass, and the compounding quantity of manganese octoate was changed to 0.043 parts by mass. Example 1 was carried out in the same manner. Table 1 shows various physical property values ​​of the obtained double-sided copper-clad laminate.

Embodiment 3

[0157] The compounding quantity of vinylbenzyl-modified polyphenylene ether (OPE-2St1200) was changed to 53 mass parts, the compounding quantity of phosphorus cyanate compound (FR-300) was changed to 3.0 mass parts, and the cyclic phosphine The compounding quantity of the nitrile compound (FP-100) was changed to 18.0 mass parts, the compounding quantity of the cresol novolak type epoxy resin (N680) was changed to 7.0 mass parts, and the compounding quantity of the cyanate compound (CA210) was changed to The amount was changed to 12.4 parts by mass, and 4.6 parts by mass of bisphenol A epoxy resin (E-1051, manufactured by DIC CORPORATION, epoxy equivalent: 475g / eq.) was blended, and an imidazole compound (2P4MZ, Shikoku Chemicals Co., Ltd. system) 0.10 parts by mass instead of manganese octoate, and carried out in the same manner as in Example 1 except that. Table 1 shows various physical property values ​​of the obtained double-sided copper-clad laminate.

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Abstract

A resin composition has high flame retardancy and excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and single-layer or laminated sheet, a metal foil-clad laminate using the prepreg, and the like. The resin composition has polyphenylene ether (A) having a number average molecular weight of 500 to 5000, a phosphorus-containing cyanate ester compound (B) represented by formula (13), a cyclophosphazene compound (C), a halogen-free epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and / or substituted styrene, and a filler (G), wherein a content of the phosphorus-containing cyanate ester compound (B) is 1 to 10 parts by mass based on 100 parts by mass of a total of the (A) to (F) components. wherein m represents an integer of 1 to 3.

Description

technical field [0001] The present invention relates to a resin composition, a prepreg, a resin sheet, a metal foil-clad laminate, and the like, and more particularly to a prepreg, a metal foil-clad laminate, and the like used in printed circuit boards forming electrical circuits. Background technique [0002] In recent years, information terminal devices such as personal computers and servers, Internet routers, optical communication and other communication devices are required to process large-capacity information at high speed, and the speed and frequency of electrical signals are advancing. Along with this, in addition to properties such as flame retardancy, heat resistance, and peel strength with copper foil, etc. that have been required for printed circuit board materials used for them, low dielectric constants are also required. Various attempts have been made on the composition of the resin composition in order to meet these characteristic requirements for low dielect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12B32B15/08B32B27/00C08J5/24C08K5/5313C08K5/5399C08L25/04C08L63/00H05K1/03
CPCC08L2205/035C08J2475/00C08K5/5399C08K5/5313C08L63/00H05K2201/0209H05K1/0366C08L2203/206C08L71/126B32B2305/076Y10T156/10C08L25/04C08J2371/12C08J2425/06H05K2203/06H05K3/44B32B2260/046C08J2463/04H05K1/056B32B15/14C08L2201/02C08L71/12B32B15/08H05K1/0353C08J5/24C08J2485/02C08K5/315C08K3/36C08L25/06C08L63/04Y10T428/31522Y10T428/31529Y10T428/31511C08J5/244C08J5/249C08F283/08C08G65/335C08K3/013B32B27/00H05K1/0373
Inventor 伊藤祥一深泽绘美上野至孝柳沼道雄
Owner MITSUBISHI GAS CHEM CO INC
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