The invention relates to a printed circuit board with a porous structure resistance layer, and a manufacturing method for the printed circuit board. The invention solves a technical problem that a conventional printed circuit board is too small in square resistance. The method comprises the following steps: 1, pasting a first light resistance layer on a conductor layer on the printed circuit board, carrying out the first exposure, first development, first etching and first light resistance removing; 2, carrying out the roughening and catalyst adsorption of the surface of the printed circuit board; 3, pasting a second light resistance layer, carrying out second exposure and second development, and forming a light resistance protection layer in a region where no resistor needs to be deposited, so as to prevent the deposition of a resistor layer; 4, carrying out the deposition of the resistor layer through employing a chemical plating method; 5, removing a protection layer. The method is advantageous in that the resistor of a finished product circuit board manufactured through the method is in a porous structure, is large in square resistance, and is good in thermal stability; moreover, the method is simple, and is high in production efficiency of the circuit board; the adjustment of the value of the resistance of the resistor layer can be achieved through thickness adjustment and porosity adjustment.