Printed circuit board processing method adopting etching process for forming backdrilled holes

A processing method and circuit board technology, applied in printed circuit, printed circuit, pattern and photolithography, etc., to achieve clean and thorough etching, low scrap rate and good product quality

Inactive Publication Date: 2017-01-25
开平依利安达电子第三有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, in the production of multi-layer circuit boards, the back drilling of L1-L2 or Ln-Ln-1 is performed by the drilling machine with controlled depth drilling. However, due to the limited accuracy of the machine, the required dielectric thickness in many cases is often contrary to

Method used

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Embodiment Construction

[0015] A kind of circuit board processing method of making back drilling with etching method of the present invention, comprises the following steps:

[0016] 1) Complete normal drilling and electroplating on the surface of the circuit board;

[0017] 2) Paste a layer of dry film on the surface of the circuit board; the dry film is usually a polymer compound, which can produce a polymerization reaction after being irradiated by ultraviolet rays, forming a stable substance attached to the board surface, so as to prevent electroplating and etching function;

[0018] 3) Use water to remove the dry film at other positions except for the holes that need to be back drilled, leaving only the dry film at the position of the hole that needs to be back drilled, and reserve the liquid on the hole to pass through the hole; a developer can be used as a fade Membrane potion, the effect is better;

[0019] 4) There is no dry film on the circuit board and tin plating in the hole; the chemic...

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PUM

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Abstract

The invention discloses a printed circuit board processing method adopting an etching process for forming backdrilled holes. The method comprises the following steps: 1) completing normal drilling and electroplating on the surface of a printed circuit board; 2) pasting a layer of dry film on the surface of the printed circuit board; 3) removing the dry film in positions other than to-be-backdrilled positions with a chemical, only reserving the dry film in positions to be backdrilled, and reserving chemical via holes in the dry film at the holes; 4) performing tinning in the holes and in positions without the dry film on the printed circuit board; 5) removing the dry film with the chemical and exposing the to-be-backdrilled positions; 6) etching the holes to the required depth; 7) removing the tin layer on the printed circuit board and the hole walls. The etching process replaces backdrilling, etching is more clean and thorough and has no requirements for the medium thickness, Stub is more uniform, and accordingly, signals of the printed circuit board cannot be influenced, the product quality is good, and the rejection rate is low.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, in particular to a circuit board processing method for making back-drilled holes by an etching method. Background technique [0002] At present, in the production of multi-layer circuit boards, the back drilling of L1-L2 or Ln-Ln-1 is drilled through the drilling machine to control the depth. However, due to the limited accuracy of the machine, in many cases the required medium thickness It is often contrary to the dielectric thickness of the signal design. At the same time, due to the influence of plate curvature and thickness uniformity during mechanical drilling, the stub residue during back drilling is quite different, which will have a greater impact on the signal of the circuit board. Contents of the invention [0003] At present, in the production of multi-layer circuit boards, the back drilling of L1-L2 or Ln-Ln-1 is drilled through the drilling machine to control the ...

Claims

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Application Information

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IPC IPC(8): H05K3/42
CPCH05K3/429H05K2201/095H05K2203/05
Inventor 张伟连
Owner 开平依利安达电子第三有限公司
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