Making method of outer layer patterns of local gold-plating printed plate

Abstract

The invention provides a making method of outer layer patterns of a local gold-plating printed plate. A printed plate is conducted to conventional plate planting and thickening and is ground to be smooth, so that outer layer etched base copper is in accordance with the requirements on the thickness of a printed plate finished conductor. A gold-plating resistant dry film is bonded on the printed plate, dry film window cutting is performed in a gold-plating pattern area, and then electrogilding treatment and stripping are performed. Tin-plating resistant dry film is bonded on the printed plate, dry film window cutting is performed in an area corresponding to pattern design other than the gold-plating area, patterns exposed after window cutting are conducted to tin plating, so as to be served as a tin plate of an alkaline etching resistant protective layer, and stripping is performed after tin plating. The gold-plating layer and the tin layer are both served as etching resistant layers, and outer layer conductor patterns are prepared through an alkaline etching technology. Peelable blue gel is screen-printed on the outer layer gold-plating conductor patterns and is cured, so that the gold-plating area is protected, and then the tin layer is conducted to tin stripping treatment. Solder resist is prepared and other surface treatment is performed.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, and more specifically, the invention relates to a method for making a pattern on the outer layer of a partially gold-plated printed board. Background technique [0002] In order to meet the requirements of different functions on the surface of printed boards, more and more printed boards require targeted combination of two or more surface treatments. Moreover, because the gold-plated surface layer has low contact resistance, anti-oxidation, and high surface smoothness, and the hard gold has excellent wear resistance and soft gold has good solderability, so the surface treatment of gold-plated (including soft gold and hard gold) has been printed. Wide attention and application in the board industry. But at the same time, the cost of gold-plating treatment is high, and the gold-plated small-sized pads are prone to defects of gold layer embrittlement after soldering. [0003] The...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a method for making the outer layer pattern of a partially gold-plated printed board in view of the above-mentioned defects in the prior art, so as to avoid the problems of many lead-in process lines and difficult process line stripping in the subsequent partial gold-plated surface treatment

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