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76results about How to "Solve glitches" patented technology

Screen printing method, screen structure and pressing marker

The invention relates to the technical field of screen printing and discloses a screen printing method. The screen printing method includes: providing a screen, wherein the screen comprises a screen frame and screen cloth stretching tight on the screen frame, the screen cloth is provided with a pressing figure mold forming a plurality of grids by cross arrangement of a plurality of parallel warps and a plurality of parallel wefts, and the warps and the wefts are mutually vertical; providing a substrate, attaching the screen to the upper surface of the substrate, applying coating materials on the position corresponding to the pressing figure mold of the screen cloth, and using a scraper to press down to abut against the screen cloth prior to moving the scraper so as to enable the coating materials to be distributed according to the pressing figure mold, wherein the latitude line of the scraper and the pressing figure mold forms a first included angle, the longitude line of the scraper and the pressing figure mold forms a second included angle, and neither the first included angle or the second included angle is zero degree; removing the screen to form printing patterns on the substrate. The invention further provides a screen structure and a pressing marker, and reject ratio of screen printing can be reduced.
Owner:BOE TECH GRP CO LTD +1

Abrasive flow machining device capable of cleaning sharp edges and burrs at annular grooves in deep holes

The invention discloses an abrasive flow machining device capable of cleaning sharp edges and burrs at annular grooves in deep holes. The device comprises a frame support structure consisting of a base plate (1), a support plate (2) and a cover plate (3), wherein a base plate counter bore (4) and a cover plate counter bore (5) which are arranged towards the outer side are formed in the base plate (1) and the cover plate (3) respectively, a base plate through hole (6) and a cover plate through hole (7) are formed in centers of the base plate counter bore (4) and the cover plate counter bore (5) respectively, a pipe joint (8) penetrating through the base plate through hole (6) is inversely buckled in the base plate counter bore (4), a flow guide rod (9) penetrating through the cover plate through hole (7) is inversely buckled in the cover plate counter bore (5), a work piece (10) is arranged between the pipe joint (8) and the flow guide rod (9), an upper passing hole (11) and a lower passing hole (12) are formed in the flow guide rod (9) and the pipe joint (8) respectively, and flow guide pieces (13) are arranged at one end of the flow guide rod (9). According to the abrasive flow machining device, the problems that the burrs at the annular grooves in the deep holes cannot be cleaned with a traditional manual deburring method and machining cannot be performed on the sharp edges of the annular grooves in the deep holes are solved.
Owner:AVIC LIYUAN HYDRAULIC

Processing method for removing burrs from flexible printed circuit board region of rigid-flexible printed circuit board

The invention relates to a processing method for removing burrs from a flexible printed circuit board region of a rigid-flexible printed circuit board. The processing method comprises the following steps of expanding along the two sides of a flexible printed circuit board in a non-linking position in a flexible region to a waste material region for a certain dimension, and feeding by adopting a shaping milling cutter; and after uncovering, adopting laser cutting along the outline of the flexible printed circuit board in the non-linking position in the flexible region to remove an outward-expansion part. According to the processing method, the step of expanding along the two sides of the flexible printed circuit board in the non-linking position of the flexible region to the waste material region for a certain dimension is performed by the shaping milling cutter in advance; then uncovering is carried out, and by adopting laser cutting, the outward-expansion part is removed along the outline of the flexible printed circuit board in the non-linking position in the flexible region, so that manual repairing is not required; the high precision of the outline precision of the flexible printed circuit board is maintained; the problem of burrs on the two sides of the flexible printed circuit board in the flexible region is solved; and effects of low cost and no waste of material are achieved.
Owner:SHENZHEN SUNTAK MULTILAYER PCB

Production method of metallized semi-hole of printed circuit board

The invention provides a production method of a semi-hole of a printed circuit board. The method comprises the following steps that a, process production of the circuit board from cutting to surface treatment is completed to form a semi-hole production state board to be metallized; b, secondary drilling is conducted on the portions, on the two sides of the metallized semi-hole, of the hole wall, wherein the circuit board is fixed to a drilling machine through locating nails, a drill bit cuts in the hole wall in a rotating mode clockwise, that is to say, small holes are drilled in the portions,on the two sides of the semi-hole in the position to be milled later, of the hole wall, and hole wall copper is drilled to be broken; c, board edge milling is conducted on the metallized semi-hole, wherein a board milling program is acquired, the metallized hole edge is milled by a milling cutter clockwise to achieve a board milling movement, and the metallized semi-hole is formed; d, board milling is conducted on the unit edge, wherein the board milling program is acquired, the unit edge is milled according to normal operation parameters to achieve a board milling movement, the circuit boardis milled to small units, and a production board with the metallized semi-hole is formed. By means of the production method of the semi-hole of the printed circuit board, the burr problem is solved,the production process of the circuit board is shortened, the production cost is lowered, and the quality, the yield and the production efficiency are improved.
Owner:珠海精毅电路有限公司

Stamping device used for manufacturing plates with unequal thicknesses

The invention discloses a stamping device used for manufacturing plates with unequal thicknesses. The stamping device comprises a rack, a workbench, baffle plates, an upper combined tool, a lower combined tool and a feeding mechanism, wherein one pair of baffle plates is mounted on the workbench; a distance between one pair of baffle plates is inconsistent with width of the plates with unequal thicknesses; the upper combined tool comprises an upper tool apron and a plurality of regularly arranged height-adjustable upper tool bits mounted on the upper tool apron; each upper tool bit can be independently mounted on the upper tool apron in a telescopic mode; according to shapes and depths of upper grooves in the plates with unequal thicknesses, one or more upper tool bits extend out to form envelope surfaces matched with the upper grooves; the lower combined tool is similar to the upper combined tool in structure; and when grooves are separately formed in upper surfaces and lower surfaces of the plates with unequal thicknesses, the upper combined tool is matched with the lower combined tool to work. According to the stamping device disclosed by the invention, plates with unequal thicknesses are manufactured in a stamping mode, and a metal flow direction during plastic deformation is controlled through a clamp, so that materials can be saved while different kinds of plates with different depths are produced.
Owner:WUHAN UNIV OF TECH

Preprocessing method of flexible substrate

The invention relates to a preprocessing method of a flexible substrate. The flexible substrate includes a flexible substrate body and a glass base material; one side of the flexible substrate body isprovided with a protection film. The preprocessing method of the flexible substrate includes the following steps that the flexible substrate body is adopted, the side, away from the protection film,of the flexible substrate body is attached to the glass base material, a precut position is formed on the flexible substrate body, and the protection film covers the precut position; cutting is conducted at the precut position to form a cut; the protection film is removed, and the surface of the flexible substrate body is exposed; a structure film layer is produced on the surface of the flexible substrate body. It is unnecessary to add other production processes and conduct other processing operation on the cut, and thus the problem is effectively solved that in traditional technologies, burrsexist at the cut; after precutting, the protection film is removed, contamination caused by cutting chippings on the flexible substrate body can be effectively prevented, the process of washing a cutting line is omitted, technical production processes are reduced, the production time is saved, the product yield of a whole production procedure is increased, and the production efficiency of the whole production procedure is improved.
Owner:TRULY SEMICON

Wrapping method of warp knitting spacer fabric

The invention discloses a serging method for a warp-knitted spacer fabric, which relates to a serging technique for a fabric article and provides the serging method for the warp-knitted spacer fabric and a serging device for the warp-knitted spacer fabric. The covering device thereof is provided with two sets of sewing-machine folders. The first sewing-machine folder is provided with a fixing bracket, upper and lower ribbon slots, a zipper locating slot and upper and lower belt guides. The second sewing-machine folder is provided with a fixing bracket, a directing plate, a U-shaped pulling plate and a belt guide. The first sewing-machine folder is arranged on a sewing machine; one half of a zipper is fixed in the zipper locating slot and two ribbons are installed in the upper and lower ribbon slots; then the sewing machine sews one half of the zipper and the two ribbons together to obtain an edge-covered ribbon with one half of the zipper; the second sewing-machine folder is arranged on the sewing machine; the edge-covered ribbon with one half of the zipper is arranged into the second sewing-machine folder and pulled out through the belt guide; the core material of the warp-knitted spacer fabric is clung to the U-shaped pulling plate and the internal wall of the directing plate. The serging is finished under the traction of the sewing machine.
Owner:福建福联精编有限公司

Novel liquid crystal display screen of black matrix structure and preparation method thereof

The invention discloses a novel liquid crystal display screen of a black matrix structure. The novel liquid crystal display screen comprises two glass substrates. The inner surfaces of the two glass substrates are each provided with a layer of black mask. The two black masks on the two glass substrates are each provided with an ITO conductive layer. The ITO conductive layers are indium tin oxide electrodes used for displaying pixel patterns and wrap the black masks. A liquid crystal layer is arranged between the two ITO conductive layers. The upper end face and the lower end face of the liquid crystal layer are provided with matched alignment films. The upper end face of the upper glass substrate and the lower end face of the lower glass substrate are provided with an upper polaroid and a lower polaroid respectively. According to the liquid display screen, the problem that a short circuit is likely to be caused between two ITO electrodes is solved, transmission of light at the non-display pixel position, namely the gap between the ITO electrodes is blocked, the light transmittance of a non-display pixel is lowered, the contrast ratio of a display pixel to the non-display pixel is improved, the visual angle of the liquid crystal display screen is increased, the production yield is high, and the service life is long. The invention further discloses a preparation method of the liquid crystal display screen.
Owner:东莞通华液晶有限公司
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