The invention provides a production method of a semi-hole of a
printed circuit board. The method comprises the following steps that a, process production of the circuit board from
cutting to surface treatment is completed to form a semi-hole production state board to be metallized; b, secondary drilling is conducted on the portions, on the two sides of the metallized semi-hole, of the hole wall, wherein the circuit board is fixed to a drilling
machine through locating nails, a
drill bit cuts in the hole wall in a rotating mode
clockwise, that is to say, small holes are drilled in the portions,on the two sides of the semi-hole in the position to be milled later, of the hole wall, and hole wall
copper is drilled to be broken; c, board edge milling is conducted on the metallized semi-hole, wherein a board milling program is acquired, the metallized hole edge is milled by a
milling cutter clockwise to achieve a board milling movement, and the metallized semi-hole is formed; d, board milling is conducted on the unit edge, wherein the board milling program is acquired, the unit edge is milled according to normal operation parameters to achieve a board milling movement, the circuit boardis milled to small units, and a production board with the metallized semi-hole is formed. By means of the production method of the semi-hole of the
printed circuit board, the burr problem is solved,the production process of the circuit board is shortened, the production cost is lowered, and the quality, the yield and the production efficiency are improved.