Production method of metallized semi-hole of printed circuit board

Abstract

The invention provides a production method of a semi-hole of a printed circuit board. The method comprises the following steps that a, process production of the circuit board from cutting to surface treatment is completed to form a semi-hole production state board to be metallized; b, secondary drilling is conducted on the portions, on the two sides of the metallized semi-hole, of the hole wall, wherein the circuit board is fixed to a drilling machine through locating nails, a drill bit cuts in the hole wall in a rotating mode clockwise, that is to say, small holes are drilled in the portions,on the two sides of the semi-hole in the position to be milled later, of the hole wall, and hole wall copper is drilled to be broken; c, board edge milling is conducted on the metallized semi-hole, wherein a board milling program is acquired, the metallized hole edge is milled by a milling cutter clockwise to achieve a board milling movement, and the metallized semi-hole is formed; d, board milling is conducted on the unit edge, wherein the board milling program is acquired, the unit edge is milled according to normal operation parameters to achieve a board milling movement, the circuit boardis milled to small units, and a production board with the metallized semi-hole is formed. By means of the production method of the semi-hole of the printed circuit board, the burr problem is solved,the production process of the circuit board is shortened, the production cost is lowered, and the quality, the yield and the production efficiency are improved.

Description

technical field [0001] The invention relates to the field of manufacturing printed circuit boards, in particular to a method for manufacturing metallized half holes of printed circuit boards. Background technique [0002] In the production of printed circuit boards, there are usually products that require a metallized half-hole design on the edge of the board. When this type of design is manufactured according to the traditional milling process, there is a problem of remaining edge. Specifically: when milling the metallized half hole, when the milling cutter enters the metallized half hole, the copper skin in the hole on the entrance side is in a state of no force support. When milling the plate, the copper skin on the side hole wall will follow the rotation of the milling cutter. It is involved in the hole to form a burr peak; on the other side of the hole, because of the support of the hole wall, the copper skin is milled off, and there is no burr peak. In order to preven...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for making metallized semi-holes in circuit boards that solves the problem of sharp edges and burrs in view of the shortcomings of the prior art, such as long process flow and high quality risk.

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