Processing method for removing burrs from flexible printed circuit board region of rigid-flexible printed circuit board

A technology of rigid-flex board and processing method, applied in flexible printed circuit boards, electrical components, printed circuit manufacturing, etc., can solve problems such as waste of polyester film materials
CN106658970AActive Publication Date: 2017-05-10SHENZHEN SUNTAK MULTILAYER PCB
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN SUNTAK MULTILAYER PCB
Publication Date
2017-05-10

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Abstract

The invention relates to a processing method for removing burrs from a flexible printed circuit board region of a rigid-flexible printed circuit board. The processing method comprises the following steps of expanding along the two sides of a flexible printed circuit board in a non-linking position in a flexible region to a waste material region for a certain dimension, and feeding by adopting a shaping milling cutter; and after uncovering, adopting laser cutting along the outline of the flexible printed circuit board in the non-linking position in the flexible region to remove an outward-expansion part. According to the processing method, the step of expanding along the two sides of the flexible printed circuit board in the non-linking position of the flexible region to the waste material region for a certain dimension is performed by the shaping milling cutter in advance; then uncovering is carried out, and by adopting laser cutting, the outward-expansion part is removed along the outline of the flexible printed circuit board in the non-linking position in the flexible region, so that manual repairing is not required; the high precision of the outline precision of the flexible printed circuit board is maintained; the problem of burrs on the two sides of the flexible printed circuit board in the flexible region is solved; and effects of low cost and no waste of material are achieved.
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Description

technical field

[0001] The invention relates to the technical field of rigid-flexible board manufacturing, and more specifically refers to a processing method for removing burrs in the soft board area of ​​a rigid-flexible board. Background technique

[0002] In the printed circuit board industry, the existing methods for making the flexible area of ​​rigid-flex boards are as follows: figure 1 As shown, before lamination, the non-flowing PP in the flexible area is hollowed out to make a window design. After lamination, the unbonded hard board is removed by milling to form a flexible area.

[0003] The two sides of the flexible board in the non-link position of the flexible area need to be broken by a milling cutter. Since the flexible board is made of PI material, the material is soft and has no support, the milling cutter will be entangled during milling, and the chip removal will not be smooth, resulting in poor cutting of the blade. Smooth, pulling the base material of t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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