Separation method for package part with cooling fins

A separation method and heat sink technology, which can be used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as heat sink burrs

Inactive Publication Date: 2016-04-06
HUATIAN TECH XIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, during the separation process of the package, ...

Method used

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  • Separation method for package part with cooling fins
  • Separation method for package part with cooling fins
  • Separation method for package part with cooling fins

Examples

Experimental program
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Embodiment Construction

[0018] A method for manufacturing a package with a heat sink added, specifically according to the following steps:

[0019] The first step: prepare the carrier board 5; figure 1 shown;

[0020] The second step: wafer thinning, the thinning range is 50um-250um;

[0021] The third step: dicing to form a single chip 4;

[0022] The fourth step: on the core, using the core glue 6 to connect the chip 4 on the carrier board 5; figure 2 shown;

[0023] The fifth step: pressure welding, using the welding wire 3 to connect the chip 4 and the carrier board 5; image 3 shown;

[0024] The sixth step: plastic sealing, the plastic sealing body 2 surrounds the chip 4, the upper core glue 6 and the upper part of the carrier plate 5, and at the same time plastic sealing the heat sink 1, and then curing; Figure 4 shown;

[0025] Step 7: Printing, cutting, packaging.

[0026] Regarding the cutting process of the seventh step above, that is, a separation method of a package with a heat...

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PUM

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Abstract

The invention discloses a separation method for a package part with cooling fins. The package part comprises a carrier plate, a chip, a plastic package body and the cooling fins. In a separation process of the package part, the cooling fins are slotted by adopting laser or a cutter and are etched, and then a product is separated by using the cutter. According to the separation method, the problem of burrs of the cooling fins caused by direct use of the cutter for cutting in the separation process of the package part is solved.

Description

technical field [0001] The invention belongs to the field of integrated circuit packaging, in particular to a method for separating a package with a heat sink. Background technique [0002] Integrated circuits are the core of the information industry and high-tech, and integrated circuit packaging is the main component of integrated circuit technology. [0003] At present, some packaged products have insufficient heat dissipation capacity. It is necessary to add a heat sink to the plastic package to improve the heat dissipation capacity, so that the heat sink and the plastic package can be directly combined and completed in one process, which greatly improves the production efficiency. However, during the separation process of the package, directly using a knife to cut will cause the problem of burrs on the heat sink. Contents of the invention [0004] For the problems existing in the above-mentioned prior art, the present invention provides a method for separating packag...

Claims

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Application Information

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IPC IPC(8): H01L21/82
CPCH01L21/82
Inventor 王虎
Owner HUATIAN TECH XIAN
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