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Preprocessing method of flexible substrate

A flexible substrate, pretreatment technology, applied in nonlinear optics, instruments, optics, etc., can solve problems such as cutting burrs, prevent pollution, improve product yield and production efficiency, and reduce process effects.

Active Publication Date: 2019-03-01
TRULY SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, the present invention provides a pretreatment method for flexible substrates, which effectively solves the problem of burrs at the cutting edge by adjusting the sequence of the pre-cutting process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The flexible substrate in this embodiment is a color filter substrate, including a glass substrate and a flexible substrate. Before pretreatment, there are protective films on both sides of the flexible substrate, which are used to protect the flexible substrate from damage. When the pretreatment is ready, the protective film on one side is torn off. The protective film is made of epoxy resin material, and the thickness of the protective film is 22 μm.

[0036] A method for preprocessing a flexible substrate, comprising the following steps:

[0037] The side of the flexible substrate away from the protective film is naturally attached to the glass substrate, the flexible substrate is provided with a pre-cut position, and the protective film covers the surface of the flexible substrate and covers the pre-cut position;

[0038] Perform laser pre-cutting on the pre-cutting position, and the flexible substrate forms a cut at the position of the pre-cutting position;

[00...

Embodiment 2

[0043] The flexible substrate in this embodiment is a color filter substrate, including a glass substrate and a flexible substrate. Before pretreatment, there are protective films on both sides of the flexible substrate, which are used to protect the flexible substrate from damage. When the pretreatment is ready, the protective film on one side is torn off. The protective film is made of epoxy resin material, and the thickness of the protective film is 40 μm.

[0044] A method for preprocessing a flexible substrate, comprising the following steps:

[0045] The side of the flexible substrate without the protective film is naturally attached to the glass substrate, the flexible substrate is provided with a pre-cut position, and the protective film covers the surface of the flexible substrate and covers the pre-cut position;

[0046] Perform laser pre-cutting on the pre-cutting position, and the flexible substrate forms a cut at the position of the pre-cutting position;

[0047...

Embodiment 3

[0051] The flexible substrate in this embodiment is a color filter substrate, including a glass substrate and a flexible substrate. Before pretreatment, there are protective films on both sides of the flexible substrate, which are used to protect the flexible substrate from damage. When the pretreatment is ready, the protective film on one side is torn off. The protective film is made of acrylic resin material, and the thickness of the protective film is 52 μm.

[0052] A method for preprocessing a flexible substrate, comprising the steps of:

[0053] Attaching the side of the flexible substrate without the protective film to the glass substrate, the flexible substrate is provided with a pre-cut position, and the protective film covers the surface of the flexible substrate and covers the pre-cut position;

[0054] Perform laser pre-cutting on the pre-cutting position, and the flexible substrate forms a cut at the position of the pre-cutting position;

[0055] Remove the prot...

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Abstract

The invention relates to a preprocessing method of a flexible substrate. The flexible substrate includes a flexible substrate body and a glass base material; one side of the flexible substrate body isprovided with a protection film. The preprocessing method of the flexible substrate includes the following steps that the flexible substrate body is adopted, the side, away from the protection film,of the flexible substrate body is attached to the glass base material, a precut position is formed on the flexible substrate body, and the protection film covers the precut position; cutting is conducted at the precut position to form a cut; the protection film is removed, and the surface of the flexible substrate body is exposed; a structure film layer is produced on the surface of the flexible substrate body. It is unnecessary to add other production processes and conduct other processing operation on the cut, and thus the problem is effectively solved that in traditional technologies, burrsexist at the cut; after precutting, the protection film is removed, contamination caused by cutting chippings on the flexible substrate body can be effectively prevented, the process of washing a cutting line is omitted, technical production processes are reduced, the production time is saved, the product yield of a whole production procedure is increased, and the production efficiency of the whole production procedure is improved.

Description

technical field [0001] The invention relates to the technical field of preparation technology of liquid crystal display devices, in particular to a pretreatment method of a flexible substrate. Background technique [0002] In the TFT-LCD manufacturing process, one of the processes is called the CELL process. In the CELL process, in order to facilitate the later binding can be carried out smoothly on the TFT substrate (Thin Film Transistor, thin film transistor substrate). A pretreatment is performed on a substrate such as a CF substrate (Color Filter, color filter substrate), so that a cut is formed on the flexible substrate to expose a bonding position (wire bonding position) on the TFT substrate. After the pretreatment, enter the next step ODF process (One Drop Filling, liquid crystal drop process), and then remove the excess part on the flexible substrate after cutting the slivers. [0003] The traditional pretreatment method of flexible substrates is: flexible substrate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/1333
CPCG02F1/133305
Inventor 柳发霖董思娜方翠怡李林
Owner TRULY SEMICON
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