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Preparation method of three-dimensional structure CNTs reinforced Cu-based composite

A composite material and three-dimensional structure technology, applied in metal material coating process, gaseous chemical plating, coating, etc., can solve the problems of uneven dispersion of three-dimensional CNTs, low strength of composite materials, and low bonding force between CNTs and the matrix. Achieve good application prospects, improve strength, and facilitate industrial production

Active Publication Date: 2016-03-30
HARBIN INST OF TECH
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention solves the problem of uneven dispersion of three-dimensional CNTs prepared by traditional methods, and low bonding force between CNTs and the matrix, resulting in low strength of the composite material, and provides a method for preparing a three-dimensional structure CNTs reinforced Cu-based composite material

Method used

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specific Embodiment approach 1

[0022] Specific embodiment 1: The preparation method of a kind of three-dimensional structure CNTs reinforced Cu-based composite material described in this embodiment is specifically carried out according to the following steps:

[0023] 1. Place copper foam in acetone for ultrasonic pretreatment for 10-20 minutes to obtain pretreated copper foam;

[0024] 2. Place the pretreated foamed copper in a chemical vapor deposition device, evacuate until the pressure is below 20 Pa, feed argon gas with a gas flow rate of 5 sccm to 20 sccm, adjust the pressure in the chemical vapor deposition device to 100 Pa to 200 Pa, and Under the pressure of 100Pa~200Pa and argon atmosphere, the temperature is raised to 500℃~800℃;

[0025] 3. Feed methane gas, adjust the gas flow rate of methane gas to 1sccm~20sccm, adjust the gas flow rate of argon gas to 80sccm~99sccm, adjust the pressure in the chemical vapor deposition device to 400Pa~700Pa, and then adjust the pressure to 400Pa~700Pa and tempe...

specific Embodiment approach 2

[0036] Embodiment 2: This embodiment differs from Embodiment 1 in that: in step 5, the growth is carried out under the conditions of a pressure of 500 Pa to 800 Pa and a temperature of 500° C. to 700° C., and the holding time is 5 min to 25 min. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0037] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that in step six, the sintering pressure is 20MPa~50MPa, the current on-off time ratio is (1~8)ms:1ms and the sintering temperature Spark plasma sintering is carried out at 800°C to 1000°C for 2min to 5min. Others are the same as in the first or second embodiment.

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Abstract

The invention relates to a preparation method of a CNTs (Carbon Nano Tubes) reinforced copper-based composite, and discloses a preparation method of a three-dimensional structure CNTs reinforced Cu-based composite, so as to solve the problems that three-dimensional CNTs are not dispersed uniformly by the traditional preparation method, and the strength of the composite is low due to the fact that a binding force between CNTs and a matrix is low. The preparation method of the three-dimensional structure CNTs reinforced Cu-based composite comprises the steps that first, by adopting a chemical vapor deposition method, three-dimensional graphene is prepared on a foamy copper matrix; then, by adopting a plasma reinforced chemical vapor deposition method, CNTs grow on graphene, and three-dimensional structure CNTs are prepared; finally, a three-dimensional CNTs / foamy copper material and copper powder are subjected to spark plasma sintering, and the three-dimensional structure CNTs reinforced Cu-based composite is obtained. The above scheme is applied to the preparation method of the three-dimensional structure CNTs reinforced Cu-based composite.

Description

technical field [0001] The invention relates to a preparation method of CNTs reinforced copper matrix composite material. Background technique [0002] Among non-ferrous metals, copper is widely used in the fields of aerospace, electronics, machining and national defense due to its good electrical and thermal conductivity, corrosion resistance and easy processing and forming. Three metals. However, with the rapid development of modern industrial technology, higher comprehensive performance requirements are put forward for the strength, electrical conductivity and thermal conductivity of copper materials. [0003] CNTs has a unique structure and excellent physical and chemical properties, its tensile strength is about 100 times that of high-strength steel, and its density is only 1 / 6 to 1 / 7 of steel; at the same time, CNTs also have high electrical conductivity and thermal conductivity. It has become a research hotspot in the field of nanotechnology because of its low therm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C1/10C23C16/26C23C16/50
CPCC22C1/10C22C9/00C23C16/26C23C16/50
Inventor 亓钧雷罗大林陈树林林景煌王泽宇冯吉才
Owner HARBIN INST OF TECH
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