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Foamy carbon/copper matrix or aluminum matrix composite material and preparation method thereof

An aluminum-based composite material and carbon foam technology, which is applied in the field of electronic packaging materials to achieve the effects of low density, low thermal expansion coefficient and improved thermal conductivity

Active Publication Date: 2012-04-04
GRIMAT ENG INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, it solves the problem of interface wetting in composite materials and greatly reduces the thermal resistance caused by the interface.

Method used

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  • Foamy carbon/copper matrix or aluminum matrix composite material and preparation method thereof
  • Foamy carbon/copper matrix or aluminum matrix composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Raw materials: carbon foam with a porosity of 50%, carbon foam is a graphitized structure, and the thermal conductivity is about 150W / mK (the specific thermal conductivity of copper and aluminum is 45W / mK and 54W / mK respectively); Cu-0.5Cr alloy.

[0030] Put the foamed carbon with a porosity of 50% into the graphite mold, put the Cu-0.5Cr alloy into the intermediate frequency induction furnace of the vacuum pressure infiltration furnace, the volume percentage of the foamed carbon is 50%, and the copper-chromium alloy is 50% ;The graphite mold that foam carbon is housed is put into vacuum pressure infiltration furnace, vacuumizes, heats up simultaneously, when vacuum pressure infiltration furnace vacuum degree reaches 0.05Pa, temperature rises to 1200 ℃ (the melting point of copper-chromium alloy is 1080 ℃) began to pour the molten copper-chromium alloy liquid from the intermediate frequency induction furnace into the graphite mold for pressure infiltration, furnace coo...

Embodiment 2

[0032] Raw materials: carbon foam with a porosity of 60%, the carbon foam is a graphitized structure, and the thermal conductivity is about 140W / mK; Cu-0.1Ti alloy.

[0033] Put the foamed carbon with a porosity of 60% into the graphite mold, put the Cu-0.1Ti alloy into the intermediate frequency induction furnace of the vacuum pressure infiltration furnace, the volume percentage of the foamed carbon is 40%, and the copper-titanium alloy is 60% ;The graphite mold that foam carbon is housed is put into the vacuum pressure infiltration furnace, vacuumizes, heats up simultaneously, when the vacuum degree of vacuum pressure infiltration furnace reaches 0.01Pa, temperature rises to 1200 ℃ (the melting point of copper-titanium alloy is 1080 ℃) began to pour the molten copper-titanium alloy liquid from the intermediate frequency induction furnace into the graphite mold for pressure infiltration, furnace cooling, and ejection of the mold. The density of the prepared foamed carbon / coppe...

Embodiment 3

[0035] Raw materials: carbon foam with a porosity of 70%, the carbon foam is a graphitized structure, and the thermal conductivity is about 130W / mK; Al-0.2B alloy.

[0036] Put the foamed carbon with a porosity of 70% into the graphite mold, put the Al-0.2B alloy into the medium frequency induction furnace of the vacuum pressure infiltration furnace, the volume percentage of the foamed carbon is 30%, and the aluminum-boron alloy is 70% ;The graphite mold that foam carbon is housed is put into vacuum pressure infiltration furnace, vacuumizes, and heats up simultaneously, when vacuum pressure infiltration furnace vacuum degree reaches 1Pa, temperature rises to 850 ℃ (the fusing point of aluminum-boron alloy is 660 ℃ ) began to pour the molten aluminum-boron alloy liquid from the intermediate frequency induction furnace into the graphite mold for pressure infiltration, furnace cooling, and demoulding, and the density of the prepared carbon foam / aluminum matrix composite material w...

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Abstract

The invention relates to a foamy carbon / copper matrix or aluminum matrix composite material with high thermal conductivity and a preparation method thereof, belonging to the technical field of electronic packaging materials. The composite material comprises 30 to 50 (v)% of foamy carbon and 50 to 70 (v)% of copper alloy or aluminum alloy, wherein, the porosity of foamy carbon is 50 to 70% and is identical with the value of the the content of copper alloy or aluminum alloy expressed as volume percent. According to the invention, a graphite die filled with foamy carbon is put in a vacuum pressure infiltration furnace, when a degree of vacuum reaches 0.01 to 1 Pa and temperature rises to be 100 to 300 DEG C higher than the melting point of the matrix, i.e., copper alloy or aluminum alloy, molten copper alloy or aluminum alloy liquid is casted into the graphite die from a medium frequency induction furnace for pressure infiltration, and the composite material is obtained after the vacuum pressure infiltration furnace is cooled and the die is removed. The composite material prepared in the invention has low density, isotropic thermal conduction performance and excellent workability, and can meet requirements of lightweight, high thermal conductivity, good dimensional stability and the like for electronic packaging materials.

Description

technical field [0001] The invention relates to a high thermal conductivity foamed carbon / copper-based or aluminum-based composite material and a preparation method thereof, belonging to the technical field of electronic packaging materials. Background technique [0002] Foamed carbon is a porous lightweight solid-state material with unique properties in terms of acoustics, thermals, optics, electricity and dynamics. Foam carbon has two structural types: pentagonal dodecahedral structure and spherical pore-like structure. The former is non-graphitized, with large openings and columnar ligaments. This structure determines that it has good thermal insulation, while spherical Foam carbon with pore-like structure is a typical ligament-like net-shaped spherical opening structure. The graphite layer is regularly arranged along the direction of the hole wall, and the cells are evenly distributed, so it has isotropic thermal conductivity, and its thermal conductivity can reach 50-20...

Claims

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Application Information

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IPC IPC(8): C22C1/10C22C9/00C22C21/00C22C47/12B22D19/02B22D19/14
Inventor 张习敏郭宏尹法章褚克范叶明韩媛媛
Owner GRIMAT ENG INST CO LTD
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