The invention relates to the technical field of glue, particularly to a formula and a process of environment-friendly epoxy resin glue. The epoxy resin glue is prepared from the following raw materials in parts by weight: 55-80 parts of epoxy resin, 8-15 parts of sodium dodecyl benzene sulfonate, 6-12 parts of potassium persulfate, 2-3 parts of a preservative, 2-5 parts of dibutyl phthalate, 2-5 parts of nanometer silicon dioxide, 4-6 parts of glass fibers, 3-6 parts of a low-temperature-resistant anti-freezing agent, 4-10 parts of a modifier, 2-4 parts of a quick drying agent, 5-8 parts of anodor masking agent, 2-4 parts of scented water and 220-280 parts of deionized water. By arranging the low-temperature-resistant anti-freezing agent, the modifier, the quick-drying agent, the odor masking agent, the scented water and the glass fibers, the epoxy resin glue has a quick solidification function, corrosion resistance, high-temperature resistance, low-temperature resistance and the like, and is environmentally friendly.