Heat conducting polyamide composite material and preparation method thereof

A composite material and polyamide technology, which is applied in the field of thermally conductive polyamide composite materials and its preparation, can solve the problems of high price, low thermal conductivity and mechanical properties of PA46, and achieve low cost, good processability and low density.

Active Publication Date: 2013-01-02
HEFEI GENIUS NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Cool Polymer has PA46 products, but the price of PA46 is relatively high. Other companies also have PA6 and PA66 thermal conductivity products, but the thermal conductivity and mechanical properties are not high.

Method used

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  • Heat conducting polyamide composite material and preparation method thereof
  • Heat conducting polyamide composite material and preparation method thereof
  • Heat conducting polyamide composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A PA heat-conducting material, by weight fraction, consists of the following components:

[0036]

[0037] (1) Dry 40 parts of PA6 at 100°C for 4 hours, and dry 58.2 parts of thermally conductive silicon carbide at 100°C for 4 hours;

[0038] (2) Put 58.2 parts of dried thermally conductive silicon carbide into the high-speed mixer, and spray a mixture of 0.5 parts of coupling agent and 0.5 part of white oil into 58.2 parts of thermally conductive silicon carbide in the high-speed mixer Mix at high speed for 30 minutes, dry at 100°C for 3 hours before use;

[0039] (3) Put 40 parts of dried PA6, 0.1 part of antioxidant 1098, 0.2 part of antioxidant 168, 0.2 part of EBS, 0.3 part of processing aid TR065 and the mixture obtained in step 2 into a high-speed mixer, Mix for 15 minutes at room temperature;

[0040] (4) Add the mixture obtained in step (3) into the twin-screw extruder, and the temperatures of the screw 1~6 zones are 180~200°C, 210~230°C, 220~240°C, 230~24...

Embodiment 2

[0046] A PA heat-conducting material, by weight fraction, consists of the following components:

[0047]

[0048] (1) Dry 20 parts of PA resin at 100°C for 4 hours, and dry 77.4 parts of thermally conductive alumina at 100°C for 4 hours;

[0049] (2) Put the dried 77.4 parts of thermally conductive alumina into the high-speed mixer, and add the mixture of 0.7 parts of coupling agent and 0.7 part of white oil to 77.4 parts of thermally conductive alumina in the high-speed mixer by spraying Medium, after mixing at high speed for 30 minutes, dry at 100°C for 3 hours before use;

[0050] (3) Put 20 parts of dried PA6, 0.1 part of antioxidant 1098, 0.1 part of PEPQ, 0.2 part of EBS, 0.6 part of processing aid TR065 and the mixture obtained in step 2 into a high-speed mixer, and at room temperature Mix for 15 minutes;

[0051] (4) Add the mixture obtained in step (3) into the twin-screw extruder, and the temperatures of the screw 1~6 zones are 180~200°C, 210~230°C, 220~240°C, 2...

Embodiment 3

[0056] A PA heat-conducting material, by weight fraction, consists of the following components:

[0057]

[0058] (1) Dry 27.6 parts of PA6 resin at 100°C for 4 hours, dry 40 parts of thermally conductive alumina and 35 parts of thermally conductive silicon carbide at 100°C for 4 hours;

[0059] (2) Put 40 parts of dried alumina and 35 parts of thermally conductive silicon carbide into the high-speed mixer, and add the mixture of 0.7 parts of coupling agent and 0.7 parts of white oil into the high-speed mixer by spraying 40 parts of thermally conductive alumina and 35 parts of thermally conductive silicon carbide were mixed at high speed for 30 minutes, dried at 100°C for 3 hours before use;

[0060] (3) Add 27.6 parts of dried PA6, 0.1 part of antioxidant 1098, 0.1 part of PEPQ, 0.6 part of processing aid TR065 and the mixture obtained in step 2 into a high-speed mixer, and mix at room temperature for 15 minutes;

[0061] (4) Add the mixture obtained in step (3) into the ...

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Abstract

The invention discloses heat conducting polyamide composite material and preparation method thereof, falling into the technical field of high polymer composite material. The heat conducting polyamide composite material is composed of PA resin 20-40, heat conducting filling 58.2-77.4, antioxidant 0.2-0.3, coupling agent 0.5-0.7, liquid assistant 0.5-0.7, lubricant 0.2-0.4, and processing assistant 0.3-0.6 parts by weight. The method includes mixing the coupling agent 0.5-0.7 parts and liquid assistant 0.5-0.7 parts, adding into dry heat conducting filling 58.2-77.4 parts, stirring for 30 min via a high-speed mixing machine, and drying for 3 h at 100 DEG C. for use; placing PA resin 20-40 parts, antioxidant 0.2-0.3 parts, lubricant 0.2-0.4 parts, processing assistant 0.3-0.6 parts and the mixture obtained from the first step into a high-speed mixing machine, stirring for 15 min, and performing extrusion and granulation via an extruding machine. The composite material has heat conducting property, low density, good processability, and low cost.

Description

technical field [0001] The invention belongs to the technical field of polymer composite materials, and relates to a heat-conducting polyamide composite material and a preparation method thereof. Background technique [0002] Although plastics have the advantages of insulation, light weight, and easy molding and processing, when plastics are used in computers, display frames, electronic and electrical components, etc., due to the relatively low thermal conductivity of plastics, it is difficult to export heat, and the accumulated heat is harmful to electronics. The stability of device operation is adversely affected. In order to solve this problem, thermally conductive plastics have entered people's field of vision. Thermally conductive plastics are formed with thermally conductive alumina, silicon carbide, aluminum nitride, graphite, carbon nanotubes, etc. as fillers, and thermoplastic or thermosetting resins as the matrix. composite material. Polyamide (PA) refers to a cl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/02C08K13/06C08K3/34C08K3/22C08K3/04C08K3/28B29C47/92C09K5/14B29C48/92
CPCB29C48/04
Inventor 郭雪晴
Owner HEFEI GENIUS NEW MATERIALS
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