Formula and process of environment-friendly epoxy resin glue

An epoxy resin, green and environmentally friendly technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of long curing time, easy shrinkage, expansion and deformation of epoxy resin glue, etc., and achieve good chemical stability. Stable, physiologically inert, improve the effect of high temperature resistant type

Inactive Publication Date: 2020-10-30
今程粘胶(惠州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problems in the prior art that the epoxy resin glue in the prior art has a long solidification time and cannot be solidified in a short time, so that the adhesive strength cannot be obtained in a short time, and it is resistant to high, The low-temperature performance is poor, and it will expand, deform and become soft in a high-temperature environment, thereby reducing the adhesive strength. , and proposed a green environmental protection epoxy resin glue formula and process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1: It is made of the following raw materials in parts by weight: epoxy resin: 70 parts, sodium dodecylbenzenesulfonate: 9 parts, potassium persulfate: 10 parts, preservatives: 2 parts, diphthalate Butyl ester: 3 parts, nano-silica: 3 parts, glass fiber: 6 parts, which can further improve its high temperature resistance type, and has corrosion resistance at the same time, low temperature resistant antifreeze: 6 parts, and the low temperature resistant antifreeze is B Diol, so that it has low temperature resistance, can ensure that it will not crack and degumming phenomenon in low temperature environment, modifier: 9 parts, the modifier is polydimethylsiloxane, so that it has Heat resistance, cold resistance, small surface tension, thermal conductivity, physiological inertness, good chemical stability, electrical insulation and weather resistance, and high shear resistance, can be used at -50°C to 200°C Under long-term use, it has strong high and low temperatur...

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Abstract

The invention relates to the technical field of glue, particularly to a formula and a process of environment-friendly epoxy resin glue. The epoxy resin glue is prepared from the following raw materials in parts by weight: 55-80 parts of epoxy resin, 8-15 parts of sodium dodecyl benzene sulfonate, 6-12 parts of potassium persulfate, 2-3 parts of a preservative, 2-5 parts of dibutyl phthalate, 2-5 parts of nanometer silicon dioxide, 4-6 parts of glass fibers, 3-6 parts of a low-temperature-resistant anti-freezing agent, 4-10 parts of a modifier, 2-4 parts of a quick drying agent, 5-8 parts of anodor masking agent, 2-4 parts of scented water and 220-280 parts of deionized water. By arranging the low-temperature-resistant anti-freezing agent, the modifier, the quick-drying agent, the odor masking agent, the scented water and the glass fibers, the epoxy resin glue has a quick solidification function, corrosion resistance, high-temperature resistance, low-temperature resistance and the like, and is environmentally friendly.

Description

technical field [0001] The invention relates to the technical field of glue, in particular to a formula and process of green and environment-friendly epoxy resin glue. Background technique [0002] Epoxy resin glue generally refers to the adhesive made of epoxy resin as the main body. Epoxy resin glue has low toxicity, low volatility, wide matching ratio, easy operation, can be cured at room temperature, strong adhesion, and good toughness , obviously superior to general monomeric amine curing agents. The epoxy resin glue in the prior art has a longer solidification time and cannot be solidified in a short time, so that the adhesive strength cannot be obtained in a short time, and it is resistant to High and low temperature performance is poor, it will expand, deform and become soft in a high temperature environment, thereby reducing the adhesive strength, and it is easy to shrink, crack, and degumming in a low temperature environment, which will cause it to fall off and mak...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/04C09J4/06C09J11/04C09J11/06C09J11/08
CPCC09J4/06C09J11/04C09J11/06C09J11/08
Inventor 洪枫棨
Owner 今程粘胶(惠州)有限公司
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