2results about How to "Environmental performance" patented technology

This invention discloses a single-component moisture-curing conductive and thermally conductive adhesive and its preparation process, comprising the following raw materials in parts by weight: 100 parts SMP adhesive; 15-30 parts flake silver powder; 500-900 parts spherical silver-coated copper powder; 0-400 parts dendritic silver-coated copper powder; 10-20 parts decamethyltetrasiloxane; 1-1.5 parts β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate isooctyl ester; 7.5-10 parts N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane; and 1-1.5 parts vinyltrimethoxysilane. This invention allows the adhesive to cure at room temperature / low temperature using moisture in the air, eliminating the need for temperatures above 120°C. This completely avoids thermal stress damage to heat-sensitive substrates such as plastics, flexible circuit boards, and PET / PI films, making it perfectly suited for low-temperature processing scenarios such as flexible electronics manufacturing, wearable devices, and flexible sensors.

This application discloses a trough fermentation system for lignite fermentation, including a fermentation trough and a heating device for heating the fermentation trough. A floor heating coil is installed at the bottom of the fermentation trough. The heating device supplies heat to the fermentation trough through the floor heating coil, providing different amounts of heat to the fermentation trough in the early, middle, and late stages of fermentation, respectively, so that the fermentation trough is in the first, second, and third stages. The gradient temperature control of this application can accurately meet the temperature requirements of different stages in the fermentation process, significantly improving fermentation efficiency, accelerating the fermentation process, significantly shortening the fermentation cycle, and reducing greenhouse gas emissions, thus offering environmental advantages.