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The utility model discloses an embodiment relates to the technical field of connector, especially discloses a kind of connector and electronic equipment, including insulating body, terminal assembly, lock catch assembly, elastic member and linkage assembly, insulating body is provided with slot and first connecting groove, slot is used for electronic card insertion, terminal assembly is set to insulating body, lock catch assembly includes lock catch piece, lock catch piece is provided with first connecting part, first connecting part is movably inserted in first connecting groove, so that lock catch piece can move along first direction and second direction, elastic member is supported in insulating body and lock catch piece, linkage assembly includes linkage piece and ejector, linkage piece is movably set to insulating body, one end of linkage piece is movably connected with lock catch piece, ejector is rotatably set to insulating body, part of ejector is set to slot, and the other end of ejector is movably connected with linkage piece. By the above-mentioned mode, the utility model embodiment realizes that connector lock card is firm.

This invention provides a tunnel-type garment smoothing machine, belonging to the field of garment smoothing technology. It includes a housing with through slots at both ends, forming a smoothing channel between the slots. A steam ironing component and a drying component are installed within the smoothing channel. A conveyor component runs through the smoothing channel, passing sequentially through the steam ironing and drying components to smooth the garments. This invention uses a conveyor component to guide the garments through the smoothing channel, and the steam ironing and drying components, sequentially arranged within the channel, achieve steam smoothing and drying of the garments. Compared to tumble drying, this method causes less damage to the garments, and the entire process is friction-free and undamaged.

The utility model discloses a lossless and pollution-free silicon carbide particle mixing device and relates to the technical field of silicon carbide crystals. Comprising a magnetic oscillator, a mixing grid plate, a base and a cylindrical side wall with upper and lower openings, the base is adsorbed on the magnetic oscillator; the multiple cylindrical side walls are sequentially stacked on the base from bottom to top, and the cylindrical side walls are detachably connected with the base and detachably connected with the base. A material mixing grid plate is placed at the insertion port of each cylindrical side wall, a gap exists at the joint of every two adjacent cylindrical side walls, and SiC powder and a doping agent are placed on the material mixing grid plates; the particle size of the SiC powder and the particle size of the doping agent are both larger than the mesh aperture of the mixed material mesh plate; the silicon carbide powder mixing device can realize lossless, efficient and pollution-free mixing of silicon carbide powder, and improves the consistency of substrates.

The application discloses a process method of sand blasting before machining for high-quality and high-efficiency machining of hard and brittle materials, and belongs to the technical field of precision machining of hard and brittle materials. In view of the problems of easy edge collapse, cracks and low machining efficiency of hard and brittle materials in cutting, sand blasting treatment is performed on the surface to be machined of a workpiece before mechanical cutting machining, a uniform micro-crack damage layer is formed in a controllable manner on the material surface layer by using the impact of high-speed abrasive particles, and the bonding strength of the surface layer is weakened; subsequent cutting machining is then performed, so that the material is mainly removed in brittleness and secondarily removed in ductility, the cutting force and tool wear are significantly reduced, defects such as edge collapse and cracks are inhibited, and the machining surface quality and machining efficiency are improved. The process is simple and has strong adaptability, and can be widely applied to the precision and high-efficiency cutting machining scenes of various hard and brittle materials such as ceramics, monocrystalline silicon and sapphire.