Low-dielectric-constant organic silicon pouring sealant and preparation method thereof

Abstract

The invention provides an organic silicon pouring sealant with a low dielectric constant. The invention belongs to the technical field of organosilicon pouring sealants. The organic silicon pouring sealant comprises a component A and a component B. The component A comprises, by weight, 10-40 parts of vinyl silicone oil, 1-10 parts of a diluent, 0-20 parts of a heat conduction filler, 10-60 parts of a low dielectric material, and 0.1-2.0 parts of a catalyst. The component B comprises, in parts by weight: 10 to 40 parts of vinyl silicone oil, 5 to 30 parts of a cross-linking agent, 0 to 20 partsof a heat conduction filler, 10 to 60 parts of a low dielectric material and 0.1 to 1.0 part of an inhibitor; the preparation method comprises the following steps: carrying out organic treatment on alow-dielectric material, stirring in a reaction kettle, cooling, stirring again, cooling again to obtain the finished product A and the finished product B, and uniformly mixing the prepared finishedproduct A and the finished product B according to the mass ratio of 1: 1 for later use. The phase change pouring sealant can solve the problem that a porous material containing air is unstable in an organic silicon system, the organic silicon pouring sealant is stable in storage, the dielectric constant is lower than 3.0 (1MHz), and heat conduction and viscosity are moderate.

Description

technical field [0001] The invention relates to the technical field of potting glue, in particular to a silicone potting glue and a preparation method thereof. Background technique [0002] With the rapid development of the microelectronics industry, more and more electronic products are developing towards miniaturization, integration and functionalization. The integration of circuits is getting higher and higher, and the types and quantities of electronic devices per unit volume are also increasing. more. The distance between different electronic devices is further reduced, and at the same time it will bring some negative effects, such as signal interference between wires, resistance and capacitance delays, and increased energy consumption. At present, in the academic circle, the most effective way to solve this problem is to use low dielectric constant materials to prepare copper clad laminates, so as to reduce the above-mentioned negative effects. For example, Chinese p...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the defects and deficiencies in the background technology, the present invention provides a low dielectric constant silicone potting compound, which can solve the problem of unstable porous materials containing air in the silicone system. The silicone potting compound is stable in storage, the dielectric constant is lower than 3.0 (1MHz), and the thermal conductivity and viscosity are moderate