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Preparing technology of circuit board nickel and gold deposition

A preparation process, the technology of immersion nickel gold, applied in the field of preparation process of circuit board immersion nickel gold, can solve problems such as nickel corrosion, black disk defects, and affecting product link reliability, so as to save costs, improve solderability, reduce The effect of the black pad

Inactive Publication Date: 2015-11-04
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention is to overcome technical bottlenecks such as nickel corrosion in electroless nickel immersion gold, black disk defects in the welding process, and problems affecting product link reliability, thereby proposing a low-cost, corrosion-reducing, Preparation process of immersion nickel gold for circuit boards with reduced black pad generation and low consumption rate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1 This embodiment discloses a preparation process of online nickel-gold deposition on a circuit board, and the specific steps are as follows:

[0019] S1 carries out nickel-gold pre-treatment, specifically: use NaS 2 o 8 、H 2 SO 4 Carry out micro-etching of the plate; then wash with overflow water twice; then use a 1000-mesh soft brush to grind the plate, and control the wear marks of the brush to 8-12mm; then use emery to sandblast; Ultrasonic immersion; then perform water column rinsing and swing high-pressure water rinsing, and finally after DI water rinsing, the board can be released.

[0020] S2 carries out upper board and degreasing treatment;

[0021] S3 carries out the hot water washing step, and the washing speed is 4-6L / min;

[0022] S4 carries out the washing step for the first time: concretely, after carrying out first-level washing (washing speed is 8-10L / min), then carry out secondary washing (washing speed is 8-10L / min); etch step;

[00...

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PUM

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Abstract

The invention belongs to the field of circuit board processing, and specifically relates to a preparing technology of circuit board nickel and gold deposition. The nickel and gold deposition technology comprises the steps of circuit board loading and oil removing; a first time of water cleaning; acid cleaning; a second time of water cleaning; pre-dipping and activation; a third time of water cleaning; nickel deposition; a fourth time of water cleaning; gold deposition; a fifth time of water cleaning; and circuit board unloading. Based on existing equipment, preprocessing, micro-corrosion amount and nickel cylinder control are realized in production line processes, a good technical effect is obtained, and the cost is saved; existing processes are optimized, the corrosion of nickel in the nickel and gold deposition process is reduced, black PADs are reduced, and the weldability of the product is improved; in addition, the preparing technology of circuit board nickel and gold deposition is good in market prospect and economic value.

Description

technical field [0001] The invention belongs to the field of circuit board processing, and in particular relates to a process for preparing a circuit board by immersion in nickel and gold. Background technique [0002] PCB surface pads are the terminals connecting PCB lines and external components. PCB surface pads are all copper conductors, and surface coating treatment is required to protect the copper surface of the connection pad from contamination and oxidation, and ensure the reliability of component welding. At present, the surface treatment of PCB pads mostly adopts electroless nickel immersion gold (ENIG). Electroless nickel immersion gold is widely used in fine electronic products due to its superior properties such as high coating flatness, good coating wear resistance and low contact resistance. Surface treatment of printed circuit boards and packaging technology of microelectronic chips and circuit boards. As we all know, ENIG coating will have black plate (ie ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/24
CPCH05K3/241H05K2203/0766
Inventor 王淑怡朱拓阙玉龙
Owner SHENZHEN SUNTAK MULTILAYER PCB
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