Novel chemical nickel gold production process and chemical nickel plating liquid

An electroless nickel plating solution and electroless nickel-gold technology, applied in liquid electroless plating, metal material coating process, coating, etc., can solve the problems of high equipment cost, high temperature of electroless nickel cylinder, scratched board surface, etc. Achieve the effect of reducing manufacturing cost and production cost, shortening treatment process and reducing sewage discharge

Inactive Publication Date: 2019-04-16
湖南互连微电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To deposit a 3-5um electroless nickel layer, it takes more than 25 minutes, the production line is relatively long, and the equipment cost is high
2. The temperature of the chemical nickel cylinder is high, the chemical nickel plating soluti...

Method used

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  • Novel chemical nickel gold production process and chemical nickel plating liquid
  • Novel chemical nickel gold production process and chemical nickel plating liquid
  • Novel chemical nickel gold production process and chemical nickel plating liquid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] In this embodiment, chemical nickel-gold is carried out on the copper surface, and the experiment is carried out according to the steps described. Wherein, the alkaline electroless nickel plating solution in step 6 comprises: nickel sulfate 10g / L, sodium hypophosphite 22g / L, lactic acid 10g / L, ammoniacal liquor 40g / L, succinic acid 10g / L, glycine 10g / L, Ammonium chloride 15g / L, citric acid 10g / L. Wherein, the nickel activator composition in step 7 includes: citric acid 10g / L.

[0056] The acidic electroless nickel plating solution in the step 8 comprises: nickel sulfate 10g / L, sodium hypophosphite 30g / L, lactic acid 10g / L, ammoniacal liquor 10g / L, sodium ethylenediamine tetramethylene phosphonate (EDTMPS) 20g / L , Hydroxyethylidene diphosphonic acid (HEDP) 10g / L, ammonium chloride 15g / L, glycine 10g / L, praseodymium sulfate 70ppm, yttrium sulfate 10ppm.

[0057] The composition of the chemical gold immersion solution in step 9 includes: potassium aurous cyanide 1g / L, ED...

Embodiment 2

[0061] In this embodiment, chemical nickel-gold is carried out on the copper surface, and the experiment is carried out according to the steps described. Wherein, the alkaline electroless nickel plating solution in step 6 comprises: nickel sulfate 10g / L, sodium hypophosphite 22g / L, lactic acid 10g / L, ammoniacal liquor 40g / L, succinic acid 15g / L glycine 10g / L, chlorine Ammonium chloride 20g / L, citric acid 10g / L. Wherein, the nickel activator composition in step 7 includes: malic acid 10g / L.

[0062] The acidic electroless nickel plating solution in the step 8 comprises: nickel sulfate 10g / L, sodium hypophosphite 30g / L, lactic acid 8g / L, ammoniacal liquor 10g / L, sodium ethylenediamine tetramethylene phosphonate (EDTMPS) 30g / L , Hydroxyethylidene diphosphonic acid (HEDP) 15g / L, ammonium chloride 15g / L, glycine 10g / L praseodymium sulfate 91ppm, yttrium sulfate 13ppm.

[0063] The composition of the chemical gold immersion solution in step 9 includes: potassium aurous cyanide 1g / ...

Embodiment 3

[0067] In this embodiment, chemical nickel-gold is carried out on the copper surface, and the experiment is carried out according to the steps described. Wherein, the alkaline electroless nickel plating solution in step 6 comprises: nickel sulfate 10g / L, sodium hypophosphite 22g / L, lactic acid 10g / L, ammoniacal liquor 40g / L, succinic acid 10g / L glycine 10g / L, chlorine Ammonium chloride 15g / L, citric acid 10g / L. Wherein, the nickel activator composition in step 7 includes: glycine 10g / L.

[0068] The acidic electroless nickel plating solution in the step 8 comprises: nickel sulfate 10g / L, sodium hypophosphite 30g / L, lactic acid 8g / L, ammoniacal liquor 10g / L, sodium ethylenediamine tetramethylene phosphonate (EDTMPS) 30g / L , Hydroxyethylidene diphosphonic acid (HEDP) 15g / L, ammonium chloride 20g / L, glycine 10g / L praseodymium sulfate 91ppm, yttrium sulfate 13ppm.

[0069] The composition of the chemical gold immersion solution in step 9 includes: potassium aurous cyanide 1g / L, ...

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PUM

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Abstract

The invention discloses a PCB or package substrate chemical nickel gold production new process. The new process comprises the steps of chemical gold pretreatment, deoiling, micro-etching, activation,alkaline chemical nickel, nickel activation, acid chemical nickel, chemical gold, gold surface hole sealing and chemical gold aftertreatment. The invention further provides novel chemical nickel plating liquid. The process is low in nickel cylinder temperature and high in chemical nickel deposition speed; nickel simple substances are difficultly separated out from the wall of a chemical nickel plating liquid stabilizing tank; the horizontal production of chemical nickel gold can be realized; a production line is shortened; the emission of waste water is reduced; and the comprehensive production cost of the production line is reduced. In the novel chemical nickel plating liquid, through adjustment of types of complexing agents and stabilizing agents in the chemical nickel plating liquid, even if under the conditions of higher PH and higher deposition speed, higher P content is achieved to meet various performance requirements of existing chemical nickel gold for the surface treatment ofPCBs and package substrates.

Description

technical field [0001] The invention relates to surface treatment of circuit boards, in particular to an electroless nickel-gold production process for PCB production and an electroless nickel plating solution. Background technique [0002] Electroless nickel gold is a surface treatment process for circuit boards, which prevents gold and copper from diffusion between them. Compared with the electroplating gold process, the chemical nickel-gold process has the advantages of high uniformity, good metallic gloss, good flatness, and good solderability, and has been widely used in surface treatment of circuit boards. [0003] The existing chemical nickel and gold production processes all realize vertical line production. However, automatic processing cannot be realized during vertical line production. First, pre-treatment is carried out before vertical line production. After chemical nickel gold is completed, post-processing is required. Multi-process circuit boards are prone t...

Claims

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Application Information

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IPC IPC(8): C23C18/34C23C18/36C23C18/42C23C18/18
CPCC23C18/1637C23C18/1651C23C18/1689C23C18/1844C23C18/34C23C18/36C23C18/42
Inventor 张毅张新学刘龙平邹银超肖开球
Owner 湖南互连微电子材料有限公司
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