The invention belongs to the field of circuit board processing and specifically relates to a lead wire etching technology with gold fingers with three surfaces wrapped by gold. The technology comprises successive steps of inner layer, laminating, drilling, copper sinking, whole-plate electroplating, outer-layer pattern (1), pattern plating, etching (1), resistance welding, outer-layer pattern (2), nickel and gold plating, stripping, outer-layer pattern (3), etching (2), stripping, tape pasting, surface processing, and post-operations. The technology optimizes the process of gold fingers with three surfaces wrapped by gold, improves the quality, solves the problem of gold diffusion, reduces finger gold surface scratches, avoids the phenomena that a coating film cannot be attached to a plate surface completely and etching solution seeps into an etching line, reduces the risk of contamination, and has great market prospect and application value.