Lead wire etching technology with gold fingers with three surfaces wrapped by gold

Abstract

The invention belongs to the field of circuit board processing and specifically relates to a lead wire etching technology with gold fingers with three surfaces wrapped by gold. The technology comprises successive steps of inner layer, laminating, drilling, copper sinking, whole-plate electroplating, outer-layer pattern (1), pattern plating, etching (1), resistance welding, outer-layer pattern (2), nickel and gold plating, stripping, outer-layer pattern (3), etching (2), stripping, tape pasting, surface processing, and post-operations. The technology optimizes the process of gold fingers with three surfaces wrapped by gold, improves the quality, solves the problem of gold diffusion, reduces finger gold surface scratches, avoids the phenomena that a coating film cannot be attached to a plate surface completely and etching solution seeps into an etching line, reduces the risk of contamination, and has great market prospect and application value.

Description

technical field [0001] The invention belongs to the field of circuit board processing, and in particular relates to a wire etching process for three-sided gold fingers. Background technique [0002] At present, as the market has more and more stringent requirements for golden fingers, the traditional three-sided gold golden finger can no longer meet the requirements of consumers. Many consumers now require that no copper should be exposed at the front end of the finger guide line of the gold finger, so the finger guide line cannot be set at the front. In the prior art, the conduction is designed to be connected to the inner layer by drilling or the conduction is realized by setting the lead wire in the PCB unit. Two choices. The three-faced gold gold finger achieves conduction through the unit design lead, and then etches the lead through the window. The gold finger electro-nickel gold and lead etching process are designed before the solder mask. [0003] However, there a...

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Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the technical bottlenecks in the prior art that the film cannot be completely attached to the board surface, the liquid medicine penetrates into other circuits during etching, the gold surface of the finger is scratched and the risk of contamination increases, thereby proposing a An environmentally friendly and energy-saving lead etching process with a high pass rate that solves gold penetration and reduces scratches on the gold surface of fingers