Circuit board production method using immersion gold and electrolytic gold plating combined surface treatment

A technology of composite surface treatment and production method, which is applied in chemical/electrolytic methods to remove conductive materials, printed circuits, and printed circuit manufacturing. Achieve the effect of saving time, improving quality and production efficiency, and reducing processes

Inactive Publication Date: 2017-08-11
广东依顿电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The current method of making wire seed boards for partial electroplating thick gold surface treatment requires electroplating copper to thicken the production boards after the pattern transfer, and electroplating a layer of anti-corrosion tin layer, and then using strong alkali to dry the photosensitive film. Remove, use a strong oxidizing potion to remove the exposed copper, and finally remove the electroplated

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Example 1: Production of immersion gold and electro-gold composite surface-treated high Tg plate circuit boards

[0038] a. After drilling the substrate (Isola FR408Tg ≥ 180°), perform plasma deglue and then copper plate electroplating, and then perform graphic electroplating to thicken the copper layer of the entire board to meet the copper thickness requirements of the finished product;

[0039] Plasma degumming parameters:

[0040] Stage 1: O 2 : 1.8L / min warm up for 30min to 55°C,

[0041] Phase Two: O 2 : 1.9L / min; N 2 :0.22L / min; CF 4 : 0.22L / min, glue removal 25min,

[0042] Three stages: O 2 : 1.8L / min, cleaning 5min.

[0043] b. Print anti-immersion gold dry film (DuPont W250, thickness 1.5mil) on the thick copper substrate. After exposure and development of film, a circuit pattern with open window and exposed copper is formed. The anti-immersion gold dry film covers the finished substrate area and electro-gold Position, immersion gold (minimum control ...

Embodiment 2

[0047] Embodiment 2: Production of common Tg plate circuit boards with immersion gold and electro-gold composite surface treatment

[0048] a. Drill the substrate (Tg ≥ 150°) and sink the copper plate for electroplating, and then carry out graphic electroplating to thicken the copper layer of the entire board to meet the copper thickness requirements of the finished product; because the size of the non-plated hole on the circuit board is 3.2mm, which exceeds the dry film seal Hole capacity, firstly carry out graphic plating on the substrate to thicken the copper, then paste the dry film on the substrate through film exposure and development to expose the non-plated holes and slots, and then etch the plate to etch away the copper in the non-plated holes and slots, Then fade the film to prevent the anti-deposition gold dry film in the subsequent process from being unable to seal the large non-plating holes and slots, and the dry film ruptures and seeps into the potion and sinks g...

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PUM

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Abstract

The invention discloses a circuit board production method using immersion gold and electrolytic gold plating combined surface treatment. A substrate is drilled and then subjected to electroless copper deposition panel plating; then the whole copper layer is thickened by pattern plating; then an anti-immersion gold dry film is printed; after exposure and development of the film, a circuit pattern with copper exposed in an open window is formed; immersion gold plating is carried out and the film is stripped off; then an anti-immersion gold dry film is printed; after exposure and development of the film, electrolytic gold plating is carried out and the film is stripped off; the circuit board is subjected to etching, and the exposed copper surface is etched off; an in-process inspection is carried out; solder masking ink is printed and follow-up processes are carried out. The method substantially simplifies the technique and solves the problems of gold infiltration and low consumed time in the prior art. The entire production process has only one etching, so that the entire substrate has the conductive copper surface to complete the electrolytic copper plating before the electrolytic copper plating, thereby reducing the process and improving the quality and production efficiency. According to the invention, the circuit pattern is produced at the same time as an immersion gold surface treatment area, and surface treatment is completed before silk screen and solder masking, so that the process is reduced, the time is saved and the production efficiency of the circuit board is improved.

Description

[0001] 【Technical field】 [0002] The invention relates to a production method of a circuit board with combined surface treatment of immersion gold and electro-gold, belonging to the technical field of printed circuit boards. [0003] 【Background technique】 [0004] The general circuit board production process includes cutting, drilling, copper sinking, full board electroplating, outer layer graphics transfer, graphic electroplating, etching, solder mask, characters, surface treatment, molding, electrical testing, FQC, FQA, packaging, etc. [0005] With the ever-changing electronic products and the multi-functional requirements, when some circuit boards are designed, different areas have different surface treatment requirements. In order to save costs, circuit board designers usually electroplate thick gold of more than 30 microinches locally on the circuit board, while other places only need 1-3 microinches of chemical gold. [0006] The current method of making wire seed boa...

Claims

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Application Information

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IPC IPC(8): H05K3/06
CPCH05K3/06H05K2203/1461
Inventor 莫介云
Owner 广东依顿电子科技股份有限公司
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