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Manufacturing method of matted gold line of circuit board

A manufacturing method and circuit board technology, applied in the direction of improving the metal adhesion of insulating substrates, manufacturing printed circuits, printed circuits, etc., can solve unsatisfactory problems, improve reliability, increase surface roughness, improve penetration, etc. bad effect

Active Publication Date: 2015-06-03
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of electronic equipment in the direction of light, thin, high performance, and multi-function and the advancement of electronic assembly technology, PCB products for the interconnection of electronic components have fully embarked on surface mount technology from the stage of through-hole technology (THT) (SMT) stage, moving to the chip-scale packaging (CSP) stage, and is gradually moving to the system-in-package (SIP) stage, the requirements for surface mount technology are becoming more and more stringent, and the requirements for circuit board process performance and types are becoming more and more stringent. Many, among them, the dumb gold circuit is one of them, but the gold surface of the current electroplating gold circuit board is bright after normal electroplating, which cannot meet the requirement that the gold surface after electroplating is matte gold

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The core board is cut out according to the size of the panel; the drilling data is used for drilling processing; the outer layer is deposited with copper to metalize the hole, so that the backlight test of the metal hole can reach 9.5 or above.

[0018] The core board is electroplated for the whole board. The whole board electroplating includes firstly using a current density of 1.4ASD electroplating for 30 minutes for the whole board, and then using a current density of 1.4ASD for 60 minutes for thickening electroplating. After thickening electroplating, the thickness of the copper layer on the surface of the core board is 48-50μm (The copper layer thickness required for the final product is 45 μm).

[0019] Clean the whole plated circuit board with a sulfuric acid solution with a mass fraction of 3%; then use a non-woven grinding machine with a grinding current of 2.8A and a grinding scar width of 11mm to grind the plate; spray and rinse the circuit board with water an...

Embodiment 2

[0025] The core board is cut out according to the size of the panel; the drilling data is used for drilling processing; the outer layer is deposited with copper to metalize the hole, so that the backlight test of the metal hole can reach 9.5 or above.

[0026] The core board is electroplated for the whole board. The whole board electroplating includes firstly using a current density of 1.3ASD electroplating for 35min for the whole board, and then using a current density of 1.3ASD for 70min for thickening electroplating. After thickening electroplating, the thickness of the copper layer on the surface of the core board is 48-50μm (The copper layer thickness required for the final product is 45 μm).

[0027] Clean the whole plated circuit board with a sulfuric acid solution with a mass fraction of 3%; then use a non-woven grinding machine with a grinding current of 2.8A and a grinding scar width of 10mm to grind the plate; spray and rinse the circuit board with water and residues...

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Abstract

The invention discloses a manufacturing method of a matted gold line of a circuit board, and belongs to the field of production and manufacturing of the circuit board. The manufacturing method sequentially comprises the following steps: whole board electroplating, surface super-roughening, external line pattern transferring, pattern nickel electroplating, pattern gold electroplating and etching; the step of whole board electroplating is carried out until copper thickness is 3-5microns more than a required thickness; the step of surface super-roughening is carried out by micro-etching a copper layer surface of the circuit board so as to control micro-etching thickness within 0.75 plus / minus 0.25microns; after micro-etching, roughness parameter values of the copper surface are as follows: Ra is 0.3-0.5microns and Rz is 3.0-4.0microns. Through the manufacturing method disclosed by the invention, the circuit board with the matted gold line is researched and developed; the copper surface is roughened by virtue of a super-roughening process and then nickel and gold are electrically matted on the copper surface, therefore through the roughened copper surface and the matted nickel, a gold surface is rougher than a normal gold-electroplated gold surface, so as to achieve required color of matted gold; meanwhile, by roughening the copper surface through the super-roughening process, surface roughness is increased, binding force between the gold surface and the surface layer is enhanced, defects such as plating permeation in the gold electroplating process are overcome, and the reliability of a product is improved.

Description

technical field [0001] The invention relates to the field of circuit board production and manufacturing, in particular to a method for manufacturing dumb gold circuits of a circuit board. Background technique [0002] With the development of electronic equipment in the direction of light, thin, high performance, and multi-function and the advancement of electronic assembly technology, PCB products for the interconnection of electronic components have fully embarked on surface mount technology from the stage of through-hole technology (THT) (SMT) stage, moving to the chip-scale packaging (CSP) stage, and is gradually moving to the system-in-package (SIP) stage, the requirements for surface mount technology are becoming more and more stringent, and the requirements for circuit board process performance and types are becoming more and more stringent. Many, among which, the dumb gold circuit is one of them, and the gold surface of the current process electro-gold circuit board i...

Claims

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Application Information

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IPC IPC(8): H05K3/18H05K3/38
CPCH05K3/241H05K2203/0766H05K2203/0789
Inventor 敖四超刘建辉邓峻白会斌
Owner JIANGMEN SUNTAK CIRCUIT TECH
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