63results about "Printed circuit drying" patented technology

The invention discloses a roll-to-roll cleaning control method and system for a flexible circuit board electronic structural member, and relates to the technical field of electronic manufacturing, and the method comprises the steps: carrying out the partitioning processing of a to-be-cleaned member, and obtaining a thin region and a thick region; the drying cavity is partitioned on the basis of the thin area and the thick area, and a partitioned temperature control method is constructed; a dehumidification drying module is placed, and a hot air drying method is obtained based on a chilled mirror dew-point instrument; the roll-to-roll cleaning control method is used for solving the problems that in an existing roll-to-roll cleaning control method for the flexible circuit board electronic structural part, differential temperature control is not carried out on a thick area and a thin area, and the influence of environment humidity in a drying cavity on the drying effect is not considered; the problems that a thin plate is overheated after being dried, water in a thick plate is not completely evaporated, watermarks which cannot be wiped appear on the surface of the electronic structural part, and then the practicability of the cleaned electronic structural part is affected are solved.

The invention relates to a fixed connection method and device for a cable and a circuit board, and the method comprises the following steps: S1, carrying out the positioning of a wiring harness in the circuit board and the cable, and enabling the bonding wires of the wiring harness to be separated from each other; s2, performing visual inspection on the positioned wire harness and the circuit board, distinguishing a bonding wire and a bonding pad, and calibrating coordinate points of the bonding wire and the bonding pad; then, according to the calibrated coordinate points of the bonding wire and the bonding pad, the set welding movement track is compensated; s3, according to the compensated welding movement track, welding wires of the wire harness are sequentially moved to the corresponding welding disc positions for welding; s4, after welding is completed, glue dispensing is carried out on the wire harness and the circuit board in sequence, so that glue overflows between the wire harness and the circuit board; and S5, after dispensing is completed, the glue is subjected to curing treatment. According to the invention, the connection efficiency and quality of the cable and the circuit board can be improved, and the connection strength of the cable and the circuit board is high.

To increase the density of metal in the repaired area. [Solution] The repair device is a device for repairing defects 94 in a pattern 93 formed on the upper surface 91 of a substrate 9. The substrate holding part holds the substrate 9 on which the pattern 93 is formed on the upper surface 91. The application part 32 applies droplet-shaped conductive paste to the defects 94 in the pattern 93. The hardening part 33 hardens the conductive paste by heating and drying it. The compression part 34 presses the hardened conductive paste toward the substrate 9 while heating it. This makes it possible to increase the density of metal in the repair part provided to fill the defects 94.

The invention belongs to the field of circuit board processing, and particularly relates to a circuit board and a processing method thereof, and the method comprises the following steps: transferring an image on a production film to a plate; electroplating a conductive layer on the exposed copper sheet of the circuit pattern of the board and the hole wall; removing an anti-electroplating covering film layer of the plate by using a cleaning solution to expose a non-circuit copper layer of the plate; the plate is installed in a machining device to be subjected to acid pickling, an exposed copper layer on the plate is removed through an acid pickling solution, and the residual acid pickling solution on the plate is removed while the plate is separated from the acid pickling solution; the board is immersed in water, the board is cleaned, residual water on the board is removed while the board is separated from the water, the board is dried, and the circuit board is obtained; according to the method, the residual pickling solution on the plate can be removed while the plate is separated from the pickling solution, and the pickling solution is prevented from dripping on other equipment.

The application discloses an aluminum nitride film circuit substrate and a preparation method thereof, and relates to the technical field of aluminum nitride substrates.The application is characterized by the following steps: a titanium film is plated on the surface of an aluminum nitride ceramic substrate by magnetron sputtering, and then a copper film is plated on the surface of the titanium film by magnetron sputtering; and a nickel film is plated on the surface of the copper film by a chemical plating method to prepare the aluminum nitride film circuit substrate.Through the titanium-copper gradient dynamic transition technology, a gradient alloy layer is formed to reduce the interface stress; the titanium and the surface of the aluminum nitride are combined through a chemical bond to form a dense transition layer, thereby relieving the difference in the thermal expansion coefficient; the copper enhances the conductive performance of the surface of the aluminum nitride ceramic substrate; the titanium compensates for the interface defects of the mismatch between the copper and the aluminum nitride ceramic lattice; the chemical nickel plating enhances the hardness and corrosion resistance of the aluminum nitride ceramic substrate, and the aluminum nitride film substrate is endowed with weldability and bondability.

A thermal processing device is disclosed herein for thermally processing material on a substrate. The thermal processing device includes a support plate which at a first main side is provided with a layer stack having a free surface for supporting the substrate, wherein the free surface defines a reference plane and which layer stack includes a first resistive heating layer, a second resistive heating layer, and an electrical insulator layer between the first resistive heating layer and the second resistive heating layer. The resistive heating layer each comprise a respective plurality of mutually electrically insulated resistive heating strips that extend in a mutually different directions. Respective pairs of a resistive heating strip of the first plurality and a resistive heating strip of the second plurality overlap in respective areas.

The application belongs to the technical field of circuit board processing machines, and relates to an electroplating device for integrated circuit board processing, which comprises a groove body, a protective cover horizontally and slidingly installed in the groove body, a drilling assembly rotatably installed on the protective cover, and a first driving assembly installed between the protective cover and the drilling assembly; the groove body has a vertical second partition plate inside, the groove body between the second partition plate and the protective cover has a vertical first partition plate, the first partition plate is provided with a clearance hole matched with the drilling, the first partition plate and the second partition plate have a polishing assembly; the protective cover and the first partition plate are provided with a collecting hopper below; the sidewall of the groove body between the first partition plate and the protective cover is provided with an air hole; the groove body is provided with a U-shaped frame, the U-shaped frame is provided with a clamping assembly, the lower portion of the U-shaped frame is provided with a drying assembly, and the groove body is provided with an electroplating assembly at the end away from the protective cover; the electroplating device can clean the circuit board in time after polishing and improve the subsequent electroplating quality. The circuit board can be dried in time after electroplating, which facilitates subsequent assembly work.

The application relates to the field of circuit boards, in particular to surface treatment equipment for PCB (Printed Circuit Board) processing, which comprises a bottom plate, a soaking box and a driving assembly; the soaking box is fixedly connected to the bottom plate; the bottom plate is connected with the driving assembly used for driving the movement of a fixing frame and parts thereon; the surface treatment equipment further comprises the fixing frame and the like; the driving assembly is connected with the fixing frame; a plurality of electric push rods I are fixedly connected to the fixing frame; the extension ends of all the electric push rods I are collectively fixedly connected with a connecting plate, and the connecting plate is slidingly connected with the fixing frame. The rectangular plate drives the connecting pipe and the absorption cylinder to move to the side close to the corresponding blind hole by controlling the electric push rod III, the absorption cylinder and the corresponding absorption cotton are separated from each other, until the absorption cylinder enters the blind hole, the sponge on the surface of the absorption cylinder absorbs and cleans the excess soaking liquid in the blind hole, and the problem that the soaking liquid remaining in the blind hole cannot be completely drained in the prior art, the thickness of the protective layer in the blind hole is relatively higher, and the draining efficiency is low is avoided.

The invention provides drying and curing integrated equipment based on a through hole film layer for a printed circuit board and a process thereof. Due to the fact that the air outlet end of each air outlet transmission wheel continuously outputs heat and the circuit board continuously moves, a plurality of surrounding baffles are arranged, each surrounding baffle divides the hot air drying cavity into a plurality of hot air backflow cavities, and each hot air backflow cavity is located over the corresponding air inlet fixing shaft. In other words, hot air output by the air outlet ends of the air outlet transmission wheels on the air inlet fixing shaft flows back to the circuit board moving path through the hot air backflow cavity and diffuses towards the two ends of the circuit board moving path to act on the surface of the circuit board, and in other words, temperature compensation is conducted on the surface of the circuit board through the backflow hot air. Therefore, the utilization rate of heat output can be improved, heat loss caused by the fact that hot air gathers at the top of the hot air drying cavity is avoided, meanwhile, the whole circuit board can be dried and solidified, and a high-quality conducting layer is formed on the circuit board.

A system for photonic sintering of a metal electrode is provided. The system includes a display. The display includes a substrate including a first side and a second side, and the display includes the metal electrode extending from the first side to the second side. The system also includes a photonic device for sintering the metal electrode. The photonic device includes a lamp configured to generate photonic energy, and the photonic device includes a mask positioned between the metal electrode and the lamp. The mask defines a slit therein, and the mask is configured to allow a portion of the photon energy from the lamp to pass through the slit toward the metal electrode.

The invention relates to the field of integrated circuit manufacturing, in particular to the technical field of manufacturing of semiconductor device special equipment such as a photoetching machine and an etching machine special for production, and provides a windowing-free Mark point structure for a PCB cover film and a manufacturing method of the windowing-free Mark point structure. The method comprises the following steps: preparing a PCB substrate and pre-processing a copper surface; for a yellow covering film area of the PCB substrate, the yellow covering film is attached to the corresponding position of the PCB substrate, windowing processing is not carried out on the covering film at the Mark point position, and the color of the yellow covering film and a background copper surface are utilized to form a contrast ratio for SMT equipment identification; for the black covering film area, white ink points are manufactured at the Mark point positions of the substrate, and the black covering film is attached to the corresponding positions of the PCB substrate; and after the lamination is completed, carrying out curing treatment on the cover film. By means of the windowing-free design of the yellow covering film area, the drilling / laser cutting procedure and the nickel-gold immersion process are omitted, and consumption of precious metal is avoided.

The present application relates to the technical field of circuit board processing equipment, and particularly relates to a circuit board glue residue removing device and method. The device comprises a support frame, a rotating frame rotatably connected to the support frame, a mounting frame symmetrically connected to the bottom of the rotating frame, a rotating frame rotatably connected to the mounting frame, a driving motor symmetrically mounted on the side surface of the rotating frame, a brush cylinder symmetrically rotatably connected to the rotating frame, and a rotating shaft of the brush cylinder being connected to an output shaft of the driving motor, a first motor mounted on the side surface of the mounting frame, a first worm connected to the output shaft of the first motor, and a first worm wheel connected to the rotating shaft of the rotating frame and engaged with the first worm. Through cooperation of the cleaning frame, the first screw rod motor and the moving plate, the device can automatically scrape off the glue residue adhered to the brush cylinder and collect the glue residue into a collection box, effectively avoiding the problem of efficiency reduction caused by glue residue accumulation of a traditional brush, and significantly improving the glue residue removing effect and the continuous working capacity of the device.

The invention discloses a novel server FPC (Flexible Printed Circuit) prepared based on weldable silver paste, which comprises a weldable silver paste circuit layer printed on the surface of a flexible substrate, a covering protection layer covering the surface of the flexible substrate printed with the weldable silver paste circuit layer, and a reinforcing layer adhered to a non-weldable silver paste circuit layer area, the weldable silver paste circuit layer is obtained by printing weldable silver paste prepared by mixing modified silver powder, an organic tin-silver complex, an organic carrier, a functional additive and an antioxidant, and the method comprises the steps of 1, material pretreatment and preparation, 2, silver paste printing, 3, low-temperature curing treatment, 4, protection treatment and 5, component welding. Through the collaborative design of the spherical modified silver powder, the organic tin-silver complex and the low-shrinkage flexible polymer, the interfacial tension of the molten solder can be reduced, gold plating or OSP pretreatment is not needed, the welding reliability is improved, meanwhile, the process is simplified, the equipment investment is greatly reduced, the labor cost is greatly reduced, and the production period is greatly shortened.

The application discloses a flexible circuit board electronic structural member roll-to-roll cleaning control method and system, and relates to the technical field of electronic manufacturing, which comprises the following steps: carrying out partition processing on the to-be-cleaned member to obtain thin areas and thick areas; carrying out partition processing on a drying cavity based on the thin areas and the thick areas, and constructing a partition temperature control method; placing a dehumidifying drying module, and obtaining a hot air drying method based on a cold mirror dew point instrument; the application is used to solve the problem that in the existing flexible circuit board electronic structural member roll-to-roll cleaning control method, the thick and thin areas are not differentiated in temperature control, and the influence of the environmental humidity in the drying cavity on the drying effect is not considered, resulting in overheating of the thin plate after drying, incomplete evaporation of water in the thick plate, and watermarks appearing on the surface of the electronic structural member which cannot be wiped, thereby affecting the practicability of the electronic structural member after cleaning.

The invention discloses a PCB (Printed Circuit Board) solder resist silicon-free ink spraying method and equipment. The PCB solder resist silicon-free ink spraying method comprises the following steps of S100, performing pretreatment on a PCB after hole plugging; s200, a diluent is used for cleaning spraying equipment for the first time, and silicon-free solder resist ink is used for spraying the first face of the PCB after pretreatment; s300, after the spraying equipment is cleaned for the second time by using a diluent, spraying is carried out on the second surface of the PCB by using silicon-free solder resist ink; s400, carrying out pre-drying, exposure, development and post-drying on the PCB after the two times of spraying; wherein the step S200 and the step S300 are carried out in a constant-temperature and constant-humidity dust-free environment, and the spraying parameters meet the conditions that the low-viscosity flow velocity of the printing ink is 27-33 s, the high-viscosity flow velocity of the printing ink is 50-56 s, the atomization rate of the spray gun in the step S200 is 500-600 per thousand, and the atomization rate of the spray gun in the step S300 is 400-500 per thousand.

The invention discloses an MIC pressing machine for flexible circuit board production and a using method thereof.The MIC pressing machine comprises a rack outer frame assembly, an automatic pressing mechanism is fixedly connected to the interior of the rack outer frame assembly and comprises a machine body assembly, and a rotating disc assembly is arranged on the right side of the top of the machine body assembly; the rear side of the top of the machine body assembly is fixedly connected with a pressing position, the rear side of the right side of the top of the rotary disc assembly is provided with a robot automatic discharging position, the left side of the front side of the top of the rotary disc assembly is provided with a robot automatic feeding position, and a detection assembly is arranged in the machine body assembly. According to the MIC pressing machine, the phenomena that products are manually placed traditionally and pressing is uneven are changed, automatic feeding and discharging are conducted through the mechanical arm, each pressing mechanism corresponds to one independent die needing pressing, the pressure of each pressing head can be independently regulated and controlled, then the products can be automatically placed, the pressing effect is better, and the production efficiency is improved. And the overall processing quality is ensured.

The embodiment of the invention relates to the technical field of PCB manufacturing, in particular to a PCB golden finger manufacturing method and device, and a whole PCB comprises a board edge structure and a plurality of PCB daughter boards arranged in the board edge structure; wherein the gold fingers of the two adjacent PCB daughter boards are adjacently arranged and are spaced through the process edges of the board edge structure, and the process edges are provided with a first lead and a second lead which are respectively connected with the two adjacent gold fingers, and gold plating is carried out on the gold fingers of the PCB daughter boards through the first lead or the second lead of different process edges. And forming a gold plating layer on the golden finger of the PCB daughter board. According to the invention, gold plating is carried out on the golden fingers of each PCB daughter board independently, and the electroplating control is realized by using the independent leads on the process edge, so that the problems of non-uniform thickness of a gold plating layer and signal interference of adjacent golden fingers in the traditional process are solved, the uniformity of the gold plating layer is improved, and electric signal crosstalk of the adjacent golden fingers is avoided; and the gold plating quality and the product yield are improved.

The application discloses a PCB copper surface repairing device and a repairing process, relates to the PCB repairing technical field, and solves the problem that when four elastic ropes are used to fix the PCB, the elastic ropes need to be repeatedly adjusted multiple times to ensure that the rotating plate on the elastic rope is perpendicular to the PCB, and the fixing steps of the PCB are complicated, comprising a water washing pool, a drain pipe which is in communication with the water washing pool and is fixedly installed outside the water washing pool, a material supporting mechanism which is used for containing the PCB to be repaired and is installed in the inside of the water washing pool, and a driving assembly which is used for driving the material supporting mechanism to move backward in the inside of the water washing pool, and the material supporting mechanism can automatically flexibly clamp the PCB, the fixing operation of the PCB is simple and convenient, and the repairing efficiency of the copper surface of the PCB is greatly improved.

The invention discloses a process for transferring a stepped circuit pattern on the surface of a PCB (Printed Circuit Board). The process specifically comprises the following steps of: (1) covering a layer of photosensitive ink on the surface of the PCB; (2) carrying out low-temperature baking on the printed board; (3) exposing the photosensitive ink layer by using ultraviolet light, wherein the used exposure negative film is a negative film; (4) developing by using a weak alkali liquid plate, dissolving and removing an unexposed ink region, and exposing a circuit and a bonding pad region which need pattern electroplating; the exposed curing ink area is reserved on the plate and is used as an anti-plating layer during pattern electroplating; (5) baking the plate at high temperature; (6) feeding the board into a pattern electroplating line, and electroplating the exposed copper surface area with a required copper layer thickness; and (7) removing the cured photosensitive ink layer, performing alkaline etching, and finally forming a precision circuit. The photosensitive ink is used for replacing a dry film, so that the problem of dry film wrinkling caused by a stepped structure on the surface of the PCB is effectively solved, the open and short circuit defects after pattern electroplating are avoided, and the production yield and the product quality are improved.

A drying device contains an upper drying head and a lower drying head. The upper drying head is arranged above a transport plane, in which objects to be dried can be transported in a transport direction through the drying device. The lower drying head is arranged below the transport plane. The upper drying head and the lower drying head contain in each case at least one air outlet slot and the longitudinal directions of the air outlet slots essentially extending parallel to the transport plane and transversely to the transport direction, and in which slot planes, in which the air outlet slots extend, intersect the transport plane at angles which are greater than 0° and less than 90°.

The application discloses a coating and baking machine, which comprises a coating machine, an oven and an elastic clamping chain system. The coating machine is used for coating ink on a substrate, the oven is used for drying the ink on the substrate, and the elastic clamping chain system is used for conveying the substrate from the coating machine to the oven. The elastic clamping chain system comprises a conveying chain, an opening clamping device and an elastic clamp. The elastic clamp comprises a mounting piece, a supporting piece and a clamping piece. The mounting piece is used for fixing the elastic clamp to the conveying chain. The supporting piece is fixedly installed on or integrally formed on the mounting piece. The clamping piece is elastically connected to the mounting piece or the supporting piece through a hinge shaft and is used for clamping the substrate in cooperation with the supporting piece. The clamping piece comprises a clamping arm and a driving arm. The clamping arm has a first tip. The clamping arm and the driving arm are located on two sides of the hinge shaft respectively. When the elastic clamp moves to the opening clamping position along with the conveying chain, the driving arm is driven to open the clamping arm. Through the improved elastic clamping chain system, the processing of a thin circuit substrate is realized.

The application relates to the field of integrated circuit manufacturing, in particular to the technical field of manufacturing special-purpose equipment such as special-purpose photoetching machines and etching machines for semiconductor devices, and provides a window-free Mark point structure for a PCB cover film and a manufacturing method thereof. The method comprises the following steps: preparing a PCB substrate and pretreating a copper surface; for a yellow cover film area of the PCB substrate, the yellow cover film is attached to a corresponding position of the PCB substrate, the cover film at a Mark point position is not subjected to windowing treatment, and the color of the yellow cover film itself is used to form contrast with a background copper surface for SMT equipment identification; for a black cover film area, a white ink point is first manufactured at a Mark point position of the substrate, and the black cover film is attached to a corresponding position of the PCB substrate; and after the attachment is completed, the cover film is subjected to solidification treatment. Through the window-free design of the yellow cover film area, the drilling / laser cutting process and the nickel gold sinking process are omitted, and the consumption of precious metals is avoided.

The invention discloses a circuit board resistance welding post-baking product frame, which comprises a base mechanism, two groups of bearing mechanisms and a plurality of groups of positioning mechanisms, the base mechanism comprises a base frame, the two groups of bearing mechanisms are respectively positioned at the front part and the rear part of an inner cavity of the base frame, the positioning mechanisms are respectively positioned at the front part and the rear part of the inner cavity of the base frame, and the positioning mechanisms are respectively positioned at the front part and the rear part of the inner cavity of the base frame. The invention relates to the technical field of circuit board frames. According to the product frame for baking after resistance welding of the circuit board, the strip-shaped plate is mounted in the base frame, the U-shaped rod is mounted at the top of the base frame, and the whole U-shaped rod is inclined and is close to a vertical angle, so that the circuit board cannot slide while being supported; and meanwhile, the U-shaped rods and the U-shaped rods are in rigid connection with the base frame, so that a rigid frame is formed, the U-shaped rods are not prone to being damaged under the condition that stability is guaranteed, and the service life of equipment is prolonged.

The present application relates to the technical field of HDI printed circuit board processing, in particular to a processing method for solving the problems of copper surface residual glue and small size of binding PAD in cavity product position, after laser cavity processing, the characteristic vector is input into the trained gradient boosting regression tree (GBRT) model, and the adaptive plasma parameter is output, and the cavity copper surface is treated by adopting the adaptive plasma parameter; the present application realizes the dynamic matching of residual glue characteristics and treatment parameters by adopting the GBRT model to adaptively output the plasma parameter and combining with the sand blasting path planned by the A* algorithm; wherein the prediction error of the GBRT model to the plasma parameter is less than or equal to 5%, the priority coverage of the region to be optimized is ensured, the path overlap rate is less than or equal to 5%, the final residual glue removal rate is improved to more than 98%, and the problem of incomplete treatment of traditional fixed parameters is solved.

The invention discloses a circuit board developing mechanism which comprises a box body, a first opening is formed in the top of the box body, and a dust cover is fixedly connected to the top of the box body. When the circuit board developing mechanism is used, when the circuit board moves to the position below a liquid spraying pipe, a developing solution in a liquid storage box can be pumped into the liquid spraying pipe through work of a first water pump; a second worm is driven to rotate through transmission connection between a transmission wheel and a driven wheel, so that left-right reciprocating movement of a push plate is realized, a liquid spraying pipe and a water spraying pipe are driven to move left and right in a reciprocating manner, and a developing solution can be uniformly sprayed on the surface of the circuit board; then, when the circuit board moves to the position below a water spraying pipe, a second water pump works to spray clean water in a water tank to the surface of the circuit board through the water spraying pipe and wash the surface of the circuit board, and water stains on the surface of the circuit board can be sucked dry through left-right movement of a plurality of water suction rollers.

The invention relates to the technical field of printed circuit board processing, and discloses a printed circuit board drying device which comprises a drying box, the back of the drying box is fixedly connected with a drying hot-air blower used for generating hot air, and an air outlet of the drying hot-air blower is fixedly communicated with a conveying pipe used for conveying the hot air. The exterior of the conveying pipe fixedly communicates with air outlet nozzles at equal intervals, the top of the drying box fixedly communicates with a moisture discharging pipe used for discharging water vapor, a uniform drying assembly is arranged at the bottom of an inner cavity of the drying box, a moisture discharging assembly is arranged outside an inlet of the moisture discharging pipe, and a filter screen is fixedly connected to the top of the moisture discharging pipe. And a dust removal assembly is arranged outside the filter screen. The problem that the placement position of the printed circuit board is difficult to adjust is effectively avoided, so that the drying uniformity of the printed circuit board is improved, and the practicability is high.

The invention discloses a circuit board processing method which comprises the following steps: step 1, obtaining a substrate which is provided with a copper layer; 2, performing first grain boundary reconstruction treatment on the surface of the copper layer to reduce the grain size of the copper layer and increase the grain boundary density; 3, performing first tin immersion treatment on the surface of the copper layer subjected to the first grain boundary reconstruction treatment to form a first tin layer; 4, baking the circuit board after the first tin immersion; step 5, performing secondary grain boundary reconstruction treatment on the surface of the first tin layer to reduce the grain size of the first tin layer and increase the grain boundary density; and step 6, performing secondary tin immersion treatment on the surface of the first tin layer after the secondary grain boundary reconstruction treatment to form a second tin layer, so that on one hand, the density and hardness of the first tin layer and the second tin layer can be increased, and on the other hand, the growth of whiskers can be inhibited, thereby improving the use safety of the circuit board.

The invention discloses a method for manufacturing a flexible circuit board with the line spacing smaller than or equal to 40 micrometers. High-density circuit manufacturing is achieved through whole-process technology optimization. A low-copper-tooth copper-clad plate is selected, and the precision of a base material is improved through UV laser drilling and nanoscale carbon film black shadow treatment; a high-resolution dry film is combined with LDI exposure and dynamic light intensity compensation, edge hardening is carried out after development is carried out in cooperation with a phenolic resin ethanol solution, and the adhesive force of the dry film is enhanced; and film stripping adopts a two-step method of hydrothermal solution alkali soaking and mechanical spraying, internal stress is eliminated by combining gradient heating baking, and then copper reduction is performed. The flexible circuit board can effectively solve the problems that in the prior art, a dry film is prone to falling off, electroplating film clamping occurs, the dry film falls off in the developing process, the film stripping phenomenon is incomplete in the film stripping process, copper is left in the line spacing, line edge burrs exist, and the like, the manufacturing precision and the yield of the flexible circuit board are improved, environmental pollution is reduced, and the production cost is reduced. And high-efficiency production of the high-density and high-reliability flexible circuit board is realized.

The present application relates to the field of FPC, and discloses a new energy single-sided double-contact FPC production process, comprising the following steps: S1, preparing a cover film roll and a blackened pure copper foil roll; S2, first using die cutting process to open a window in the whole roll of the first cover film in a roll-to-roll manner; S3, using an existing coating and compounding process to compound the blackened pure copper foil with the required width and the die-cut cover film to form a composite roll; S4, and using a roll-to-roll manner to age the composite roll of S3; then baking the aged composite roll; S5, cleaning the bottom film of the composite roll of S4 to remove the blackened layer on the back of the composite roll; S6, using a double-sided dry film pressing equipment or a coating photosensitive oil equipment to press or coat the composite roll of S5 in a roll-to-roll manner; S7, positioning hole target punching is performed on the composite roll of S6 in a roll-to-roll manner, and the number of positioning holes is four, which are respectively located at the four corners of the composite roll.