190results about "Printed circuit drying" patented technology

The invention discloses a flexible circuit board made of weldable low-temperature silver paste and a preparation process of the flexible circuit board, and relates to the technical field of flexible electronic device manufacturing, and the flexible circuit board comprises a base material layer, a low-temperature weldable silver paste conductive layer and a protective layer. According to the invention, the collaborative design of the weldable low-temperature silver paste and the self-repairing protection layer is integrated, the efficient preparation of the flexible circuit board is realized through the printing technology, the weldable low-temperature silver paste breaks through the traditional high-temperature limitation, supports a wide range of substrates and can be directly welded without surface treatment, and in addition, the polyurethane protection layer containing the dynamic disulfide bond has a self-repairing function. Compared with a traditional FPC, only two core processes of printing and baking are needed, the process is greatly simplified, the equipment investment is reduced, and double reduction of the manufacturing cost and the material cost is achieved.

The invention discloses a roll-to-roll cleaning control method and system for a flexible circuit board electronic structural member, and relates to the technical field of electronic manufacturing, and the method comprises the steps: carrying out the partitioning processing of a to-be-cleaned member, and obtaining a thin region and a thick region; the drying cavity is partitioned on the basis of the thin area and the thick area, and a partitioned temperature control method is constructed; a dehumidification drying module is placed, and a hot air drying method is obtained based on a chilled mirror dew-point instrument; the roll-to-roll cleaning control method is used for solving the problems that in an existing roll-to-roll cleaning control method for the flexible circuit board electronic structural part, differential temperature control is not carried out on a thick area and a thin area, and the influence of environment humidity in a drying cavity on the drying effect is not considered; the problems that a thin plate is overheated after being dried, water in a thick plate is not completely evaporated, watermarks which cannot be wiped appear on the surface of the electronic structural part, and then the practicability of the cleaned electronic structural part is affected are solved.

A printed circuit board (PCB) serves as a core basic component of the electronic information industry, and the manufacturing process of the PCB faces double challenges of rapid iteration and customization requirements of electronic products. A traditional PCB manufacturing technology (such as mechanical board manufacturing, silk-screen printing and the like) is suitable for large-scale production, but has the defects of long production period, high cost, minimum order quantity limitation and the like, and is difficult to meet the market requirements of small batch and high flexibility. Under the background, the 3D printing technology is completely exposed by means of the efficient customized production capacity, the supply efficiency of a minimum batch of PCBs (such as test single boards and concept verification boards) can be remarkably improved, the production batch constraint of a traditional method is avoided, and the comprehensive cost advantage is shown in the design verification stage. However, the current 3D printing PCB technology is still limited by the circuit complexity and the number of layers and is mostly limited by single / double panel manufacturing, and the performance of the conductive slurry and the base material needs to be optimized urgently. The key technical bottlenecks of interlayer vertical interconnection, multilayer medium lamination manufacturing and the like need to be broken through in the future, so that 3D printing of high-density and multilayer arbitrary interconnection PCBs is achieved, deep application of the technology in the field of intelligent manufacturing and new materials is promoted, and an innovative development opportunity is created for the PCB industry.

The invention belongs to the technical field of circuit board processing machinery, and relates to an electroplating device for integrated circuit board processing, which comprises a tank body, a protective cover is horizontally and slidably mounted in the tank body, a drilling assembly is rotatably mounted on the protective cover, and a first driving assembly is mounted between the protective cover and the drilling assembly; a vertical second partition plate is arranged in the groove body, a vertical first partition plate is arranged in the groove body between the second partition plate and the protective cover, a receding hole matched with the drill hole is formed in the first partition plate, and a polishing assembly is arranged between the first partition plate and the second partition plate; a collecting hopper is arranged below the protective cover and the first partition plate; air holes are formed in the side wall of the tank body between the first partition plate and the protective cover; the U-shaped frame is arranged on the tank body, the clamping assembly is arranged on the U-shaped frame, the drying assembly is installed below the U-shaped frame, the electroplating assembly is installed at the end, away from the protective cover, in the tank body, abrasive dust of the circuit board is removed in time after polishing is completed, and the follow-up electroplating quality is improved. And after electroplating is completed, the circuit board is dried in time, and follow-up assembling work is facilitated.

The invention relates to the technical field of circuit board production and processing, and discloses a circuit board character tunnel oven baking system and a control method, and the method comprises the steps: obtaining the information data of a to-be-baked circuit board, carrying out the character region feature modeling, and determining a single-stage or multi-stage baking mode according to the feature data; setting an initial temperature for a single-stage mode and adjusting thermal field uniformity, and setting an initial temperature for a multi-stage mode and analyzing a thermal field fluctuation range; performing time sequence temperature change prediction on the multi-stage thermal field fluctuation, dynamically regulating and controlling the temperature, and combining two types of data to construct a temperature control strategy; feedback data are collected to evaluate baking quality, and a control strategy is adaptively optimized. The system comprises a baking mode recognition module, a single-stage temperature regulation module, a multi-stage temperature regulation module and a feedback optimization module. The circuit board baking system realizes intelligent selection of baking modes and accurate temperature regulation and control, improves the circuit board baking quality and production efficiency, and is suitable for the field of circuit board production and processing.

The invention relates to a high-efficiency heat dissipation circuit board and a manufacturing method thereof, and the manufacturing method comprises the steps: constructing a raw material performance database through the structural collection and evaluation of the physical parameters of a high-thermal-conductivity nanofiller and a resin matrix, and guiding the nanofiller to adaptively migrate and locate along the gradient through the adjustment of the partition solvent evaporation rate and the interfacial tension gradient. And an efficient heat-conducting filler network with orderly partitions is formed. Furthermore, in-situ multi-mode detection and automatic feedback optimization are combined, the dispersion uniformity of the filler and the continuity of a heat conduction channel are guaranteed, and the circuit board with uniform heat dissipation performance is prepared through a medium-low temperature step-by-step curing latch structure.

The invention relates to the field of circuit board processing automation equipment, and discloses a circuit board chip mounter and a dispensing mechanism, the circuit board chip mounter comprises a support, the top of the support is provided with a positioner, the exterior of the positioner is provided with a material taking device through screws, the material taking device comprises a mounting table and a positioning plate, and the top of the mounting table is provided with a pneumatic pump; a conveying pipe connected with the output end of the pneumatic pump is arranged in the mounting table, the bottom end of the conveying pipe is fixedly connected with a main flow divider, the output end of the main flow divider is fixedly connected with four secondary flow dividers, the output ends of the secondary flow dividers are fixedly connected with four material taking heads, and the multiple material taking heads are mounted in the positioning plate; the material taking head comprises a fixed box fixedly mounted at the top of the positioning plate and a movable shell slidably connected into the positioning plate. According to the device and the method, the glue is synchronously blow-dried while the surface mounting operation is completed, an additional drying station is not needed, and the influence of vibration and temperature and humidity environment changes on the surface mounting stability of the component in the conveying process is avoided.

The invention relates to the technical field of cleaning machines, in particular to a PCB after-copper-deposition cleaning machine which comprises a pickling machine, a clear water flushing machine is arranged on the left side of the pickling machine, a cold air drying machine is arranged on the left side of the clear water flushing machine, a hot air drying machine is arranged on the left side of the cold air drying machine, and a turnover box is arranged on the left side of the hot air drying machine. A conveying mechanism used for conveying PCBs is jointly arranged in the pickling machine, the clean water flushing machine, the cold air drying machine and the hot air drying machine, and the PCBs are conveyed and cleaned from right to left. Through cooperative use of the driving assembly, the reciprocating assembly and the rotating assembly, rotation of the rotating nozzles is synchronously achieved while the rotating nozzles are driven to do linear reciprocating motion; by means of the technical scheme, reciprocating linear spraying and rotary spraying are achieved, the washing coverage area is increased, compared with fixed spray head washing, dynamic washing reduces cleaning blind areas, shearing force to stains is increased through a complex water flow mode generated by rotation and reciprocating actions, pollutants can be stripped and taken away easily, and the cleaning effect is good.

The invention relates to a manufacturing method of a high-heat-dissipation circuit board. The manufacturing method comprises the following steps of manufacturing a first multi-layer board and a second multi-layer board; anti-etching photosensitive dry films are attached to the single faces of the first multilayer board and the second multilayer board; etching the exposed copper foil layers of the first multilayer board and the second multilayer board; semi-grooves are machined in the exposed film layers of the first multilayer board and the second multilayer board; the capillary copper pipe is subjected to blocking and browning treatment, and semi-cured resin coating is carried out; the first multi-layer plate and the second multi-layer plate are stacked, and the capillary copper pipe is horizontally arranged in the containing groove; riveting the first multi-layer plate and the second multi-layer plate which are pre-embedded with the capillary copper pipes by using a rivet through electromagnetic hot melting; laminating the riveted first and second multi-layer boards, the outer layer prepreg and the outer copper foil layer by using a vacuum laminating machine to form a semi-finished board; performing ultrasonic nondestructive testing on the semi-finished plate; and post-processing the semi-finished board to obtain the circuit board. According to the manufacturing method, the circuit board with the horizontally-embedded capillary copper pipe is obtained through the processes of film drying, single-face etching, groove milling and the like, and the heat dissipating capacity is increased.

The invention relates to a fixed connection method and device for a cable and a circuit board, and the method comprises the following steps: S1, carrying out the positioning of a wiring harness in the circuit board and the cable, and enabling the bonding wires of the wiring harness to be separated from each other; s2, performing visual inspection on the positioned wire harness and the circuit board, distinguishing a bonding wire and a bonding pad, and calibrating coordinate points of the bonding wire and the bonding pad; then, according to the calibrated coordinate points of the bonding wire and the bonding pad, the set welding movement track is compensated; s3, according to the compensated welding movement track, welding wires of the wire harness are sequentially moved to the corresponding welding disc positions for welding; s4, after welding is completed, glue dispensing is carried out on the wire harness and the circuit board in sequence, so that glue overflows between the wire harness and the circuit board; and S5, after dispensing is completed, the glue is subjected to curing treatment. According to the invention, the connection efficiency and quality of the cable and the circuit board can be improved, and the connection strength of the cable and the circuit board is high.

The invention belongs to the technical field of electronic manufacturing and printed circuit boards, and particularly relates to a lamination method and system of a multilayer flexible circuit board, which comprises the steps of providing a flexible substrate layer, forming a graphical photosensitive layer, arranging a binder layer, stacking a multilayer structure, performing exposure development and lamination treatment and the like. The system comprises a material supply unit, a graphical photosensitive layer forming unit, a lamination stacking unit, a graphical processing unit and a lamination unit, and full-process automation is realized through a central control unit. According to the invention, the positioning and alignment precision can be improved, the material compatibility is optimized, the process integration level is enhanced, and the lamination quality is improved, so that the production efficiency and the product yield of the multi-layer flexible circuit board are remarkably improved.

To increase the density of metal in the repaired area. [Solution] The repair device is a device for repairing defects 94 in a pattern 93 formed on the upper surface 91 of a substrate 9. The substrate holding part holds the substrate 9 on which the pattern 93 is formed on the upper surface 91. The application part 32 applies droplet-shaped conductive paste to the defects 94 in the pattern 93. The hardening part 33 hardens the conductive paste by heating and drying it. The compression part 34 presses the hardened conductive paste toward the substrate 9 while heating it. This makes it possible to increase the density of metal in the repair part provided to fill the defects 94.

The invention discloses an ultraviolet alkaline developing resin curing oven, and particularly relates to the technical field of resin curing, the ultraviolet alkaline developing resin curing oven comprises a bottom plate, the bottom plate extends upwards to form two vertical optical shafts, the two optical shafts are jointly and fixedly connected with a lower hemispherical shell, and the two optical shafts are jointly and slidably connected with an upper hemispherical shell matched with the lower hemispherical shell; a lifting assembly used for lifting the upper hemispherical shell is installed on the cross rod, an inner cavity formed by the upper hemispherical shell and the lower hemispherical shell is communicated with a first ventilation pipe and a second ventilation pipe, ultraviolet lamp beads are evenly distributed on the spherical wall of the inner cavity formed by the upper hemispherical shell and the lower hemispherical shell, and the first ventilation pipe is communicated with a switcher; the first ventilation pipe is communicated with the round pipe at one end of the switcher, the second ventilation pipe is communicated with the round pipe at one end of the switcher, the two ends of the switcher are in sliding connection with switching bases respectively, the two switching bases are jointly and fixedly connected with a temperature adjusting box, and the circuit board manufacturing method is suitable for manufacturing special circuit boards with complex curved surfaces or multiple surfaces.

The invention relates to the field of circuit boards, in particular to surface treatment equipment for PCB (printed circuit board) processing, which comprises a bottom plate, a soaking box and a driving assembly, the bottom plate is fixedly connected with a soaking box; the bottom plate is connected with a driving assembly used for driving the fixing frame and the parts on the fixing frame to move. The device further comprises a fixing frame and the like. The driving assembly is connected with a fixing frame; the fixed frame is fixedly connected with a plurality of electric push rods I; the telescopic ends of all the electric push rods I are jointly and fixedly connected with a connecting plate, and the connecting plate is slidably connected with the fixing frame. An electric push rod III is controlled to enable a rectangular plate to drive a connecting pipe and an absorption barrel to move towards one side close to a corresponding blind hole, the absorption barrel and corresponding absorption cotton are separated from each other until the absorption barrel enters the blind hole, redundant soaking liquid in the blind hole is absorbed and cleaned through the sponge on the surface of the absorption barrel, and the cleaning efficiency is improved. The problems that the thickness of a protective layer in the blind hole is relatively high and the draining efficiency is low due to the fact that residual soaking liquid in the blind hole cannot be thoroughly drained in the prior art are solved.

The invention belongs to the field of circuit board processing, and particularly relates to a circuit board and a processing method thereof, and the method comprises the following steps: transferring an image on a production film to a plate; electroplating a conductive layer on the exposed copper sheet of the circuit pattern of the board and the hole wall; removing an anti-electroplating covering film layer of the plate by using a cleaning solution to expose a non-circuit copper layer of the plate; the plate is installed in a machining device to be subjected to acid pickling, an exposed copper layer on the plate is removed through an acid pickling solution, and the residual acid pickling solution on the plate is removed while the plate is separated from the acid pickling solution; the board is immersed in water, the board is cleaned, residual water on the board is removed while the board is separated from the water, the board is dried, and the circuit board is obtained; according to the method, the residual pickling solution on the plate can be removed while the plate is separated from the pickling solution, and the pickling solution is prevented from dripping on other equipment.

The application relates to the technical field of circuit board processing, in particular to a surface treatment device for circuit board processing, which comprises a copper immersion tank, a walking structure, a control box, a lifting structure, a air-drying structure, a clamping structure, a hanging basket structure, an adjusting structure, a feeding structure, a conveying structure and a circuit board body; the lifting structure is used for lifting the hanging basket structure, meanwhile, the lifting of the lifting structure can adjust the air-sweeping range of the air-drying structure, the air-sweeping effect is improved, the air-drying process of the circuit board body is accelerated, the chemical solution in one copper immersion tank is prevented from entering another copper immersion tank, and the copper immersion effect is affected; the clamping structure can clamp the hanging basket structure and the circuit board body, and cooperates with the feeding structure to assist the feeding of the circuit board body, so that the feeding efficiency is improved; the position of the partition strip is adjusted through the adjusting structure, and the distance between the hanging basket top frame and the hanging basket bottom frame is adjusted at the same time, different sizes of circuit board bodies are conveniently loaded, and the applicability of the device is improved.

The application discloses an aluminum nitride film circuit substrate and a preparation method thereof, and relates to the technical field of aluminum nitride substrates.The application is characterized by the following steps: a titanium film is plated on the surface of an aluminum nitride ceramic substrate by magnetron sputtering, and then a copper film is plated on the surface of the titanium film by magnetron sputtering; and a nickel film is plated on the surface of the copper film by a chemical plating method to prepare the aluminum nitride film circuit substrate.Through the titanium-copper gradient dynamic transition technology, a gradient alloy layer is formed to reduce the interface stress; the titanium and the surface of the aluminum nitride are combined through a chemical bond to form a dense transition layer, thereby relieving the difference in the thermal expansion coefficient; the copper enhances the conductive performance of the surface of the aluminum nitride ceramic substrate; the titanium compensates for the interface defects of the mismatch between the copper and the aluminum nitride ceramic lattice; the chemical nickel plating enhances the hardness and corrosion resistance of the aluminum nitride ceramic substrate, and the aluminum nitride film substrate is endowed with weldability and bondability.

A thermal processing device is disclosed herein for thermally processing material on a substrate. The thermal processing device includes a support plate which at a first main side is provided with a layer stack having a free surface for supporting the substrate, wherein the free surface defines a reference plane and which layer stack includes a first resistive heating layer, a second resistive heating layer, and an electrical insulator layer between the first resistive heating layer and the second resistive heating layer. The resistive heating layer each comprise a respective plurality of mutually electrically insulated resistive heating strips that extend in a mutually different directions. Respective pairs of a resistive heating strip of the first plurality and a resistive heating strip of the second plurality overlap in respective areas.

The application belongs to the technical field of circuit board processing machines, and relates to an electroplating device for integrated circuit board processing, which comprises a groove body, a protective cover horizontally and slidingly installed in the groove body, a drilling assembly rotatably installed on the protective cover, and a first driving assembly installed between the protective cover and the drilling assembly; the groove body has a vertical second partition plate inside, the groove body between the second partition plate and the protective cover has a vertical first partition plate, the first partition plate is provided with a clearance hole matched with the drilling, the first partition plate and the second partition plate have a polishing assembly; the protective cover and the first partition plate are provided with a collecting hopper below; the sidewall of the groove body between the first partition plate and the protective cover is provided with an air hole; the groove body is provided with a U-shaped frame, the U-shaped frame is provided with a clamping assembly, the lower portion of the U-shaped frame is provided with a drying assembly, and the groove body is provided with an electroplating assembly at the end away from the protective cover; the electroplating device can clean the circuit board in time after polishing and improve the subsequent electroplating quality. The circuit board can be dried in time after electroplating, which facilitates subsequent assembly work.

A UV oven for curing an applied coating on a part, includes a housing having a top wall, a bottom wall, and side walls that enclose an interior volume of the housing. The UV oven further includes a first shutter and a second shutter located on the side walls and configured to be selectively opened to selectively allow the part to enter or exit the interior volume of the housing. The UV oven further includes a conveyor secured to the housing and having a surface on which the part may be supported and at least one UV lamp supported within the housing by a carriage that is movable with respect to the housing. A method of curing an applied coating on a part is further disclosed.

The invention provides a substrate processing technology and a production line, belongs to the technical field of substrate processing, and aims to solve the problem that in the prior art, in the substrate processing process, moisture absorption and cutting debris cleaning are incomplete after drying. Comprising the steps that S1, a substrate is dried, solder paste is printed on the dried substrate, an electronic element is attached to the substrate printed with the solder paste, and backflow curing is conducted on the substrate where the electronic element is attached; and the dried substrate is placed in a drying oven before being used. S2, performing optical inspection on the substrate subjected to backflow curing through optical inspection equipment; s3, cutting the substrate which is qualified in the optical inspection, and carrying out manual insertion element welding on the cut substrate; before the substrate is cut, chips on the surface of the substrate are cleaned. And S4, performing performance inspection on the substrate after welding is completed, performing potting on the substrate with qualified performance inspection by adopting a potting material, inspecting the product after potting, and finally warehousing the qualified product after inspection.

The invention discloses integrated circuit board production, processing and cleaning equipment and a use method thereof.The equipment comprises a mounting frame, inner barrels, a cover plate, an outer rotating sleeve, a box and a fan, a placement frame is arranged below the cover, cleaning liquid in the box is pumped into the inner barrel on the left side through a water pump, hot air is conveyed into the inner barrel on the right side through the fan, and the inner barrel is arranged in the placement frame; the method comprises the steps of feeding, cleaning, position changing, continuous cleaning and the like, and has the beneficial effects that a circuit board to be cleaned is placed in an inner barrel on the left side through a placement frame, and the cleaned circuit board is placed in an inner barrel on the right side through the placement frame; cleaning liquid in the box body is pumped into the inner barrel on the left side through the water pump to clean the circuit board, hot air is conveyed into the inner barrel on the right side through the draught fan to dry the circuit board, cleaning and drying operation of the circuit board can be achieved at the same time, and the cleaning effect is improved; and a plurality of circuit boards can be cleaned and dried at the same time, so that the efficiency is improved.

The application relates to the field of circuit boards, in particular to surface treatment equipment for PCB (Printed Circuit Board) processing, which comprises a bottom plate, a soaking box and a driving assembly; the soaking box is fixedly connected to the bottom plate; the bottom plate is connected with the driving assembly used for driving the movement of a fixing frame and parts thereon; the surface treatment equipment further comprises the fixing frame and the like; the driving assembly is connected with the fixing frame; a plurality of electric push rods I are fixedly connected to the fixing frame; the extension ends of all the electric push rods I are collectively fixedly connected with a connecting plate, and the connecting plate is slidingly connected with the fixing frame. The rectangular plate drives the connecting pipe and the absorption cylinder to move to the side close to the corresponding blind hole by controlling the electric push rod III, the absorption cylinder and the corresponding absorption cotton are separated from each other, until the absorption cylinder enters the blind hole, the sponge on the surface of the absorption cylinder absorbs and cleans the excess soaking liquid in the blind hole, and the problem that the soaking liquid remaining in the blind hole cannot be completely drained in the prior art, the thickness of the protective layer in the blind hole is relatively higher, and the draining efficiency is low is avoided.

The invention relates to a method for producing electrical or electronic components or circuits on a flexible, flat or three-dimensional substrate via the application of a liquid or paste-like starting material for a structured or unstructured electrical or electronic functional layer, and subsequent drying, sintering and / or curing of the starting material on the substrate, wherein the step of drying, sintering and / or curing involves a short surface-application of the coated substrate with radiation in the near-infrared range, with an amplitude maximum in a wavelength range between 800 and 1500 nm and with a power density on the surface of the substrate between 50 kW / m 2 and 1000 kW / m 2.

The invention discloses a dispensing process for an electronic circuit board, and relates to the field of printed circuits, the dispensing process comprises the following steps: S1, keeping glue at a constant temperature of 25-27 DEG C, and performing low-temperature pre-curing treatment; s2, positioning dispensing points are dotted on the processed glue at the four corners of the target filling area of the electronic circuit board respectively, and a main body stranded wire is dotted along the edge of an element in a continuous linear shape; s3, standing the dispensed electronic circuit board at the temperature of 30-35 DEG C, and carrying out post-treatment; and S4, carrying out gradient curing on the post-processed electronic circuit board in two stages to finish dispensing of the electronic circuit board. According to the dispensing process, the problems that the bonding pad is polluted by out-of-control capillary force of HDI plate dispensing and stress concentration is caused by micro holes are effectively solved, then the extremely low pollution rate of 0.5% and the low void rate of 3.1% of the bonding pad are achieved, the mechanical shock resistance and moisture-proof sealing reliability of a welding spot can be remarkably improved, and therefore the reliability and the manufacturing yield of an HDI plate are improved.

The invention relates to the technical field of PCB processing, in particular to a baking oven and a baking method for a PCB. According to the technical scheme, the PCB machining device comprises a machining table, a conveying belt is installed at the top end of the machining table, partition plates can be moved upwards through a control assembly, PCBs can enter a preheating area, the PCBs between the two sets of partition plates can be heated through a heating plate in the preheating area, after the PCBs are preheated, the PCBs can enter a drying area through the cooperation of the conveying belt and a control structure, and therefore the PCBs can be dried. The PCBs are dried through the heating plates and the air pipes in the drying area, then the control assembly is matched with the conveying belt to convey a set of PCBs to the slow cooling area, the temperature in the area is controlled through the set of heating plates and the air pipes in the slow cooling area, the temperature of the cold exchange area is gradually decreased from high to low, the PCBs can be prevented from being cooled too fast, and the service life of the PCBs is prolonged. The problem that the PCB is affected by the large temperature gradient of the baking processing chamber is solved.

The application belongs to the technical field of electronic manufacturing and printed circuit board, and particularly relates to a laminating method and system for a multilayer flexible circuit board, which comprises the following steps: providing a flexible substrate layer, forming a patterned photosensitive layer, arranging an adhesive layer, stacking a multilayer structure, performing exposure and development, and laminating, etc. The system comprises a material supply unit, a patterned photosensitive layer forming unit, a laminated stacking unit, a patterned processing unit and a laminating unit, and realizes full-process automation through a central control unit. The application can improve positioning and alignment accuracy, optimize material compatibility, enhance process integration, improve laminating quality, and thus significantly improve the production efficiency and product yield of the multilayer flexible circuit board.

The invention relates to the field of PCB processing, in particular to a PCB embedded deep groove processing device and process based on laser and chemical corrosion.The PCB embedded deep groove processing device comprises a base and a clamping base clamping a circuit board, the clamping base turns over along one side of the base, and an air drying base and a corrosion assembly are arranged on the periphery of the clamping base; the outer side of the base is connected with an annular rail which is in sliding connection with the clamping seat, the clamping seat can slide to the position above the air drying seat and the cleaning assembly through the annular rail after being turned over, chemical corrosion is added into the process of the scheme, rough machining is conducted through drilling firstly, then more accurate finish machining is conducted in a chemical etching mode, and on the basis, the machining efficiency is improved. According to the technical scheme, rapid switching is carried out in all pools in an annular track mode, the switching time of PCBs in all environments is shortened, the circuit board on the surface of the clamping base is placed downwards through the overturning structural design, and therefore when cleaning is carried out among the developing base, the washing base and the etching base, the circuit board faces downwards, and chemical residues can be avoided.

To provide a system and method for applying a coating to a substrate.SOLUTION: A coating system includes: a coating station 24 for applying a coating material to the substrate, where the coating station has a bottom portion; an oven 34 for curing the coating material on the substrate, where the oven is positioned vertically below the bottom portion; and a first lift 28 for transporting the substrate from the coating station to the oven. The system can also include an inspection station 54 for inspecting the substrate. Each of the separate elements of the coating system, including the coating station, first lift, oven, and inspection station can define self-contained modules.SELECTED DRAWING: Figure 4