The invention discloses an integrated heat dissipation module of a
computer case, and relates to the technical field of heat dissipation of computer cases. The device specifically comprises a mounting plate fixed to an inner cavity of a case, a swing mechanism is arranged at the top of the mounting plate, an adsorption
assembly is clamped to the end of the swing mechanism, a heat dissipation
assembly is arranged at the top of the swing mechanism, a heat conduction coil
pipe is wound around the inside and the outside of the heat dissipation
assembly, and fixing screws are arranged at the four corners of the top of the mounting plate. The heat dissipation assembly comprises fixing frames, heat insulation plates, side frames, W-shaped
copper pipes, a top frame and inserting grooves, the two fixing frames are connected to the inner wall of the case through bolts, the inserting grooves are formed in the four corners of the opposite sides of the two fixing frames, the W-shaped
copper pipes are inserted into the inserting grooves, and the side frames are sequentially welded to the outer surfaces of the W-shaped
copper pipes at equal intervals. The problem that the heat dissipation effect becomes poor due to the fact that the heat dissipation space of a heat dissipation module in a traditional case is compressed is solved, the heat conduction area is increased, the heat dissipation efficiency is improved, and the problem that the local temperature is high due to heat gathering is solved.