50 results about "Desoldering" patented technology

The invention discloses a semiconductor package and a manufacturing method thereof, the semiconductor package comprises an EM I shielding layer, and the semiconductor package has the beneficial effects that a stable supporting structure is provided for a welding wire by arranging a connecting bump and a conductive copper rod between the EM I shielding layer and a supporting mold, and the design effectively prevents the welding wire from shifting or unsoldering in the packaging process, so that the reliability of the packaging process is improved. The packaging yield and reliability are remarkably improved, the mechanical connection is enhanced by using the conductive copper rod and the conductive bump, and the good electrical connection is ensured, so that the stability and the performance of the whole circuit are improved; through the design that the sealing filling groove and the sealing groove are introduced into the packaging structure, the sealing space formed through injection molding effectively prevents external moisture, dust and other harmful substances from invading, the supporting bottom frame is tightly matched with the outer sealing frame and the sealing bottom frame, and the sealing material is filled to jointly form an efficient sealing system. And all-around protection is provided for circuits and elements in the package.

The utility model relates to the technical field of tubular motor electronic device desoldering, and aims to solve the problem that a motor pin is easy to damage when a tubular motor and a circuit board are desoldered. Efficient desoldering equipment for a motor and a circuit board comprises a base, a product fixing table, a welding gun and a tin sucking piece used for sucking soldering tin, the product fixing table is fixedly installed on the base, and the efficient desoldering equipment further comprises a middle connecting base slidably connected to the base and an installation piece slidably connected to the middle connecting base; the mounting part comprises a bracket for mounting the tin sucking part and a height adjusting frame for mounting the welding gun; the height adjusting frame is used for adjusting and fixing the position of the welding end of the welding gun in the height direction; the middle connecting base moves left and right relative to the product fixing table, and the mounting piece moves front and back relative to the product fixing table. The mounting and fixing positions of the welding gun and the product are adjusted and fixed in advance, a subsequent worker only needs to take and place the product, the positions of the product and the welding gun do not need to be adjusted in the desoldering process, and motor pins are prevented from being damaged by manual actions in the desoldering process.

The invention discloses a BMS test device, and relates to the BMS test field, the BMS test device comprises a test platform, the test platform is provided with a carrying platform and a plugging connection device, the plugging connection device comprises a profiling plug, a plugging mechanism and a driving mechanism, the driving mechanism is used for driving the plugging mechanism to move along the plugging direction, the plugging mechanism comprises a fixed end and a free end, and the fixed end is provided with a clamping groove. The fixed end is connected with the driving mechanism, the fixed end and the free end are connected through the elastic piece, the free end is connected with the profiling plug, and the fixed end and the free end are connected through the arranged plugging connecting device and the elastic piece, so that the profiling plug has the capabilities of axial movement, radial translation and multidirectional torsion; the elastic piece can dynamically absorb position deviation of the BMS socket, rigid extrusion of the profiling plug and the socket is avoided, the risks of socket metal contact deformation, coating scratching and PCB welding spot unsoldering are remarkably reduced, the yield of BMS products after testing is improved, and meanwhile the service life of the profiling plug is prolonged.

The utility model relates to a desoldering and repairing table, which belongs to the field of desoldering and repairing and comprises a table frame, a desoldering mechanism for desoldering a circuit board at a fixed point and cleaning soldering tin in time is arranged on the upper surface of the table frame, and a conveying mechanism for automatically feeding and discharging is arranged on the upper surface of the table frame. The desoldering mechanism comprises a supporting frame, a linear module, an air cylinder, a connecting plate, a collecting nozzle, a tin sucking pump, a material sucking pipe, a feeding pipe and a collecting box. According to the desoldering repair table, the desoldering mechanism and the linear module are arranged and used for accurately moving the air cylinder and the connecting plate so that accurate positioning of circuit board welding spots can be achieved, heating of the circuit board welding spots is achieved through the heating piece, and generated hot air is directly blown to a specific area of a circuit board through the air supply pipe and the air outlet nozzle; the tin sucking pump is matched with the material sucking pipe and the collecting nozzle to suck molten soldering tin and convey the sucked soldering tin to the collecting box, and the visual positioning sensor is installed on the lower surface of the connecting plate and used for accurately recognizing the position of a welding spot on the circuit board so as to improve the accuracy of desoldering.

The present invention belongs to the field of high-voltage power supply, and specifically relates to a miniature voltage-doubler integrated module and a manufacturing method thereof, comprising a plurality of component platforms arranged at intervals, wherein the insides of the component platforms are respectively provided with diode slots and capacitor slots, and a through pole slot is provided between the diode slots and the capacitor slots; the voltage-doubler module is designed in a modular manner, wherein the capacitor and the high-voltage diode are welded and then welded to a circuit board after being arranged in a specific manner, and the independent component platforms only need four welding points to be connected to a PCB board after being integrated, so that the independent component platforms have miniaturization, integration, and product consistency, so as to facilitate standardized production, i.e., surface mounting; the component platforms of the miniature voltage-doubler integrated module are independently arranged, and except for the component platforms at the input and output ends, the components are not directly connected to the PCB board, so that when a fault occurs, the fault point can be specially repaired, which can solve the problem that traditional repairs require repeated desoldering, soldering and other processes, thereby improving the convenience of maintenance.

The present invention relates to the field of optoelectronic glass technology, and in particular to a non-destructive repair method and repair equipment for optoelectronic glass, including: non-contact repair of the optoelectronic glass to be repaired through electric field radiation. The present invention emits electric field radiation to the outside through a radiation head, and aims the radiation head at the damaged point of the optoelectronic glass. The damaged point is heated in the electric field radiation, and its internal desoldering point will melt and be welded again, so as to achieve the purpose of repair; because the electric field radiation only acts on metal materials and has no effect on non-metallic materials, it can achieve non-destructive repair of the damaged point of the optoelectronic glass, effectively solving the problem that the existing optoelectronic glass products cannot be repaired because the lamp beads and circuits are placed between the laminated glass, and can achieve that there is no need to replace the glass or disassemble the glass, and the overall appearance will not be affected after the repair, saving the customer's maintenance cost and construction cost, and improving the quality assurance of the product.

The utility model discloses a capacitor with a protection mechanism, comprising a capacitor body; an outer protection cover, wherein the outer protection cover is arranged on the outside of the capacitor body. The utility model has the following beneficial effects: by arranging a positioning base plate and a grounding wire connecting foot, the grounding wire connecting foot at the bottom of the positioning base plate is fixed to the surface of a circuit board and electrically connected to the grounding wire of the circuit board, the positions of the outer protection cover and the capacitor body are stabilized and grounded at the same time, so as to prevent the capacitor body from moving and causing the pin to be desoldered and broken; by arranging a ventilating port and an inner annular ventilating groove, the ventilating and heat dissipating treatment of the capacitor body when it is in the outer protection cover is achieved through the cooperation between the ventilating port and the inner annular ventilating groove; by arranging a rubber protection side block, the rubber protection side block is protected against collision; when the rubber protection side block moves, the limiting slide plate is driven to move to press the reset spring on one side, so as to reduce the collision and prevent the desoldering.

The invention relates to a chip solder mask solution method and device based on an SC PUF circuit, and belongs to the technical field of hardware security, and the method comprises the steps: determining the first equivalent capacitance of a sub-capacitor array based on a plurality of sub-capacitor arrays in the constructed SC PUF circuit; mismatch of a second equivalent capacitance of a parasitic capacitance of a welding spot outside the chip is compensated through a capacitance compensation array, and the compensated second equivalent capacitance is determined; based on the first equivalent capacitance and the compensated second equivalent capacitance, the node voltage difference is utilized to drive the LSSA to generate a secret key; according to the chip solder mask solution method based on the SC PUF circuit provided by the invention, a larger excitation-response pair space can be realized, the information entropy is remarkably improved, the PUF key and the PCB hardware environment are tightly bound through the Chip-PCB hybrid design, disassembly, counterfeit and hardware replacement attacks are effectively prevented, the safety is improved, and the relatively high cost controllability is also ensured.

The invention discloses an air knife detinning device for a circuit integrated mainboard, which is characterized in that a bearing seat rotatably provided with a rolling shaft is arranged on one side, far away from mainboard adding equipment, of a feeding groove, a plurality of first connecting frames are mounted on the circumferential outer wall of the rolling shaft at intervals, and a supporting seat matched with the feeding groove is rotatably mounted in each first connecting frame; a torsion elastic piece is arranged between the supporting seat and the first connecting frame; a third connecting frame is arranged on the inner wall of the supporting shell and is parallel to the first air knife ejector, the third connecting frame is fixedly connected with a contact plate matched with the supporting seat, a clamping plate is symmetrically arranged in the supporting seat, a bottom plate is arranged below the supporting seat, and the clamping plate and the bottom plate are fixedly connected through a limiting insertion rod; and a driving mechanism is arranged between the bottom plate and the supporting seat. On the basis of realizing rotary feeding of the main board, an air knife is parallel to the main board for tin removal, clamping and fixing of the main board are also realized, and the tin removal effect of the air knife is improved.

The utility model relates to the field of electronics, and discloses an electric solder sucker which comprises a solder sucking table, a solder sucking handle and a switch, the solder sucking handle is provided with an upper cover and a base, one side of the upper cover is provided with a first upper cover, the other side of the upper cover is provided with a second upper cover, the other side of the upper cover is provided with a second upper cover, and the center of the top of the first upper cover is provided with a rear clamping groove. A front clamping groove is formed in the upper portion of the top face of the second upper cover. A first base is arranged on one side of the base, a fixing piece is arranged on one side of the first mounting piece, a rear clamping hook is arranged on one side of the fixing piece, a second base is arranged on the other side of the base, and a front clamping hook is arranged on the upper portion of the inner surface of the second base. The problems that in the prior art, a solder wick handle is complex in structure and inconvenient to disassemble and maintain are effectively solved, then portable disassembly of the upper cover of the solder wick handle is achieved, the efficiency of disassembling and maintaining the solder wick handle by a user is improved, and regular maintenance of the solder wick handle by the user is facilitated.

The utility model belongs to the related technical field of circuit board detinning, and particularly relates to a drum-type circuit board detinning device. The drum-type circuit board detinning device comprises a rotary drum body, a feeding part and a heating part, the rotary drum body sequentially comprises a temperature rise section used for heating a circuit board to raise the temperature of the circuit board, a separation section used for tin soldering and element discharging and a tailing section used for substrate discharging, and shoveling plates are arranged on the inner walls of the temperature rise section and the separation section; the wall face of the separation section is provided with a hole channel for soldering tin and elements to pass through, and a first discharging opening is formed in the lower portion of the separation section. And the tailing section is communicated with a second discharge port. According to the utility model, the circuit board is temporarily clamped by the shoveling plate of the temperature rise section, so that the distribution uniformity of the circuit board in the rotary drum body is improved, the circuit board is stirred by the shoveling plate of the separation section, and the heating uniformity of the circuit board in the rotary drum can be improved and the separation efficiency between soldering tin and a substrate is also improved in cooperation with a mode of simultaneously heating inside and outside.

The invention provides a novel circuit board green disassembling method, and belongs to the technical field of electronic waste disposal, the novel circuit board green disassembling method comprises the steps of circuit board pretreatment, information recording and electrostatic dust collection; preheating at low temperature, controlling the heating rate and ventilating; nondestructive desoldering is carried out, and infrared heating is matched with ultrasonic vibration; components are classified and recycled, and proper clamps are used; substrate material separation and biological enzyme treatment; metal refining and organic material recovery; according to the method, various innovative technologies and processes are adopted, parameters are accurately controlled, and special equipment tools such as an electrostatic dust collection device, preheating equipment, an infrared heating device, a biological enzyme treatment system and an adaptive clamp are used; the problems that according to a traditional disassembling method, environmental pollution is serious, the resource recovery rate is low, and damage to circuit boards and components is large are solved, green and efficient disassembling is achieved, the resource recovery rate is increased, and the integrity of the circuit boards and the components is protected.

1. The name of the product of this design: Hot air gun host (HG‑01). 2. Purpose of the product of this design: a tool for removing and soldering components on circuit boards. 3. The design key point of this appearance design product lies in the combination of shape and pattern. 4. The picture or photo that best illustrates the design points: three-dimensional picture.

The utility model discloses novel hot air, infrared and laser integrated repair equipment which comprises a first mounting box, and a lower preheating mechanism and a lower heating mechanism are mounted in the first mounting box. The top of the first mounting box is further connected with a carrier in a sliding mode. The repair device comprises a first X-axis translation mechanism, a first Y-axis translation mechanism and a galvanometer laser heater which are connected with the first X-axis translation mechanism, a first translation frame connected with the first Y-axis translation mechanism, and a desoldering mounting mechanism mounted on the first translation frame; and an upper visual mechanism and a tin removing mechanism are further mounted on the first translation frame. According to the utility model, a series of procedures such as automatic desoldering, tin removal, mounting, welding and curing of the BGA chip can be realized, the automation degree is high, the working efficiency is high, three heating modes of hot air heating, infrared heating and laser heating are arranged, a user can freely select according to actual use requirements, and the universality is strong.

The invention discloses an integrating sphere-based chip test method and an optical test system, and the method comprises the steps: providing an integrating sphere, a first probe and a second probe, the integrating sphere comprises an upper housing and a lower housing which are detachably connected, the upper housing is provided with a first through hole, and the lower housing is provided with a second through hole and a third through hole; the first probe and the second probe respectively extend into the lower shell through the second through hole and the third through hole; placing a to-be-tested unpackaged chip on a bearing table in the lower shell, and enabling a light-emitting surface of the chip to deviate from the bearing table; coupling a first probe to a first bonding pad of the unpackaged chip to be tested and applying a first electric signal, coupling a second probe to a second bonding pad of the unpackaged chip to be tested and applying a second electric signal, and lightening the unpackaged chip to be tested; covering the upper shell on the lower shell; and installing an optical detector in the first through hole, and testing light emitted by the to-be-tested unpackaged chip by using the optical detector. According to the method, the steps of wire bonding, desoldering and the like on the unpackaged chip are not needed, and the chip test loss rate is reduced.

The application discloses a kind of movable heating circuit board repair methods, the repair method includes S1: data acquisition, S2: inductive heating desoldering, and S3: new component re-soldering etc.Step, compared with prior art, movable heating circuit board repair method provided by the application has processing flexible, repair efficiency is high, repair success rate is high, processing coverage is wide, adaptability is strong, heat is sufficient, heat source controllability is strong, can adapt to the desoldering or welding requirement of element of wide size range, can reach the expected heating effect well, positioning is accurate, work stable and other beneficial effects.

The present invention discloses a BMS testing device, which relates to the field of BMS testing. The test platform comprises a test platform, a carrier and a plug-in connection device are installed on the test platform, the plug-in connection device comprises a contour plug, a plug-in mechanism and a driving mechanism, the driving mechanism is used to drive the plug-in mechanism to move along the plug-in direction, the plug-in mechanism comprises a fixed end and a free end, the fixed end is connected to the driving mechanism, the fixed end and the free end are connected by an elastic member, the free end is connected to the contour plug, and the elastic member connects the fixed end and the free end through the provided plug-in connection device, so that the contour plug has axial movement, radial translation and multi-directional torsion capabilities, during the insertion process, the elastic member can dynamically absorb the position deviation of the BMS socket, avoid hard squeezing of the contour plug and the socket, significantly reduce the risks of deformation of the metal contact of the socket, scratching of the coating and desoldering of the PCB solder joints, improve the yield of the BMS product after the test, and extend the service life of the contour plug.

The invention relates to the technical field of LED packaging, and discloses an LED device and an LED lamp panel. The LED device comprises a substrate, an LED chip, a light-transmitting separator and packaging glue, the LED chip is inversely arranged on the substrate, the light-transmitting separator is arranged on the outer side of the LED chip, and the packaging glue covers the outer side of the light-transmitting separator, so that the LED chip is isolated from the packaging glue. According to the LED device provided by the invention, the inverted LED chip and the packaging adhesive are completely isolated by arranging the light-transmitting isolation piece, so that the solder paste at the welding part of the inverted LED chip is prevented from being pulled by the thermal expansion force generated by the packaging adhesive during secondary melting at a high temperature; solder paste at the welding position of an inverted LED chip under high-temperature backflow can be smoothly melted back to be connected with a bonding pad, the phenomenon that a lamp is dead due to insufficient soldering or unsoldering of the chip is avoided, and finally the high reliability of the LED device and lamp drive integrated display module is achieved.

This utility model relates to the field of separation and recycling devices, and in particular to a low-temperature desoldering device for waste circuit boards, comprising: a support frame, a furnace body, a centrifugal desoldering component, a drive component, and a heating component; the furnace body is rotatably mounted on the support frame; a feed inlet is provided on one side of the furnace body, and a furnace door is provided on one side of the feed inlet; the centrifugal desoldering component is rotatably mounted in the furnace body for centrifugally ejecting molten tin; the drive component drives the centrifugal desoldering component to rotate; the heating component is used to change the temperature inside the furnace body. This utility model achieves rapid loading and unloading through the structure of the furnace body being horizontally mounted on the support frame, and the support frame allows the furnace body to tilt, allowing the processed tin inside the furnace body to be discharged through the tin discharge port. Furthermore, the entire working process is at a low temperature and includes a tail gas treatment device, making the desoldering process more convenient and faster, greatly improving work efficiency and reducing environmental pollution, which is in line with the concept of sustainable development.

The embodiment of the utility model provides a chip packaging structure, and relates to the technical field of chip packaging, the chip packaging structure comprises a substrate, a chip, a heat radiation cover and a plastic packaging body, the substrate is provided with a first grounding pad and a second grounding pad; the chip is mounted on the substrate; the heat dissipation cover is arranged on the substrate and attached to the back face of the chip. The plastic package body is arranged on the substrate and wraps the heat dissipation cover. Wherein the edge of the heat dissipation cover is provided with a pin bending part, the pin bending part is bent towards the direction far away from the substrate from the edge of the heat dissipation cover, the space between the pin bending part and the substrate is filled with the plastic package body, the edge of the heat dissipation cover is connected to the first grounding bonding pad, and the pin bending part is electrically connected to the second grounding bonding pad. Compared with the prior art, the electric connection performance between the heat dissipation cover and the substrate can be improved, the electrostatic discharge performance and the electrostatic shielding effect of the packaging structure are ensured, meanwhile, the welding combination stability is improved, the structure is stable, and desoldering is not prone to occurring.

The present invention provides a method and device for controlling a converter with variable carrier, which determine the maximum temperature rise of a device module that can be turned off under multiple carrier frequencies and different output currents; determine the design temperature rise of the device module that can be turned off under different output currents; determine the converter carrier frequency under the current heat sink temperature and the current output current based on the maximum temperature rise and the design temperature rise, and control the converter by variable carrier, taking into account the influence of the heat sink temperature of the device that can be turned off, and can avoid the phenomena of bonding wire desoldering and solder layer fatigue cracking in the device module that can be turned off as much as possible, reduce harmonic pollution when the converter is lightly loaded, and reduce the loss when the converter is heavily loaded; achieve approximately constant junction temperature of the device module that can be turned off under different output capacities, greatly reduce the number of power cycles and temperature cycles of the device module that can be turned off, and significantly extend the service life of the device module that can be turned off.

The utility model relates to the technical field of atomizers, and discloses an atomizing device, which is used for atomizing to generate aerosol and comprises a shell component, a first cavity and a ventilation channel, and the ventilation channel is configured to allow external air to flow through the interior of the shell component; the circuit board is arranged in the first cavity; the airflow sensor is accommodated in the first chamber and is directly welded on the circuit board; the sealing part is matched with the circuit board to form a containing space, the airflow sensor is located in the containing space, a starting vent hole is formed in the sealing part, and the airflow sensor is in airflow sensing communication with the ventilation channel through the starting vent hole. The air flow sensor structure at least can reduce pseudo soldering of a circuit board and an air flow sensor, is less in desoldering, enables circuit conduction to be more stable and reliable, improves yield, and reduces cost. The airflow sensor is in airflow sensing communication with the ventilation channel through the starting ventilation hole, the sensitivity of the airflow sensor is improved, and the phenomenon that the atomization device is not started is reduced.

1. Name of the Design Product: Soldering Iron Main Unit. 2. Use of the Design Product: For the desoldering and soldering work of electronic components. 3. Design Key Points of the Design Product: Lies in the shape. 4. Picture or Photograph that Best Illustrates the Design Key Points: Perspective View.

The utility model provides a semiconductor device detinning device which comprises a heating unit, a detinning unit, a cooling unit and a filter screen, when the semiconductor device detinning device works, the heating unit heats the detinning unit to enable the temperature of the detinning unit to enable soldering tin to be melted, and a semiconductor device to be detinned is placed on the detinning unit. And the tin removing unit falls into the first hole body of the heating unit through the drainage hole after being heated and melted, and then falls into the second hole body below through the first hole body. And after entering the second hole body, the soldering tin is cooled and solidified into a solid which is blocked by the filter screen. The heating unit, the detinning unit, the cooling unit and the filter screen act together, soldering tin on the pins of the semiconductor device can be effectively removed, the soldering tin is removed in a high-temperature melting mode, the detinning effect is good, and the detinning efficiency is high. And the cooling unit and the filter screen are arranged below the heating unit, so that the removed soldering tin can be collected, and double benefits are achieved.

1. Name of the product in this design: Single-station intelligent welding station. 2. Purpose of this design: An electronic welding equipment, mainly used for welding, desoldering and rework of electronic components and printed circuit boards. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The utility model discloses a PCBA board bearing and desoldering device which comprises a soldering station body, a desoldering groove is formed in the right side of the upper end of the soldering station body, an overturning table is installed at the upper end of the desoldering groove, a vibration table is fixed to the upper end of the overturning table, a desoldering bearing table is arranged at the upper end of the vibration table, and a storage net is arranged in the desoldering groove. The storage net is located under the vibration table, an image collector is arranged on the inner wall of the desoldering groove, and a movable hot air gun is installed at the bottom of the desoldering groove. By means of the overturning table, the vibrating table and the movable hot air gun, electronic elements needing to be disassembled can be automatically heated and then separated through high-frequency vibration, other surrounding elements cannot be damaged, and disassembling efficiency is high.

The invention relates to the technical field of inductors, in particular to an inductor with a replaceable electrode slice, which solves the problem existing in the prior art that an electrode slice on the inductor is connected with a free terminal in a welding mode, and comprises a packaging block, a coil is arranged in the packaging block, and the two ends of the coil are connected with connecting columns. The packaging structure is characterized in that two threaded grooves are formed in the top of the packaging block, and the two connecting columns are arranged in the two threaded grooves respectively; a communicating groove is formed between the threaded groove and the outer wall of the packaging block, electrode plates are arranged on the two sides of the packaging block, and contact claws which are inserted along the communicating groove and attached to the connecting columns are fixedly connected to the electrode plates. When the electrode plate is damaged and aged or needs to be replaced with different specifications to adapt to different circuit requirements, the old electrode plate can be easily taken down and replaced with a new electrode plate only by operating according to corresponding disassembly steps, complicated desoldering and re-welding processes are not needed, and the maintenance difficulty and cost are greatly reduced.

The invention discloses a chip problem positioning method and device, equipment, a storage medium and a product. The method comprises the steps that a JTAG debugger is controlled to send a first preset instruction to a JTAG interface of a PCB where a to-be-tested chip is located so as to conduct a target test scan chain related to a suspected fault module in the to-be-tested chip; under the condition that the target test scan chain is conducted, the JTAG debugger is controlled to send a second preset instruction to a JTAG interface of a PCB where the to-be-tested chip is located, so that a preset controller in the to-be-tested chip is triggered to conduct self-testing on the suspected fault module, and a self-testing result is fed back to the JTAG debugger through the JTAG interface; and receiving a self-test result forwarded by the JTAG debugger, and carrying out fault positioning on the suspected fault module according to the self-test result. According to the invention, the fault module in the chip can be directly positioned on the printed circuit board, the chip does not need to be desoldered, and the positioning efficiency of the chip fault in the application field is greatly improved.

The invention discloses a lossless desoldering method for an LCC packaging optical module, and solves the problems of high desoldering difficulty and excessive dependence on the skill level of an operator caused by the problems of high dimensional precision requirement, more desoldering time limitation, large influence of inconsistency of welding spots and the like of a desoldering device in the prior art. The basic implementation principle of the invention is as follows: 1, pre-cleaning an LCC packaging optical module to be desoldered; 2, the cleaned exposed welding spots are coated with heat conduction cement gum, so that the heat conduction cement gum is tightly attached to the exposed welding spots; 3, an unwelding tool is obtained, the unwelding tool comprises a heating frame, heating holes located in the peripheral side of the heating frame and temperature control soldering iron matched with the heating holes in size, the shape of the heating frame is matched with the shape of the LCC packaging optical module, the heating frame is arranged on the periphery of the heat conduction cement, and the heating frame is tightly attached to the heat conduction cement; 4, a temperature control soldering iron is placed in the heating hole, and soldering tin is heated; 5, heating until the solder is molten, and clamping the LCC packaging optical module; and 6, the heat-conducting cement gum is cleaned, and lossless desoldering is completed.

The present invention discloses a semiconductor package and a manufacturing method thereof, including an EMI shielding layer. The beneficial effects of the present invention are as follows: By providing connecting bumps and conductive copper bars between the EMI shielding layer and the support mold, a stable support structure is provided for the welding wires. This design effectively prevents the offset or desoldering of the welding wires during the packaging process, significantly improving the yield and reliability of the package. The use of conductive copper bars and conductive bumps not only enhances the mechanical connection but also ensures good electrical connection, thereby improving the stability and performance of the overall circuit. By introducing the design of a sealing filling groove and a closed groove in the packaging structure, the sealing space formed by injection molding effectively prevents the intrusion of harmful substances such as external moisture and dust. The tight fit of the support bottom frame with the outer closed frame and the closed bottom frame, as well as the filling of the sealing material, together constitute an efficient sealing system, providing comprehensive protection for the circuits and components inside the package.