36 results about "Desoldering" patented technology

The utility model relates to the technical field of tubular motor electronic device desoldering, and aims to solve the problem that a motor pin is easy to damage when a tubular motor and a circuit board are desoldered. Efficient desoldering equipment for a motor and a circuit board comprises a base, a product fixing table, a welding gun and a tin sucking piece used for sucking soldering tin, the product fixing table is fixedly installed on the base, and the efficient desoldering equipment further comprises a middle connecting base slidably connected to the base and an installation piece slidably connected to the middle connecting base; the mounting part comprises a bracket for mounting the tin sucking part and a height adjusting frame for mounting the welding gun; the height adjusting frame is used for adjusting and fixing the position of the welding end of the welding gun in the height direction; the middle connecting base moves left and right relative to the product fixing table, and the mounting piece moves front and back relative to the product fixing table. The mounting and fixing positions of the welding gun and the product are adjusted and fixed in advance, a subsequent worker only needs to take and place the product, the positions of the product and the welding gun do not need to be adjusted in the desoldering process, and motor pins are prevented from being damaged by manual actions in the desoldering process.

The invention discloses a BMS test device, and relates to the BMS test field, the BMS test device comprises a test platform, the test platform is provided with a carrying platform and a plugging connection device, the plugging connection device comprises a profiling plug, a plugging mechanism and a driving mechanism, the driving mechanism is used for driving the plugging mechanism to move along the plugging direction, the plugging mechanism comprises a fixed end and a free end, and the fixed end is provided with a clamping groove. The fixed end is connected with the driving mechanism, the fixed end and the free end are connected through the elastic piece, the free end is connected with the profiling plug, and the fixed end and the free end are connected through the arranged plugging connecting device and the elastic piece, so that the profiling plug has the capabilities of axial movement, radial translation and multidirectional torsion; the elastic piece can dynamically absorb position deviation of the BMS socket, rigid extrusion of the profiling plug and the socket is avoided, the risks of socket metal contact deformation, coating scratching and PCB welding spot unsoldering are remarkably reduced, the yield of BMS products after testing is improved, and meanwhile the service life of the profiling plug is prolonged.

The invention relates to a chip solder mask solution method and device based on an SC PUF circuit, and belongs to the technical field of hardware security, and the method comprises the steps: determining the first equivalent capacitance of a sub-capacitor array based on a plurality of sub-capacitor arrays in the constructed SC PUF circuit; mismatch of a second equivalent capacitance of a parasitic capacitance of a welding spot outside the chip is compensated through a capacitance compensation array, and the compensated second equivalent capacitance is determined; based on the first equivalent capacitance and the compensated second equivalent capacitance, the node voltage difference is utilized to drive the LSSA to generate a secret key; according to the chip solder mask solution method based on the SC PUF circuit provided by the invention, a larger excitation-response pair space can be realized, the information entropy is remarkably improved, the PUF key and the PCB hardware environment are tightly bound through the Chip-PCB hybrid design, disassembly, counterfeit and hardware replacement attacks are effectively prevented, the safety is improved, and the relatively high cost controllability is also ensured.

The invention discloses an air knife detinning device for a circuit integrated mainboard, which is characterized in that a bearing seat rotatably provided with a rolling shaft is arranged on one side, far away from mainboard adding equipment, of a feeding groove, a plurality of first connecting frames are mounted on the circumferential outer wall of the rolling shaft at intervals, and a supporting seat matched with the feeding groove is rotatably mounted in each first connecting frame; a torsion elastic piece is arranged between the supporting seat and the first connecting frame; a third connecting frame is arranged on the inner wall of the supporting shell and is parallel to the first air knife ejector, the third connecting frame is fixedly connected with a contact plate matched with the supporting seat, a clamping plate is symmetrically arranged in the supporting seat, a bottom plate is arranged below the supporting seat, and the clamping plate and the bottom plate are fixedly connected through a limiting insertion rod; and a driving mechanism is arranged between the bottom plate and the supporting seat. On the basis of realizing rotary feeding of the main board, an air knife is parallel to the main board for tin removal, clamping and fixing of the main board are also realized, and the tin removal effect of the air knife is improved.

The utility model relates to the field of electronics, and discloses an electric solder sucker which comprises a solder sucking table, a solder sucking handle and a switch, the solder sucking handle is provided with an upper cover and a base, one side of the upper cover is provided with a first upper cover, the other side of the upper cover is provided with a second upper cover, the other side of the upper cover is provided with a second upper cover, and the center of the top of the first upper cover is provided with a rear clamping groove. A front clamping groove is formed in the upper portion of the top face of the second upper cover. A first base is arranged on one side of the base, a fixing piece is arranged on one side of the first mounting piece, a rear clamping hook is arranged on one side of the fixing piece, a second base is arranged on the other side of the base, and a front clamping hook is arranged on the upper portion of the inner surface of the second base. The problems that in the prior art, a solder wick handle is complex in structure and inconvenient to disassemble and maintain are effectively solved, then portable disassembly of the upper cover of the solder wick handle is achieved, the efficiency of disassembling and maintaining the solder wick handle by a user is improved, and regular maintenance of the solder wick handle by the user is facilitated.

The utility model belongs to the related technical field of circuit board detinning, and particularly relates to a drum-type circuit board detinning device. The drum-type circuit board detinning device comprises a rotary drum body, a feeding part and a heating part, the rotary drum body sequentially comprises a temperature rise section used for heating a circuit board to raise the temperature of the circuit board, a separation section used for tin soldering and element discharging and a tailing section used for substrate discharging, and shoveling plates are arranged on the inner walls of the temperature rise section and the separation section; the wall face of the separation section is provided with a hole channel for soldering tin and elements to pass through, and a first discharging opening is formed in the lower portion of the separation section. And the tailing section is communicated with a second discharge port. According to the utility model, the circuit board is temporarily clamped by the shoveling plate of the temperature rise section, so that the distribution uniformity of the circuit board in the rotary drum body is improved, the circuit board is stirred by the shoveling plate of the separation section, and the heating uniformity of the circuit board in the rotary drum can be improved and the separation efficiency between soldering tin and a substrate is also improved in cooperation with a mode of simultaneously heating inside and outside.

1. The name of the product of this design: Hot air gun host (HG‑01). 2. Purpose of the product of this design: a tool for removing and soldering components on circuit boards. 3. The design key point of this appearance design product lies in the combination of shape and pattern. 4. The picture or photo that best illustrates the design points: three-dimensional picture.

The invention discloses an integrating sphere-based chip test method and an optical test system, and the method comprises the steps: providing an integrating sphere, a first probe and a second probe, the integrating sphere comprises an upper housing and a lower housing which are detachably connected, the upper housing is provided with a first through hole, and the lower housing is provided with a second through hole and a third through hole; the first probe and the second probe respectively extend into the lower shell through the second through hole and the third through hole; placing a to-be-tested unpackaged chip on a bearing table in the lower shell, and enabling a light-emitting surface of the chip to deviate from the bearing table; coupling a first probe to a first bonding pad of the unpackaged chip to be tested and applying a first electric signal, coupling a second probe to a second bonding pad of the unpackaged chip to be tested and applying a second electric signal, and lightening the unpackaged chip to be tested; covering the upper shell on the lower shell; and installing an optical detector in the first through hole, and testing light emitted by the to-be-tested unpackaged chip by using the optical detector. According to the method, the steps of wire bonding, desoldering and the like on the unpackaged chip are not needed, and the chip test loss rate is reduced.

The application discloses a kind of movable heating circuit board repair methods, the repair method includes S1: data acquisition, S2: inductive heating desoldering, and S3: new component re-soldering etc.Step, compared with prior art, movable heating circuit board repair method provided by the application has processing flexible, repair efficiency is high, repair success rate is high, processing coverage is wide, adaptability is strong, heat is sufficient, heat source controllability is strong, can adapt to the desoldering or welding requirement of element of wide size range, can reach the expected heating effect well, positioning is accurate, work stable and other beneficial effects.

The present invention discloses a BMS testing device, which relates to the field of BMS testing. The test platform comprises a test platform, a carrier and a plug-in connection device are installed on the test platform, the plug-in connection device comprises a contour plug, a plug-in mechanism and a driving mechanism, the driving mechanism is used to drive the plug-in mechanism to move along the plug-in direction, the plug-in mechanism comprises a fixed end and a free end, the fixed end is connected to the driving mechanism, the fixed end and the free end are connected by an elastic member, the free end is connected to the contour plug, and the elastic member connects the fixed end and the free end through the provided plug-in connection device, so that the contour plug has axial movement, radial translation and multi-directional torsion capabilities, during the insertion process, the elastic member can dynamically absorb the position deviation of the BMS socket, avoid hard squeezing of the contour plug and the socket, significantly reduce the risks of deformation of the metal contact of the socket, scratching of the coating and desoldering of the PCB solder joints, improve the yield of the BMS product after the test, and extend the service life of the contour plug.

The invention relates to the technical field of LED packaging, and discloses an LED device and an LED lamp panel. The LED device comprises a substrate, an LED chip, a light-transmitting separator and packaging glue, the LED chip is inversely arranged on the substrate, the light-transmitting separator is arranged on the outer side of the LED chip, and the packaging glue covers the outer side of the light-transmitting separator, so that the LED chip is isolated from the packaging glue. According to the LED device provided by the invention, the inverted LED chip and the packaging adhesive are completely isolated by arranging the light-transmitting isolation piece, so that the solder paste at the welding part of the inverted LED chip is prevented from being pulled by the thermal expansion force generated by the packaging adhesive during secondary melting at a high temperature; solder paste at the welding position of an inverted LED chip under high-temperature backflow can be smoothly melted back to be connected with a bonding pad, the phenomenon that a lamp is dead due to insufficient soldering or unsoldering of the chip is avoided, and finally the high reliability of the LED device and lamp drive integrated display module is achieved.

This utility model relates to the field of separation and recycling devices, and in particular to a low-temperature desoldering device for waste circuit boards, comprising: a support frame, a furnace body, a centrifugal desoldering component, a drive component, and a heating component; the furnace body is rotatably mounted on the support frame; a feed inlet is provided on one side of the furnace body, and a furnace door is provided on one side of the feed inlet; the centrifugal desoldering component is rotatably mounted in the furnace body for centrifugally ejecting molten tin; the drive component drives the centrifugal desoldering component to rotate; the heating component is used to change the temperature inside the furnace body. This utility model achieves rapid loading and unloading through the structure of the furnace body being horizontally mounted on the support frame, and the support frame allows the furnace body to tilt, allowing the processed tin inside the furnace body to be discharged through the tin discharge port. Furthermore, the entire working process is at a low temperature and includes a tail gas treatment device, making the desoldering process more convenient and faster, greatly improving work efficiency and reducing environmental pollution, which is in line with the concept of sustainable development.

The embodiment of the utility model provides a chip packaging structure, and relates to the technical field of chip packaging, the chip packaging structure comprises a substrate, a chip, a heat radiation cover and a plastic packaging body, the substrate is provided with a first grounding pad and a second grounding pad; the chip is mounted on the substrate; the heat dissipation cover is arranged on the substrate and attached to the back face of the chip. The plastic package body is arranged on the substrate and wraps the heat dissipation cover. Wherein the edge of the heat dissipation cover is provided with a pin bending part, the pin bending part is bent towards the direction far away from the substrate from the edge of the heat dissipation cover, the space between the pin bending part and the substrate is filled with the plastic package body, the edge of the heat dissipation cover is connected to the first grounding bonding pad, and the pin bending part is electrically connected to the second grounding bonding pad. Compared with the prior art, the electric connection performance between the heat dissipation cover and the substrate can be improved, the electrostatic discharge performance and the electrostatic shielding effect of the packaging structure are ensured, meanwhile, the welding combination stability is improved, the structure is stable, and desoldering is not prone to occurring.

The present invention provides a method and device for controlling a converter with variable carrier, which determine the maximum temperature rise of a device module that can be turned off under multiple carrier frequencies and different output currents; determine the design temperature rise of the device module that can be turned off under different output currents; determine the converter carrier frequency under the current heat sink temperature and the current output current based on the maximum temperature rise and the design temperature rise, and control the converter by variable carrier, taking into account the influence of the heat sink temperature of the device that can be turned off, and can avoid the phenomena of bonding wire desoldering and solder layer fatigue cracking in the device module that can be turned off as much as possible, reduce harmonic pollution when the converter is lightly loaded, and reduce the loss when the converter is heavily loaded; achieve approximately constant junction temperature of the device module that can be turned off under different output capacities, greatly reduce the number of power cycles and temperature cycles of the device module that can be turned off, and significantly extend the service life of the device module that can be turned off.

1. Name of the Design Product: Soldering Iron Main Unit. 2. Use of the Design Product: For the desoldering and soldering work of electronic components. 3. Design Key Points of the Design Product: Lies in the shape. 4. Picture or Photograph that Best Illustrates the Design Key Points: Perspective View.

The utility model provides a semiconductor device detinning device which comprises a heating unit, a detinning unit, a cooling unit and a filter screen, when the semiconductor device detinning device works, the heating unit heats the detinning unit to enable the temperature of the detinning unit to enable soldering tin to be melted, and a semiconductor device to be detinned is placed on the detinning unit. And the tin removing unit falls into the first hole body of the heating unit through the drainage hole after being heated and melted, and then falls into the second hole body below through the first hole body. And after entering the second hole body, the soldering tin is cooled and solidified into a solid which is blocked by the filter screen. The heating unit, the detinning unit, the cooling unit and the filter screen act together, soldering tin on the pins of the semiconductor device can be effectively removed, the soldering tin is removed in a high-temperature melting mode, the detinning effect is good, and the detinning efficiency is high. And the cooling unit and the filter screen are arranged below the heating unit, so that the removed soldering tin can be collected, and double benefits are achieved.

1. Name of the product in this design: Single-station intelligent welding station. 2. Purpose of this design: An electronic welding equipment, mainly used for welding, desoldering and rework of electronic components and printed circuit boards. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The utility model discloses a PCBA board bearing and desoldering device which comprises a soldering station body, a desoldering groove is formed in the right side of the upper end of the soldering station body, an overturning table is installed at the upper end of the desoldering groove, a vibration table is fixed to the upper end of the overturning table, a desoldering bearing table is arranged at the upper end of the vibration table, and a storage net is arranged in the desoldering groove. The storage net is located under the vibration table, an image collector is arranged on the inner wall of the desoldering groove, and a movable hot air gun is installed at the bottom of the desoldering groove. By means of the overturning table, the vibrating table and the movable hot air gun, electronic elements needing to be disassembled can be automatically heated and then separated through high-frequency vibration, other surrounding elements cannot be damaged, and disassembling efficiency is high.

The invention relates to the technical field of inductors, in particular to an inductor with a replaceable electrode slice, which solves the problem existing in the prior art that an electrode slice on the inductor is connected with a free terminal in a welding mode, and comprises a packaging block, a coil is arranged in the packaging block, and the two ends of the coil are connected with connecting columns. The packaging structure is characterized in that two threaded grooves are formed in the top of the packaging block, and the two connecting columns are arranged in the two threaded grooves respectively; a communicating groove is formed between the threaded groove and the outer wall of the packaging block, electrode plates are arranged on the two sides of the packaging block, and contact claws which are inserted along the communicating groove and attached to the connecting columns are fixedly connected to the electrode plates. When the electrode plate is damaged and aged or needs to be replaced with different specifications to adapt to different circuit requirements, the old electrode plate can be easily taken down and replaced with a new electrode plate only by operating according to corresponding disassembly steps, complicated desoldering and re-welding processes are not needed, and the maintenance difficulty and cost are greatly reduced.

The invention discloses a chip problem positioning method and device, equipment, a storage medium and a product. The method comprises the steps that a JTAG debugger is controlled to send a first preset instruction to a JTAG interface of a PCB where a to-be-tested chip is located so as to conduct a target test scan chain related to a suspected fault module in the to-be-tested chip; under the condition that the target test scan chain is conducted, the JTAG debugger is controlled to send a second preset instruction to a JTAG interface of a PCB where the to-be-tested chip is located, so that a preset controller in the to-be-tested chip is triggered to conduct self-testing on the suspected fault module, and a self-testing result is fed back to the JTAG debugger through the JTAG interface; and receiving a self-test result forwarded by the JTAG debugger, and carrying out fault positioning on the suspected fault module according to the self-test result. According to the invention, the fault module in the chip can be directly positioned on the printed circuit board, the chip does not need to be desoldered, and the positioning efficiency of the chip fault in the application field is greatly improved.

The invention discloses a lossless desoldering method for an LCC packaging optical module, and solves the problems of high desoldering difficulty and excessive dependence on the skill level of an operator caused by the problems of high dimensional precision requirement, more desoldering time limitation, large influence of inconsistency of welding spots and the like of a desoldering device in the prior art. The basic implementation principle of the invention is as follows: 1, pre-cleaning an LCC packaging optical module to be desoldered; 2, the cleaned exposed welding spots are coated with heat conduction cement gum, so that the heat conduction cement gum is tightly attached to the exposed welding spots; 3, an unwelding tool is obtained, the unwelding tool comprises a heating frame, heating holes located in the peripheral side of the heating frame and temperature control soldering iron matched with the heating holes in size, the shape of the heating frame is matched with the shape of the LCC packaging optical module, the heating frame is arranged on the periphery of the heat conduction cement, and the heating frame is tightly attached to the heat conduction cement; 4, a temperature control soldering iron is placed in the heating hole, and soldering tin is heated; 5, heating until the solder is molten, and clamping the LCC packaging optical module; and 6, the heat-conducting cement gum is cleaned, and lossless desoldering is completed.

The present invention discloses a semiconductor package and a manufacturing method thereof, including an EMI shielding layer. The beneficial effects of the present invention are as follows: By providing connecting bumps and conductive copper bars between the EMI shielding layer and the support mold, a stable support structure is provided for the welding wires. This design effectively prevents the offset or desoldering of the welding wires during the packaging process, significantly improving the yield and reliability of the package. The use of conductive copper bars and conductive bumps not only enhances the mechanical connection but also ensures good electrical connection, thereby improving the stability and performance of the overall circuit. By introducing the design of a sealing filling groove and a closed groove in the packaging structure, the sealing space formed by injection molding effectively prevents the intrusion of harmful substances such as external moisture and dust. The tight fit of the support bottom frame with the outer closed frame and the closed bottom frame, as well as the filling of the sealing material, together constitute an efficient sealing system, providing comprehensive protection for the circuits and components inside the package.

This invention relates to an electronic device with a detachable female electrical connector. A maintenance window and a maintenance cover plate covering the maintenance window are formed on the cover of the device's housing. The maintenance window corresponds to a female electrical connector soldered on the circuit board. The female electrical connector is a modular connector, meaning its electrical connector socket can be directly inserted and removed from its solder pad. Therefore, as long as the solder pad is soldered onto the circuit board, if repair or replacement is needed, simply open the maintenance cover plate and directly unplug the electrical connector socket through the maintenance window. This eliminates the cumbersome procedures of disassembling the housing and desoldering, significantly improving the efficiency of repairing the female electrical connector.

The invention relates to the technical field of electronic production, and particularly discloses soldering iron with welding and tin sucking functions, which comprises a soldering iron head, a handle, a tin sucking belt, a tin sucking rod and a tin sucking rod telescopic switch, the soldering bit is connected with the handle, the tin sucking rod telescopic switch is connected with the tin sucking belt through the tin sucking rod, the tin sucking rod telescopic switch is connected with the handle in a sliding mode, and the tin sucking rod telescopic switch drives the tin sucking belt to be close to or away from the soldering bit in the sliding process. According to the soldering iron, the modes can be rapidly switched in the welding process for tin sucking operation, a user can operate the soldering iron with one hand, the time for switching tools is shortened, and the production efficiency is greatly improved.

The invention relates to the technical field of waste electronic equipment recovery, and discloses an electric energy meter scrap treatment device and system.The electric energy meter scrap treatment device comprises a supporting platform, the top of the supporting platform is provided with a conveying platform, a desoldering box and a disassembling box, and camera modules are installed on the front side and the rear side of the desoldering box and the front side and the rear side of the disassembling box correspondingly; the conveying platform is arranged in the welding removing box and the disassembling box, a hot air box is installed at the top of the welding removing box, a suction cup is installed on the middle side in the disassembling box, a hot air mechanism is arranged in the welding removing box, and fixing mechanisms are arranged on the front side and the rear side in the disassembling box correspondingly. And control systems are arranged in the welding removing box and the disassembling box. Through the combination of the hot air box and the hot air plate, high-temperature hot air can be rapidly generated and accurately conveyed to a welding point of the electric energy meter, the welding point is rapidly removed, and the accurate adjustment of the air outlet plate and the spray head can be adjusted through the mutual cooperation of the toothed plate and the gear.

The utility model discloses a circuit board capable of preventing vibration desoldering, which belongs to the technical field of circuit boards and comprises a circuit board main body and an anti-vibration board fixed at the bottom end of the circuit board main body, and a plurality of metal connecting parts are fixed on the circuit board main body. A positioning rod clamped with the metal connecting part is fixed to the top end of the anti-vibration plate, a bearing rod tightly connected with the bottom end of the circuit board body is detachably fixed to the anti-vibration plate, and elastic plates abutting against the top end of the circuit board body are fixed to the two sides of the top end face of the positioning rod; the circuit board comprises a circuit board main body, large part welding parts are arranged on the two sides of the top end face of the circuit board main body, a small part welding part is arranged in the center of the circuit board main body, and conductive parts are arranged at the two ends of the circuit board main body at equal intervals. And the stability and the anti-vibration sealing-off effect of the circuit board are improved.

The invention belongs to the field of embedded computer data processing, discloses a health management system and method for detecting FPGA desoldering, and achieves real-time monitoring of the desoldering state of a welding spot. Due to the fact that the detection pin has clear level difference between strong pull-up and weak pull-down, when a welding spot is in poor contact or is completely disconnected, the level can change immediately. The system can discover the desoldering trend at the first time by continuously collecting the level information, so that functional abnormality and potential system risks caused by delayed detection are avoided. According to the method, the desoldering degree can be quantitatively analyzed. According to the traditional method, the welding spot problem can be found only when the function is completely invalid, but the system can reflect the contact quality of the welding spot through the fine change of the level state, so that a continuous quantification result of normal, slightly bad and serious sealing-off is provided, and operation and maintenance personnel can carry out graded early warning and fault management conveniently.

The utility model discloses a surface-mounted capacitor resistant to vibration. Comprising a capacitor body and a base arranged at the bottom of the capacitor body. The capacitor body comprises a bottom-sealed cylindrical shell and a capacitor core; a rubber plug with a boss seal is arranged between the capacitor body and the base; a plurality of tapered recesses are formed on the outer peripheral surface of the housing, the radial depth of each tapered recess being reduced from the bottom surface of the bottom-sealed cylindrical shape toward the opening side, and a tapered protrusion protruding toward the radial center side is formed on the inner peripheral surface of the back surface of each recess. According to the utility model, the capacitor body and the capacitor base are relatively fixed and synchronously vibrated, so that the surface-mounted capacitor is more stable and reliable in structure, and electrode leads are prevented from being broken and unsoldered. And the working condition of the surface-mounted capacitor is improved.

The invention relates to the technical field of surface-mounted component repairing and refitting, in particular to a desoldering method for reducing the temperature of a surface-mounted component body, which comprises the following steps: S1, cleaning a to-be-desoldered surface-mounted component; carrying out moisture removal and drying treatment on the to-be-desoldered printed part; s2, arranging thermocouples on the top surface and the side surface of the to-be-desoldered surface-mounted component; s3, a heat insulation part is arranged on the body of the to-be-desoldered surface-mounted component, and a to-be-desoldered assembly is formed; s4, the assembly to be desoldered is heated and desoldered until the solder is molten; a temperature curve during desoldering is set according to a method of reducing the temperature of the upper heating area and increasing the temperature of the lower heating area; and S5, after the desoldering is completed and the component is naturally cooled, cleaning the bonding pads at the component end and the printed part end. Heat insulation measures are preset for the surface-mounted component body before desoldering, so that the heat absorption capacity of the surface-mounted component body in the desoldering process is weakened, and the component is prevented from being damaged due to high temperature. And through real-time monitoring and adjustment of heating parameters, rapid melting of welding flux at the welding spot is ensured, heat diffusion to the component body is reduced to the greatest extent, and the risk of temperature rise of the component body is further reduced.

The utility model discloses an electronic component desoldering workbench which comprises a workbench body and an air gun connected to the workbench body through a pipeline, a heating wire is arranged in the workbench body, and a fan is arranged in the air gun and communicated with the workbench body. The outer side of the workbench body is further provided with a containing base for containing a blower gun in a clamped mode and a pedal controller electrically connected with a heating wire in the workbench body, the back face of the workbench body is provided with a rear cover plate, the outer side of the rear cover plate is integrally provided with a power interface and a power switch, and the front face of the workbench body is provided with a control panel; a placing frame and a heating table are fixedly arranged on the outer side and the upper end of the workbench body correspondingly. According to the electronic component desoldering workbench, the problem of adjusting the temperature of the air gun in the desoldering process can be solved through the pedal controller, and more functional structures are added, so that the overall practical effect is improved.