16 results about "Desoldering" patented technology

The invention discloses an air knife detinning device for a circuit integrated mainboard, which is characterized in that a bearing seat rotatably provided with a rolling shaft is arranged on one side, far away from mainboard adding equipment, of a feeding groove, a plurality of first connecting frames are mounted on the circumferential outer wall of the rolling shaft at intervals, and a supporting seat matched with the feeding groove is rotatably mounted in each first connecting frame; a torsion elastic piece is arranged between the supporting seat and the first connecting frame; a third connecting frame is arranged on the inner wall of the supporting shell and is parallel to the first air knife ejector, the third connecting frame is fixedly connected with a contact plate matched with the supporting seat, a clamping plate is symmetrically arranged in the supporting seat, a bottom plate is arranged below the supporting seat, and the clamping plate and the bottom plate are fixedly connected through a limiting insertion rod; and a driving mechanism is arranged between the bottom plate and the supporting seat. On the basis of realizing rotary feeding of the main board, an air knife is parallel to the main board for tin removal, clamping and fixing of the main board are also realized, and the tin removal effect of the air knife is improved.

The utility model belongs to the related technical field of circuit board detinning, and particularly relates to a drum-type circuit board detinning device. The drum-type circuit board detinning device comprises a rotary drum body, a feeding part and a heating part, the rotary drum body sequentially comprises a temperature rise section used for heating a circuit board to raise the temperature of the circuit board, a separation section used for tin soldering and element discharging and a tailing section used for substrate discharging, and shoveling plates are arranged on the inner walls of the temperature rise section and the separation section; the wall face of the separation section is provided with a hole channel for soldering tin and elements to pass through, and a first discharging opening is formed in the lower portion of the separation section. And the tailing section is communicated with a second discharge port. According to the utility model, the circuit board is temporarily clamped by the shoveling plate of the temperature rise section, so that the distribution uniformity of the circuit board in the rotary drum body is improved, the circuit board is stirred by the shoveling plate of the separation section, and the heating uniformity of the circuit board in the rotary drum can be improved and the separation efficiency between soldering tin and a substrate is also improved in cooperation with a mode of simultaneously heating inside and outside.

The invention discloses an integrating sphere-based chip test method and an optical test system, and the method comprises the steps: providing an integrating sphere, a first probe and a second probe, the integrating sphere comprises an upper housing and a lower housing which are detachably connected, the upper housing is provided with a first through hole, and the lower housing is provided with a second through hole and a third through hole; the first probe and the second probe respectively extend into the lower shell through the second through hole and the third through hole; placing a to-be-tested unpackaged chip on a bearing table in the lower shell, and enabling a light-emitting surface of the chip to deviate from the bearing table; coupling a first probe to a first bonding pad of the unpackaged chip to be tested and applying a first electric signal, coupling a second probe to a second bonding pad of the unpackaged chip to be tested and applying a second electric signal, and lightening the unpackaged chip to be tested; covering the upper shell on the lower shell; and installing an optical detector in the first through hole, and testing light emitted by the to-be-tested unpackaged chip by using the optical detector. According to the method, the steps of wire bonding, desoldering and the like on the unpackaged chip are not needed, and the chip test loss rate is reduced.

The application discloses a kind of movable heating circuit board repair methods, the repair method includes S1: data acquisition, S2: inductive heating desoldering, and S3: new component re-soldering etc.Step, compared with prior art, movable heating circuit board repair method provided by the application has processing flexible, repair efficiency is high, repair success rate is high, processing coverage is wide, adaptability is strong, heat is sufficient, heat source controllability is strong, can adapt to the desoldering or welding requirement of element of wide size range, can reach the expected heating effect well, positioning is accurate, work stable and other beneficial effects.

This utility model relates to the field of separation and recycling devices, and in particular to a low-temperature desoldering device for waste circuit boards, comprising: a support frame, a furnace body, a centrifugal desoldering component, a drive component, and a heating component; the furnace body is rotatably mounted on the support frame; a feed inlet is provided on one side of the furnace body, and a furnace door is provided on one side of the feed inlet; the centrifugal desoldering component is rotatably mounted in the furnace body for centrifugally ejecting molten tin; the drive component drives the centrifugal desoldering component to rotate; the heating component is used to change the temperature inside the furnace body. This utility model achieves rapid loading and unloading through the structure of the furnace body being horizontally mounted on the support frame, and the support frame allows the furnace body to tilt, allowing the processed tin inside the furnace body to be discharged through the tin discharge port. Furthermore, the entire working process is at a low temperature and includes a tail gas treatment device, making the desoldering process more convenient and faster, greatly improving work efficiency and reducing environmental pollution, which is in line with the concept of sustainable development.

The embodiment of the utility model provides a chip packaging structure, and relates to the technical field of chip packaging, the chip packaging structure comprises a substrate, a chip, a heat radiation cover and a plastic packaging body, the substrate is provided with a first grounding pad and a second grounding pad; the chip is mounted on the substrate; the heat dissipation cover is arranged on the substrate and attached to the back face of the chip. The plastic package body is arranged on the substrate and wraps the heat dissipation cover. Wherein the edge of the heat dissipation cover is provided with a pin bending part, the pin bending part is bent towards the direction far away from the substrate from the edge of the heat dissipation cover, the space between the pin bending part and the substrate is filled with the plastic package body, the edge of the heat dissipation cover is connected to the first grounding bonding pad, and the pin bending part is electrically connected to the second grounding bonding pad. Compared with the prior art, the electric connection performance between the heat dissipation cover and the substrate can be improved, the electrostatic discharge performance and the electrostatic shielding effect of the packaging structure are ensured, meanwhile, the welding combination stability is improved, the structure is stable, and desoldering is not prone to occurring.

1. Name of the product in this design: Single-station intelligent welding station. 2. Purpose of this design: An electronic welding equipment, mainly used for welding, desoldering and rework of electronic components and printed circuit boards. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The invention relates to the technical field of inductors, in particular to an inductor with a replaceable electrode slice, which solves the problem existing in the prior art that an electrode slice on the inductor is connected with a free terminal in a welding mode, and comprises a packaging block, a coil is arranged in the packaging block, and the two ends of the coil are connected with connecting columns. The packaging structure is characterized in that two threaded grooves are formed in the top of the packaging block, and the two connecting columns are arranged in the two threaded grooves respectively; a communicating groove is formed between the threaded groove and the outer wall of the packaging block, electrode plates are arranged on the two sides of the packaging block, and contact claws which are inserted along the communicating groove and attached to the connecting columns are fixedly connected to the electrode plates. When the electrode plate is damaged and aged or needs to be replaced with different specifications to adapt to different circuit requirements, the old electrode plate can be easily taken down and replaced with a new electrode plate only by operating according to corresponding disassembly steps, complicated desoldering and re-welding processes are not needed, and the maintenance difficulty and cost are greatly reduced.

The invention discloses a chip problem positioning method and device, equipment, a storage medium and a product. The method comprises the steps that a JTAG debugger is controlled to send a first preset instruction to a JTAG interface of a PCB where a to-be-tested chip is located so as to conduct a target test scan chain related to a suspected fault module in the to-be-tested chip; under the condition that the target test scan chain is conducted, the JTAG debugger is controlled to send a second preset instruction to a JTAG interface of a PCB where the to-be-tested chip is located, so that a preset controller in the to-be-tested chip is triggered to conduct self-testing on the suspected fault module, and a self-testing result is fed back to the JTAG debugger through the JTAG interface; and receiving a self-test result forwarded by the JTAG debugger, and carrying out fault positioning on the suspected fault module according to the self-test result. According to the invention, the fault module in the chip can be directly positioned on the printed circuit board, the chip does not need to be desoldered, and the positioning efficiency of the chip fault in the application field is greatly improved.

This invention relates to an electronic device with a detachable female electrical connector. A maintenance window and a maintenance cover plate covering the maintenance window are formed on the cover of the device's housing. The maintenance window corresponds to a female electrical connector soldered on the circuit board. The female electrical connector is a modular connector, meaning its electrical connector socket can be directly inserted and removed from its solder pad. Therefore, as long as the solder pad is soldered onto the circuit board, if repair or replacement is needed, simply open the maintenance cover plate and directly unplug the electrical connector socket through the maintenance window. This eliminates the cumbersome procedures of disassembling the housing and desoldering, significantly improving the efficiency of repairing the female electrical connector.

The invention belongs to the field of embedded computer data processing, discloses a health management system and method for detecting FPGA desoldering, and achieves real-time monitoring of the desoldering state of a welding spot. Due to the fact that the detection pin has clear level difference between strong pull-up and weak pull-down, when a welding spot is in poor contact or is completely disconnected, the level can change immediately. The system can discover the desoldering trend at the first time by continuously collecting the level information, so that functional abnormality and potential system risks caused by delayed detection are avoided. According to the method, the desoldering degree can be quantitatively analyzed. According to the traditional method, the welding spot problem can be found only when the function is completely invalid, but the system can reflect the contact quality of the welding spot through the fine change of the level state, so that a continuous quantification result of normal, slightly bad and serious sealing-off is provided, and operation and maintenance personnel can carry out graded early warning and fault management conveniently.

The invention relates to the technical field of surface-mounted component repairing and refitting, in particular to a desoldering method for reducing the temperature of a surface-mounted component body, which comprises the following steps: S1, cleaning a to-be-desoldered surface-mounted component; carrying out moisture removal and drying treatment on the to-be-desoldered printed part; s2, arranging thermocouples on the top surface and the side surface of the to-be-desoldered surface-mounted component; s3, a heat insulation part is arranged on the body of the to-be-desoldered surface-mounted component, and a to-be-desoldered assembly is formed; s4, the assembly to be desoldered is heated and desoldered until the solder is molten; a temperature curve during desoldering is set according to a method of reducing the temperature of the upper heating area and increasing the temperature of the lower heating area; and S5, after the desoldering is completed and the component is naturally cooled, cleaning the bonding pads at the component end and the printed part end. Heat insulation measures are preset for the surface-mounted component body before desoldering, so that the heat absorption capacity of the surface-mounted component body in the desoldering process is weakened, and the component is prevented from being damaged due to high temperature. And through real-time monitoring and adjustment of heating parameters, rapid melting of welding flux at the welding spot is ensured, heat diffusion to the component body is reduced to the greatest extent, and the risk of temperature rise of the component body is further reduced.

The utility model discloses a semi-automatic BGA chip non-contact detinning device based on visual positioning. The semi-automatic BGA chip non-contact detinning device comprises a workbench, a detinning device and a product bearing device, wherein the detinning device and the product bearing device are installed on the workbench. The product bearing device is arranged below the tin removing device; the product bearing device comprises a Y-axis translation mechanism, a Y-axis translation seat connected with the Y-axis translation mechanism, a preheating platform mounted on the Y-axis translation seat, and an adsorption platform mounted on the preheating platform; a heating assembly is installed in the preheating platform, and vacuum adsorption holes are formed in the adsorption platform. The non-contact tin removal device is suitable for non-contact tin removal work of various BGA chips, can realize whole-piece tin removal and single-point tin removal, and is high in automation degree, high in working effect and high in practicability.

1. Name of the product in this design: Dual-purpose desoldering station. 2. Purpose of this product design: Dual-purpose desoldering station. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.

The invention belongs to the technical field of MEMS cantilever probe cards, and particularly relates to a probe replacement method of a cantilever probe card. The method comprises the steps that a clamping jaw clamps a probe body from the back of a probe, heating laser irradiates the clamping position of the clamping jaw from the upper portion of the clamping jaw to the inclined lower portion, laser spots are located in the area where the two clamping jaws are located, and soldering tin is preset on the welding face of a normal probe body used for replacement. The technical scheme provided by the invention has the following technical advantages: 1) the split type clamping jaw is adopted, so that the processing difficulty and cost are reduced; (2) the heating position of a laser spot is changed, the problem of thermal deformation of a probe arm is avoided, the position of a clamping jaw is matched with the laser spot, and the influence of laser on an adjacent probe is shielded to the maximum extent; and (3) the tin-containing probes are used for welding, so that the problems that tin cannot be supplemented due to the small distance between the adjacent probes after the probes are desoldered, and the tin amount is insufficient when the probes are planted are solved, the welding spot strength is improved, and the welding strength and the electrical stability of the maintenance position are improved.

This invention provides a circuit board etching and desoldering equipment, including a roller conveyor, an etching machine, and a desoldering box. The etching machine and the desoldering box are respectively installed on both sides of the top of the roller conveyor. Several drip cylinders are installed inside the desoldering box. A rotatable plate is rotatably connected inside the drip cylinders. A soft brush is connected to the bottom end of the rotatable plate. The bottom end of the soft brush penetrates through the drip cylinder and extends to the outside. A storage box is connected to one side of the outer wall of the roller conveyor. A partition is installed inside the storage box. The two sides of the partition are respectively a desoldering liquid tank and a film-removing agent tank. A pair of fixed bends are connected between the storage box and the desoldering box. The fixed bends include a first tube body and a second tube body. One end of the first tube body penetrates through the desoldering box and is connected to several guide hoses. By efficiently removing the black film and the adhering water stains, the problems of poor contact and defective products on the circuit board are solved.