Ball grid array (BGA) packaging device laser tin soldering and desoldering method

Abstract

The invention discloses a ball grid array (BGA) packaging device laser tin soldering and desoldering method. The BGA packaging device laser tin soldering and desoldering method comprises the steps that a circuit board image collected by a camera is received; a BGA packaging device needing to be subjected to tin soldering or desoldering is marked on the circuit board image according to user operation instructions; laser beams of a laser device are shaped into a parallel uniform surface light beam with the same size as the marked BGA packaging device for heating; the power of the laser device issubjected to closed loop feedback control; whether the BGA packaging device is fully collapsed or not is judged by image processing; and the heating heat preservation of the laser device is maintained until the BGA packaging device is fully collapsed. According to the technical scheme, a laser beam shaping device is adopted to shape point light sources into a surface light source with the same size as the device for heating the device, it is ensured that the device is heated uniformly, solder balls are fully molten, while the tin soldering or desoldering of electronic parts and components adopting the BGA packaging mode is realized accurately and rapidly, peripheral adjacent devices and back part coincidence devices cannot be damaged.

Description

technical field [0001] The invention relates to the technical field of soldering and desoldering, in particular to a method for laser soldering and desoldering of BGA (Ball Grid Array, solder ball array packaging) packaged devices. Background technique [0002] Soldering and desoldering BGA packaged devices is the first step in industrial production and repair. The traditional method of soldering and desoldering BGA devices uses hot air gun heating. The directionality and controllability of the hot air gun heating method are relatively poor. Poor, easy to cause damage to adjacent devices around the processed device on the circuit board and overlapping devices on the back, easy to cause lead frames of tiny devices to fall apart, etc. Naturally, there have been many corresponding improvement methods, among which laser heating for the device is the most representative method. [0003] The purpose of soldering and desoldering of BGA packaged devices is to melt the solder ball b...

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