Tube target desoldering device and using method thereof

Abstract

The invention provides a tube target desoldering device and a using method thereof. The device comprises a desoldering table and a heating assembly, the desoldering comprises a desoldering bottom plate and a hollow tube vertically fixed on the desoldering bottom plate, the to-be-welded tube target is arranged on the outer side of the hollow tube in a sleeved mode; the heating assembly comprises a heating rod and at least one heating ring, the heating rod is arranged inside the hollow tube, and the heating ring is arranged on the outer side of the to-be-welded pipe target in sequence from bottom to top. According to the tube target desoldering device, the target material in the tube target and the back tube can be uniformly heated through the combination of a supporting structure and a heating assembly, when the welding flux is heated and molten, the separation of the target material and the back tube is realized, and the solder can be effectively recycled; the device is simple in structure and simple and convenient to use, the temperature is controllable in the desoldering process, the desoldering efficiency is high, and the device is especially suitable for off-welding separation of tubular target materials.

Description

technical field [0001] The invention belongs to the technical field of target recovery, and relates to a tube target de-soldering device and a use method thereof. Background technique [0002] Sputtering technology is one of the main processes for the preparation of film materials, and it is widely used in semiconductors, integrated circuits, flat-panel displays, and workpiece surface coatings. Among them, as an important component and material in the sputtering process, the sputtering target plays an increasingly important role, directly affecting the quality of the film material obtained after sputtering. [0003] The target assembly is usually composed of a target and a back plate. As a target with a tubular structure, the tube target is a commonly used target structure at present, and its outer surface is the ion bombardment surface. At this time Combined with it is the back tube, which is welded by putting the target material outside the back tube. The back tube materi...

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Problems solved by technology

[0003] The target assembly is usually composed of a target and a back plate. As a target with a tubular structure, the tube target is a commonly used target structure at present, and its outer surface is the ion bombardment surface. At this time Combined with it is the back tube, which is welded by putting the target material outside the back tube. The back tube material has high strength and can be reused. However, after the tube target is used for sputtering, the surface is usually called uneven, which is difficult to Secondary processing and utilization; therefore, the tube target after sputtering needs to be desoldered to separate it from the back tube, and the desoldered back tube is welded with a new tube target

[0004] In the prior art, the desoldering of the target is usually the separation of the plate-shaped target and the back plate. There is a method of turning, that is, the back plate of the target is turned off, but this method is easy to cause damage to the target blank, and the back plate material It cannot be reused, and the process is time-consuming and wastes a lot of materials; there is also a pressure method for separation. CN 105689832A discloses a method for desoldering the target. The target includes a target blank and a back plate, and the target blank is embedded Welding in the back plate, using a hydraulic press for desoldering, the hydraulic press includes a hydraulic press platform and a hydraulic press machine head, the target is suspended and fixed on the hydraulic press platform, so that the target blank faces the hydraulic press platform and there is a gap between the hydraulic press platform, Use the head of a hydraulic press to apply pressure to the back of the back plate until the target blank falls off from the back plate; however, this method only uses pressure to separate the target blank and the back plate, which requires high pressure and cannot achieve solder recovery, and is not suitable for tubes. Separation of target from dorsal canal

[0005] In addition, the separation of the plate-shaped target and the back plate can also be separated by heating. Its cylindrical structure makes it difficult for the tube target to be heated evenly, and the heating efficiency is low. During the heating process, the solder is easy to remain in the target after melting, and it is difficult to effectively recycle.

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