Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Desoldering method of semiconductor device

A technology of components and semiconductors, which is applied in the field of desoldering of semiconductor components, can solve the problems of easy damage to the device body and complicated operation, and achieve the effect of improving the yield rate and processing efficiency, high safety, and the safety of the desoldering and separation process

Inactive Publication Date: 2016-10-05
厦门睿析检测技术有限公司
View PDF9 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is complex to operate and easily damages the device body

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Desoldering method of semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Such as figure 1 As shown, a method for desoldering semiconductor components, the method for desoldering semiconductor components includes the following steps:

[0024] Step S1: fixing the semiconductor components to be processed in the area to be desoldered;

[0025] Fix the semiconductor components in the area to be desoldered by bolts.

[0026] Step S2: setting the heating source and heating at the same time;

[0027] The step S2: setting a heating source near the area to be desoldered and simultaneously heating includes: the heating time is between 50s and 60s, and the temperature is between 700°C and 800°C.

[0028] The heating source is mainly a heat gun, which uses the principle of hot air to directly blow and fill the solder joints of the part to be removed on the semiconductor component to melt the solder around it, and then use the heat of the heat gun to blow away the part to be removed. Moreover, the distance between the heat gun and the semiconductor com...

Embodiment 2

[0038] Such as figure 1 As shown, a method for desoldering semiconductor components, the method for desoldering semiconductor components includes the following steps:

[0039] Step S1: fixing the semiconductor components to be processed in the area to be desoldered;

[0040] Fix the semiconductor components in the area to be desoldered by bolts.

[0041] Step S2: setting the heating source and heating at the same time;

[0042] The step S2: setting the heating source and simultaneously heating includes: the heating time is between 50s and 60s, and the temperature is between 700°C and 800°C.

[0043] The heating source is mainly a heat gun, which uses the principle of hot air to directly blow and fill the solder joints of the part to be removed on the semiconductor component to melt the solder around it, and then use the heat of the heat gun to blow away the part to be removed. Moreover, the distance between the heat gun and the semiconductor components and the temperature o...

Embodiment 3

[0053] Such as figure 1 As shown, a method for desoldering semiconductor components, the method for desoldering semiconductor components includes the following steps:

[0054] Step S1: fixing the semiconductor components to be processed in the area to be desoldered;

[0055] Fix the semiconductor components in the area to be desoldered by bolts.

[0056] Step S2: setting the heating source and heating at the same time;

[0057] The step S2: setting the heating source and simultaneously heating includes: the heating time is between 50s and 60s, and the temperature is between 700°C and 800°C.

[0058] The heating source is mainly a heat gun, which uses the principle of hot air to directly blow and fill the solder joints of the part to be removed on the semiconductor component to melt the solder around it, and then use the heat of the heat gun to blow away the part to be removed. Moreover, the distance between the heat gun and the semiconductor components and the temperature o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a desoldering method of a semiconductor device. The method comprises following steps: fixing the semiconductor device to be machined in the region to be desoldered; arranging a heating source and heating simultaneously; enabling the heating source to keep the proper safety distance with the region to be desoldered; enabling the heating source to align at the welding spot of the semiconductor device in the region to be desoldered for desoldering with hot water, and utilizing self hot water of the heating source to blow away the part to be desoldered of a workpiece. The above steps can process samples at high efficiency for multiple times and improves yield rate and processing efficiency of a conventional distributive physical method. In addition, the above steps are high in safety. Due to the adjustable desoldering temperature and distance, the occasion of physical separation technology that samples are damaged due to mis-operation is avoided; and push force generated by expansion at high temperature such that a desoldering and separation process is safer.

Description

technical field [0001] The invention relates to a method for desoldering electronic devices, in particular to a method for desoldering semiconductor components. Background technique [0002] The structure of the existing ordinary semiconductor component products (IC) is mainly a single silicon chip structure or a stacked structure of multiple silicon chips, while MEMs (English: Micro Electro Mechanical Systems, abbreviated as MEMS, Chinese: Micro Electro Mechanical System) devices belong to In the field of semiconductor components, but the structure is different from ordinary semiconductor components. [0003] The function of the existing heat gun is mainly used for chip welding operation and chip desoldering operation, according to the melting characteristics of the solder under the temperature condition of 180° to 230°, to provide suitable temperature conditions for the chip to be operated. Generally, the temperature condition that the heat gun can provide is from 0 to 80...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/018
Inventor 龚慧兰
Owner 厦门睿析检测技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com