LED (Light Emitting Diode) lamp filament without bonding wire

Abstract

The invention relates to an LED (Light Emitting Diode) lamp filament without a bonding wire, and solves the problem of poor luminescence performance and heat dissipation of a traditional LED lamp filament. The lamp filament comprises a substrate, wherein a circuit is arranged on the surface of the substrate, LED chips are connected to the circuit, two ends of the substrate are connected with sheet metals, the circuit consists of a plurality of connecting circuits, each connecting circuit comprises two electric conduction silver layers which are connected through an electric conduction line, the LED chips are flip chips, and each LED chip is arranged between two adjacent connecting circuits for connecting the connecting circuits. The LED lamp filament has the advantages that a structure without the bonding wire is adopted, so that the cost is saved, the risks of the electric leakage and the dry joint of the LED since a porcelain nozzle has an impact on the LED chips in a welding process are greatly reduced, the packaging reliability and a production yield are greatly improved, and meanwhile the cost is lowered; and since the lamp filament and a lamp filament support are assembled in an embedding manner, the bad problems of the desoldering and the dry joint of the lamp filament of a light source in a traditional electric welding process can be avoided.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a wire-free LED filament. Background technique [0002] LED filament lamp, from the appearance point of view, is an incandescent lamp made of LED. It has: 1. Similar shape and light distribution curve to incandescent lamp; mature bulb technology, low price; 360-degree full-angle light, no aperture; high Fingerprint, high light efficiency; no need for independent heat dissipation and other characteristics. At the same time, there are many problems in the development of LED bulbs, the main restricting factor is the LED filament. The LED filament encapsulates multiple chips on a thin strip substrate, and the two sides are coated with fluorescent glue. At present, LED filaments are mainly fixed on the substrate by die-bonding glue, and then connected by soldering metal wires, but the metal wires will affect the light output, and the heat dissipation and reliability problems in this pa...

AI Technical Summary

Problems solved by technology

[0003] The present invention mainly solves the problem of insufficient light emission and heat dissipation of LED filaments in the prior art, and provides a wire-free LED filament that omits welding wires, saves costs, and has a good heat dissipation effect.

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