2results about How to "Avoid desoldering" patented technology

This invention provides a chip flip-chip packaging method. A first solder is applied to the solder windows of a chip formed on a wafer, fixing the first end of a solder post to the solder window. A curing agent is filled between the solder posts. The solder posts are then ground so that their second ends are on the same plane, and a solderable layer is formed on the end face of the solder posts before the curing agent is removed. The second end of the solder post is fixed to a frame or substrate coated with a second solder, forming a potting gap between the second end of the solder post and the chip. Epoxy resin is then filled into the potting gap and encapsulates the chip. The melting point of the first solder is higher than that of the second solder. This invention uses solder posts on the chip solder window to create a potting gap between the chip and the frame or substrate. During a single epoxy resin filling, the epoxy resin flows directly into the potting gap and encapsulates the chip. Compared to processes requiring bottom filling with adhesive, this reduces the number of filling operations, lowers internal stress caused by varying degrees of curing of the adhesive with different filling operations, thereby simplifying production steps and improving production efficiency.

The utility model relates to multilayer ceramic capacitor technical field, concretely to a new multilayer ceramic capacitor with protection structure, include: support, the both ends tin soldering of support have capacitor body, the downside of support is equipped with two groups of support structure, the support structure includes first connecting piece, two groups first connecting piece are connected in the both ends of support bottom surface through tin soldering, the surface of first connecting piece integrative buffering piece has, the bottom of buffering piece integrative second connecting piece forms. The buffering piece of utility model setting is inclined and presents the zigzag shape structure, can reduce buffering piece's rigidity in vertical and left and right direction, improve the deformation sensitivity of support structure, and the bottom of two groups buffering piece is located left and right sides of support respectively, can increase the floor area of device, and then guarantee that device can stably place on the substrate, be convenient for translation activity and will not tip over, improve the convenience of welding.