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Heat radiating process method for printed-circuit board

A technology of printed circuit boards and process methods, applied in the fields of avionics and electronics, which can solve the problems of warping and deformation of printed circuit boards, low strength of printed circuit boards, and resistance to bumps, etc., to prevent virtual soldering and excellent heat dissipation Strength, increase the effect of anti-corrosion performance

Active Publication Date: 2013-04-10
SHAANXI QIANSHAN AVIONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Purpose of the invention: The purpose of the present invention is to provide a process method for heat dissipation of printed circuit boards, which solves the problem that when the printed circuit board is powered on, the heat emitted by electronic components can be discharged in time without affecting the assembly of printed circuit board components , Solve the problem of virtual soldering and desoldering caused by high-temperature welding warping and deformation of printed circuit boards, and solve the problems of low strength and resistance to bumping of printed circuit boards

Method used

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specific Embodiment 1

[0014] A heat dissipation process method for printed circuit boards, the method takes the following steps:

[0015] 1) Design the avoidance structure diagram of the cold plate components, process the light drawing data of the printed circuit board through the CAM350 software, export the pin positions of the components in the file, and form the pcb file in the PROTEL format through the application software ger-pcb conversion processing, and use the PROTEL software Set the cold plate structure opening at the corresponding position on the avoidance structure diagram of the cold plate component, and the component pins can be welded with the printed circuit board through the cold plate structure opening. The size of the opening on the cold plate depends on the characteristics of the component. The pin opening of the straight plug-in should be increased by 1.8mm on the basis of the pad size of the corresponding position, and then a round hole should be opened. The opening of the surf...

specific Embodiment 2

[0021] A heat dissipation process method for printed circuit boards, the method takes the following steps:

[0022] 1) Design the avoidance structure diagram of the cold plate components, process the light drawing data of the printed circuit board through the CAM350 software, export the pin positions of the components in the file, and form the pcb file in the PROTEL format through the application software ger-pcb conversion processing, and use the PROTEL software Set the cold plate structure opening at the corresponding position on the avoidance structure diagram of the cold plate component, and the component pins can be welded with the printed circuit board through the cold plate structure opening. The size of the opening on the cold plate depends on the characteristics of the component. The pin hole of the straight plug-in is increased by 1.5mm on the basis of the pad size of the corresponding position, and then a round hole is opened. The hole of the surface mount device is ...

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Abstract

The invention discloses a heat radiating process method for a printed-circuit board, belongs to electron technology, and applies to the technical field of avionics. The a cold plate is bonded on a printed-circuit board through a dedicated bonding device, a component is enabled to grovel on the cold plate, and heat radiating is carried out through the bonding membrane material and the cold plate, wherein the membrane material is arranged among the printed-circuit board base materials, the metal conducting materials on the inner portion and the surface of the printed-circuit board, the printed-circuit board and the cold plate. The cold plate is formed by arranging holes in an aluminium alloy plate according to the welding locating of the components of the printed-circuit board through hard anodic oxidation surface treatment. The bonding material between the printed-circuit board and the cold plate is a polyimide double-faced adhesive membrane. The bonding device is a convex thick steel mold plate and a concave thick steel mold plate with a certain curvature, and enables the printed-circuit board and the cold plate can be completed a flattening function simultaneously with bonding. The heat radiating process method for the printed-circuit board achieves the processing of the bonding and the flattening of the cold plate and the printed-circuit board at one time, solves the problem of product performance deterioration due to the fact that heat emitted by component after being powered on can not be released in time, increases the mechanical strength, the antiseptic property and the insulating property of the printed-circuit board, and restrains the layer splitting and the deformation of the printed-circuit board generated by high-temperature wave soldering.

Description

technical field [0001] The invention belongs to the category of electronic technology and is applied in the technical field of avionics. Background technique [0002] With the rapid development of electronic technology and the wide application of large-scale and ultra-large-scale integrated circuit devices, electronic equipment is becoming thinner and smaller, and the density of components loaded on corresponding printed circuit boards is increasing. After the printed circuit board is energized, the electronic components on the printed circuit board become a heat source of heat, and the heat emitted will cause the temperature of the electronic product to rise. When the allowable operating temperature of the components is exceeded, the characteristics of the components will change. Lead to product performance deterioration, reduced reliability, shortened life. The problem of high temperature failure of components is becoming more and more prominent on printed circuit boards,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 徐燕林
Owner SHAANXI QIANSHAN AVIONICS
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